Microfluidic assembly and methods of forming same

Patent metadata

Field	Value
Publication number	US-9950511-B2
Application number	US-201615277825-A
Country	US
Kind code	B2
Filing date	Sep 27, 2016
Priority date	Feb 12, 2016
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

First claim

The invention claimed is:

1. A printhead, comprising:
an outer surface; and
a microfluidic assembly coupled to the outer surface, the microfluidic assembly including:
a microfluidic die having a first surface and a plurality of nozzles on the first surface, the plurality of nozzles being configured to expel a fluid, the microfluidic die including a ledge having a second surface that is offset from the first surface, the second surface including a plurality of bond pads;
an interconnect substrate having a first end including a plurality of contacts, the first end located on the ledge of the microfluidic die, the plurality of contacts of the interconnect substrate being laterally arranged with the bond pads of the microfluidic die;
conductive elements having first ends coupled to the bond pads of the microfluidic die and second ends coupled to the contacts of the interconnect substrate; and
encapsulant material over the plurality of bond pads, the plurality of contacts, and the conductive elements.

2. The printhead of claim 1 wherein the first end of the interconnect substrate is coupled to the ledge of the microfluidic die.

3. The printhead of claim 1 wherein the encapsulant at least aids in coupling the microfluidic die to the interconnect substrate.

4. The printhead of claim 1 wherein the first surface of the microfluidic die and the second surface of the ledge are facing the same direction.

5. The printhead of claim 1 , comprising a plurality of microfluidic assemblies coupled to the outer surface.

6. The printhead of claim 1 , comprising a reservoir and a lid, the outer surface being an outer surface of one of the reservoir and the lid, wherein the fluid contained in the reservoir.

7. An electronic device, comprising:
an upper surface; and
one or more microfluidic assemblies mounted to the upper surface, each of the one or more microfluidic assemblies including:
a microfluidic die having a plurality of nozzles to expel a fluid and a plurality of bond pads on a ledge of the microfluidic die that is offset from the plurality of nozzles;
an interconnect substrate having a first end resting on the ledge of the microfluidic die proximate the plurality of bond pads, the interconnect substrate having a plurality of contacts substantially laterally aligned with the plurality of bond pads of the microfluidic die;
conductive elements having first ends coupled to the bond pads of the microfluidic die and second ends coupled to the contacts of the interconnect substrate; and
encapsulant over the plurality of bond pads, the plurality of contacts, and the conductive elements.

8. The electronic device of claim 7 wherein a first end of the interconnect substrate is coupled to the ledge of the microfluidic die.

9. The electronic device of claim 8 wherein the ledge has a surface that is recessed from a surface of the microfluidic die that includes the plurality of nozzles.

10. The electronic device of claim 9 wherein the plurality of contacts of the interconnect substrate are aligned with the plurality of bond pads on the ledge of the microfluidic die.

11. A microfluidic assembly, comprising:
a microfluidic die having a nozzle plate with a plurality of nozzles configured to expel a fluid, the microfluidic die including an ledge that extends from a side surface of the microfluidic die, the ledge having an exposed surface that is offset from an exposed surface of the nozzle plate, the ledge including a plurality of bond pads;
an interconnect substrate having an end that rests on the exposed surface of the ledge, the interconnect substrate having a plurality of contacts that are laterally aligned with the bond pads of the ledge;
conductive wires having first ends coupled to the bond pads of the microfluidic die, respectively; and second ends coupled to the contacts of the interconnect substrate, respectively; and
encapsulant over the plurality of bond pads, the plurality of contacts, and the conductive wires.

12. The microfluidic assembly of claim 11 wherein the exposed surface of the ledge and the exposed surface of the nozzle plate are parallel with each other.

13. The microfluidic assembly of claim 11 wherein a first end of the interconnect substrate is on the ledge of the microfluidic die, wherein the plurality of contacts of the interconnect substrate are substantially aligned with the plurality of bond pads of the microfluidic die.

14. The microfluidic assembly of claim 11 wherein the encapsulant at least aids in coupling the interconnect substrate to the microfluidic die.

Assignees

• St Microelectronics Inc
• Stmicroelectronics Malta Ltd

Inventors

• Dodd Simon
• Ellul Ivan
• Brincat Christopher

Classifications

• B41J2/04548

  Details of power line section of control circuit · CPC title

• B41J2/14201

  Structure of print heads with piezoelectric elements · CPC title

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2/1433

  Structure of nozzle plates · CPC title

• B41J2/01 Primary

  Ink jet · CPC title