Solid state deposition methods, apparatuses, and products

Patent metadata

Field	Value
Publication number	US-9951425-B2
Application number	US-201414340473-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Jul 25, 2013
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

The described embodiments relate generally to methods for enhancing cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line with a cosmetic surface portion of the friction stir processed parts. In some embodiments cold spray can be used to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.

First claim

What is claimed is:

1. A substrate for enclosing an electronic device, comprising:
a first substrate in co-planar arrangement with a second substrate along a joint line;
a deposition layer including metallic particles that cover at least the joint line; and
a pre-formed mechanical structure that is joined to portions of the first and second substrates, wherein the first and second substrates are joined together by the deposition layer and the pre-formed mechanical structure.

2. The substrate as recited in claim 1 , wherein the first and second substrates are joined together at their respective mating surfaces that correspond to the joint line, and the pre-formed mechanical structure extends through the mating surfaces.

3. The substrate as recited in claim 1 , wherein the pre-formed mechanical structure includes a first fastener and a second fastener, and the first fastener is positioned over the second fastener.

4. The substrate as recited in claim 1 , wherein the first substrate includes a groove defining the pre-formed mechanical structure, and the second substrate includes a tapered end positioned within the groove and having a shape corresponding to the pre-formed mechanical structure.

5. The substrate as recited in claim 4 , wherein the deposition layer is positioned within a region between the tapered end and the groove.

6. The substrate as recited in claim 1 , wherein at least one of the first or second substrates includes a channel that is covered by the deposition layer.

7. The substrate as recited in claim 1 , wherein the deposition layer has an external surface having a texture that is generally similar to textures of external surfaces of the first and second substrates.

8. The substrate as recited in claim 1 , further comprising a second deposition layer that is disposed over the deposition layer, the second deposition layer having different metallic particles than the deposition layer.

9. The substrate as recited in claim 8 , wherein the second deposition layer is blended with the deposition layer, the first substrate, and the second substrate to provide an appearance of continuity among the first substrate, the second substrate, the deposition layer, and the second deposition layer.

10. A method for joining a first substrate with a second substrate, the method comprising:
aligning the first substrate to the second substrate along a joint line;
inserting a mechanical structure through portions of the first substrate and the second substrate; and
covering at least the joint line with a solid state deposition layer, wherein the first substrate and the second substrate are held together by the solid state deposition layer and the mechanical structure.

11. The method as recited in claim 10 , further comprising depositing a second solid state deposition layer proximate to the solid state deposition layer, wherein the second solid state deposition layer is formed from a material different than the solid state deposition layer.

12. The method as recited in claim 10 , wherein the solid state deposition layer covers portions of external surfaces of the first and second substrates.

13. The method as recited in claim 10 , wherein:
the mechanical structure includes a first fastener and a second fastener, and the first fastener is a pin or a screw, and the second fastener is a clamp mechanism.

14. The method as recited in claim 10 , wherein at least one of the first or second substrates includes an external channel, and the external channel is covered by the solid state deposition layer.

15. The method as recited in claim 10 , further comprising:
positioning a part on the first substrate,
depositing the solid state deposition layer over the part; and
subsequent to depositing the solid state deposition layer over the part, removing the part to define a space previously occupied by the part.

16. The method as recited in claim 10 , wherein the solid state deposition layer has an external surface having a texture that is generally similar to textures of external surfaces of the first and second substrates.

17. An enclosure for an electronic device, comprising:
a joined part, comprising:
a first part that is joined to a second part along an interface,
a solid state deposition layer that covers portions of the first part and the second part, and
a mechanical structure that is inserted through the portions of the first part and the second part, wherein the first part and the second part are joined together by the solid state deposition layer and the mechanical structure.

18. The enclosure of claim 17 , wherein the mechanical structure includes at least one of a weld, a pin, a clamp, or a screw.

19. The enclosure of claim 17 , wherein at least one of the first or the second part includes a channel, and the solid state deposition layer is disposed over the channel.

20. The enclosure of claim 19 , wherein the channel is defined by walls that extend away from an external portion of the first or the second part.

21. The enclosure of claim 17 , wherein the solid state deposition layer has an external surface with a texture that is generally similar to textures of external surfaces of the first and second substrates.

Assignees

• Apple Inc

Inventors

• Lancaster-Larocque Simon R
• Chan Collin D
• Ross Kenneth A
• Corbet Lindsay D
• Miller Ari P
• Budd Thomas G

Classifications

• Y10T29/4998

  Combined manufacture including applying or shaping of fluent material · CPC title

• Y10T403/472

  including mechanical interlock · CPC title

• C23C24/04 Primary

  Impact or kinetic deposition of particles · CPC title