Multilayer structure having at least one metal layer and at least one polyamide layer

Patent metadata

Field	Value
Publication number	US-9950499-B2
Application number	US-201514945684-A
Country	US
Kind code	B2
Filing date	Nov 19, 2015
Priority date	Dec 11, 2014
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

A layer structure having at least one metal element and at least one polyamide layer arranged at least regionally on the metal element, the structure preferably comprising an insulated electrical conductor wherein The polyamide layer consists of a polyamide molding composition consisting of the following components: (a) a polyamide based on cycloaliphatic diamines or cycloaliphatic dicarboxylic acids having a glass transition temperature (Tg) of at 130° C.; (b) a polyolefin based on C2-C12 alkenes, and additionally on at least one monomer selected from the following group: maleic anhydride, itaconic anhydride, glycidyl acrylate, butene, propylene, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl (meth)acrylates, substituted or unsubstituted styrene, or a mixture of such monomers; (c) optionally an aliphatic polyamide different from (a), or a mixture of such polyamides; (d) optionally additives.

First claim

The invention claimed is:

1. A layer structure—having at least one metal element—and at least one polyamide layer—arranged at least regionally on the metal element,
wherein
the polyamide layer consists of a polyamide moulding composition which is a mixture consisting of the following components:
(a) a polyamide based on cycloaliphatic diamines, cycloaliphatic dicarboxylic acids, or both cycloaliphatic diamines and cycloaliphatic dicarboxylic acids, or a mixture of such polyamides, having a glass transition temperature (T g ) of at least 130° C.;
(b) a polyolefine based on
C2-C12 alkenes, in branched or unbranched form, or a mixture thereof, and additionally
at least one monomer selected from the group consisting of: maleic anhydride, itaconic anhydride, glycidyl acrylate, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl acrylates, C1-C12 alkyl methacrylates, substituted or unsubstituted styrene and a mixture thereof;

(c) an aliphatic polyamide different from (a), or a mixture of such polyamides;
(d) additives;
with the proviso that the fraction of components (c) and (d) may be zero, and with the proviso that the sum of the components (a)-(d) makes 100 wt %.

2. The layer structure according to claim 1 , wherein the polyamide moulding composition is a mixture of the stated components (a)-(d) with the following fractions:
(a) 60-90 wt % of a polyamide based on cycloaliphatic diamines, cycloaliphatic dicarboxylic acids, or both cycloaliphatic diamines and cycloaliphatic dicarboxylic acids, or a mixture of such polyamides, having a glass transition temperature (T g ) of at least 130° C.;
(b) 10-40 wt % of a polyolefin based on
C2-C12 alkenes, in branched or unbranched form, or a mixture thereof and additionally
at least one monomer selected from the group consisting of: maleic anhydride, itaconic anhydride, glycidyl acrylate, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl acrylates, C1-C12 alkyl methacrylates, substituted or unsubstituted styrene and a mixture thereof;

(c) 0-20 wt % of an aliphatic polyamide different from (a), or a mixture of such polyamides;
(d) 0-25 wt % of additives;
with the proviso that the sum of the components (a)-(d) makes 100 wt %.

3. The layer structure according claim 1 , wherein the amorphous polyamide or polyamides of component (a) is or are composed of the following building blocks:
(a1) 50 to 100 mol % of a cycloaliphatic diamine or mixtures thereof and
(a2) 0 to 50 mol % of an aliphatic or aromatic diamine having 4 to 36 carbon atoms, or mixtures thereof,
based in each case on the molar entirety of diamines, and
(a3) one or more than one aliphatic or cycloaliphatic dicarboxylic acid having 4 to 36 carbon atoms,
(a4) one or more than one aliphatic or aromatic lactam or aminocarboxylic acid having 4-36 carbon atoms.

4. The layer structure according to claim 1 , wherein component (a) comprises a polyamide selected from the group consisting of: MACM9, MACM10, MACM11, MACM12, MACM13, MACM14, MACM16, MACM18, PACM9, PACM10, PACM11, PACM12, PACM13, PACM14, PACM16, PACM18, TMDC9, TMDC10, TMDC11, TMDC12, TMDC13, TMDC14, TMDC15, TMDC16, TMDC17, TMDC18, MACMI/12, MACMT/12, MACMI/MACMT/12, 6I/6T/MACMI/MACMT/12, 6I/MACMI/MACMT, 6I/PACMI/PACMT, 6I/6T/MACMI, MACMI/MACM36, 12/PACMI, 12/MACMT, 6/PACMT, 6/IPDT, 10I/10T/BACI/BACT, MACM9-18/PACM9-18, MACM9-18/TMDC9-18, TMDC9-18/PACM9-18, and mixtures thereof.

