Cooling device and electronic equipment

Patent metadata

Field	Value
Publication number	US-9951999-B2
Application number	US-201414571951-A
Country	US
Kind code	B2
Filing date	Dec 16, 2014
Priority date	Dec 27, 2013
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A cooling device includes: a refrigerant circulation loop configured to depressurizing the inside thereof, the refrigerant circulation loop includes, an evaporator that vaporizes a part of refrigerant by heat generated by an electronic component, a condenser that cools the refrigerant, and a pump that circulates the refrigerant, wherein a filling ratio of liquid refrigerant to a volume of the refrigerant circulation loop is configured to maintain a refrigerant circulation capability of the pump.

First claim

What is claimed is:

1. A cooling device comprising:
a refrigerant circulation loop that a refrigerant flows in a circle through an inside thereof, the refrigerant circulation loop includes,
an evaporator that vaporizes a part of the refrigerant by heat generated by an electronic component,
a condenser that cools the refrigerant, and
a pump that circulates the refrigerant and has a moving fin,
wherein a filling ratio of the liquid refrigerant to a volume of the refrigerant circulation loop is from 75% to 95%, and a cooling capability ratio is 50% or more.

2. The cooling device according to claim 1 ,
wherein the inside of the refrigerant circulation loop is filled with the refrigerant and is sealed by metal.

3. The cooling device according to claim 1 , further comprising:
a first piping in which the refrigerant warmed by the evaporator flows; and
a second piping in which the refrigerant cooled by the condenser flows,
wherein the evaporator is coupled with the condenser by the first piping and the second piping.

4. The cooling device according to claim 3 , wherein
the first piping is coupled to an upper part of the condenser and the second piping is coupled to a lower part of the condenser.

5. The cooling device according to claim 1 , wherein
a liquid-contacting part, which the refrigerant flows and contact, of the refrigerant circulation loop is molded by a metallic material.

6. The cooling device according to claim 1 , wherein
the inside of the refrigerant circulation loop is depressurized to less than atmospheric pressure.

7. The cooling device according to claim 1 , further comprising;
a tank that extends the volume of the refrigerant circulation loop in the refrigerant circulation loop.

8. The cooling device according to claim 1 , wherein the moving fin is a rotary fin.

9. A cooling device comprising:
a refrigerant circulation loop that a refrigerant flows in a circle through an inside thereof, the refrigerant circulation loop includes,
an evaporator that vaporizes a part of the refrigerant by heat generated by an electronic component,
a condenser that cools the refrigerant,
a pump that circulates the refrigerant,
a first piping in which the refrigerant warmed by the evaporator flows, and
a second piping in which the refrigerant cooled by the condenser flows,
wherein a filling ratio of the liquid refrigerant to a volume of the refrigerant circulation loop is from 75% to 95%, and a cooling capability ratio is 50% or more,
wherein the evaporator is coupled with the condenser by the first piping, and
wherein the pump is directly coupled with the condenser and the evaporator via the second piping.

Assignees

• Fujitsu Ltd

Inventors

• So Tsuyoshi
• Kubo Hideo
• Aizawa Osamu
• Hayashi Nobuyuki
• Nakanishi Teru
• Uzuka Yoshinori
• Aoki Nobumitsu

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• F28D15/025 Primary

  having non-capillary condensate return means · CPC title

• H01L2924/0002

  Electricity · mapped topic