5. The layer structure according to claim 1 , wherein in component (b) the fraction of C2-C12 alkenes, in branched or unbranched form, or a mixture thereof, is in the range of 50-95 wt %,
or in that in component (b) the fraction of C2-C3 alkenes, or a mixture thereof, is in the range of 50-95 wt %.

6. The layer structure according to claim 1 , wherein component (b) as polyolefin is selected from the following group:
polyolefin of ethylene and glycidyl methacrylate;
polyolefin of ethylene, vinyl acetate and glycidyl methacrylate;
polyolefin of ethylene, methyl acrylate and glycidyl methacrylate;
polyolefin of ethylene, butyl acrylate and glycidyl methacrylate;
or a mixture of such polyolefins.

7. The layer structure according to claim 1 , wherein component (c) is selected from the group consisting of: polyamide 6, polyamide 10, polyamide 12, polyamide 1212, polyamide 1012, polyamide 1210, polyamide 46, polyamide 66, polyamide 612, polyamide 126, polyamide 106, polyamide 610, polyamide 1010, polyamide 614, polyamide 618, polyamide 1014, polyamide 1018, polyamide 1214, polyamide 1218 and copolyamides and mixtures thereof.

8. The layer structure according to claim 1 , wherein component (d) is selected from the group consisting of: UV stabilizers, heat stabilizers, radical scavengers, antioxidants, processing aids, inclusion inhibitors, lubricants, mould-release auxiliaries, plasticizers, antistats, fillers including particulate fillers, including nanoscale fillers and/or adjuvants, and also fibrous fillers, including glass fibres, flame retardants, including halogen-free flame retardants, dyes, pigments, residuals from polymerization processes including catalysts, salts and derivatives thereof and mixtures thereof.

9. The layer structure according to claim 1 , wherein the metal element consists of a metal selected from the following group: aluminium, copper, silver, zinc, iron, steel, or mixtures and/or alloys thereof, it being possible for the surface to be in oxidized and/or galvanized form.

10. The layer structure according to claim 1 , wherein the layer structure has one of the following constructions:
metal element/polyamide layer;
metal element/polyamide layer/further layer;
metal element/further layer/polyamide layer;
where the stated further layer is based to an extent of at least 50 wt % on a thermoplastic moulding composition which is different from the polyamide moulding composition, and where further layers may additionally be disposed on the layer remote from the metal element.

11. The layer structure according to claim 1 , wherein the metal element comprises a metal profile, which is covered by the polyamide layer.

12. The layer structure according to claim 11 , wherein the metal element is an electrical conductor, wherein the thickness of the polyamide layer, measured perpendicularly to the direction of principal extent of the conductor, is in the range of 0.1-2 mm.

13. The layer structure according to claim 1 , wherein component (b) is composed exclusively
of C2-C12alkenes, in branched or unbranched form, or a mixture thereof, and additionally of at least one monomer selected from the group consisting of: maleic anhydride, itaconic anhydride, glycidyl acrylate, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl acrylates, C1-C12 alkyl methacrylates, substituted or unsubstituted styrene, or a mixture of such monomers.

14. A method for producing a layer structure according to claim 1 , comprising:
coating the metal element with the polyamide.

15. A method for generating a polyamide layer on a metal element comprising:
preparing a mixture of a polyamide moulding composition consisting of the following components:
(a) a polyamide based on cycloaliphatic diamines, cycloaliphatic dicarboxylic acids, or both cycloaliphatic diamines and cycloaliphatic dicarboxylic acids, or a mixture of such polyamides, having a glass transition temperature (T g ) of at least 130° C.;
(b) a polyolefine based on
C2-C12 alkenes, in branched or unbranched form, or a mixture thereof, and additionally
at least one monomer selected from the group consisting of: maleic a

Assignees

• Ems Patent Ag

Inventors

• Stoppelmann Georg
• Garcia Gabriel

Classifications

• C08L77/06 Primary

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C09D151/06

  grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond · CPC title

• C09D177/06

  Polyamides derived from polyamines and polycarboxylic acids (C09D177/10 takes precedence) · CPC title

• C08K3/01

  characterized by their specific function · CPC title

• C08K5/0008

  Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59 · CPC title