Production of thin silicone films

Patent metadata

Field	Value
Publication number	US-9950453-B2
Application number	US-201715440485-A
Country	US
Kind code	B2
Filing date	Feb 23, 2017
Priority date	Dec 12, 2012
Publication date	Apr 24, 2018
Grant date	Apr 24, 2018

Abstract

Thin silicon films of high thickness uniformity and thicknesses of from 0.1 μm to 200 μm are prepared by applying a crosslinkable silicone composition to a moving carrier by means of a slot die, removing solvent, if present, and subsequently crosslinking the silicone layer formed on the carrier.

First claim

What is claimed is:

1. A method for the continuous production of a thin silicone film having a film thickness of 0.1 to 200 μm and a thickness precision of not more than ±5% measured over an entire area of 200 cm 2 , comprising:
i) applying a crosslinkable, solvent-containing or solvent-free silicone composition (X) through the gap of a slot die onto a moving carrier,
ii) subsequently removing solvent, if present, from a silicone layer which forms on the carrier, and crosslinking the silicone layer,
iii) wherein after crosslinking, the resulting crosslinked silicone film is partable from the carrier, and
a) the slot die in step i) is at an angle of between 10° and 90° to the carrier;
b) the travel speed of the carrier is between 0.1 and 500 m/min; and
c) the dynamic viscosity of the silicone composition (X) as measured according to DIN53019 is between 100 mPa·s and 100 Pa·s, and

wherein the silicone composition contains reinforcing filler having a BET surface area ≥50 m 2 /g.

2. The method of claim 1 , wherein the dynamic viscosity of the silicone composition (X) is between 200 mPa·s and 75 Pa·s.

3. The method of claim 1 , wherein the dynamic viscosity of the silicone composition (X) is between 300 mPa·s and 50 Pa·s.

4. The method of claim 1 , wherein a distance of the slot die from the carrier in step i) is at least 2 μm greater than the layer thickness of the silicone film produced.

5. The method of claim 1 , wherein the thickness precision is not more than ±3%.

6. The method of claim 5 , wherein the film thickness is from 2 to 100 μm.

7. The method of claim 1 , wherein the film thickness is from 2 to 100 μm.

8. The method of claim 1 , wherein the film thickness is from 0.5 μm to 50 μm.

9. The method of claim 1 , wherein the maximum diameter of particles in the reinforcing filler is less than or equal to one third the film thickness.

10. The method of claim 1 , wherein the method takes place in a clean room of class ISO 4 or better.

11. The method of claim 1 , wherein the carrier has a smooth surface characterized by the absence of depressions or elevations which are greater than ±5% of the film thickness.

12. The method of claim 1 , wherein the carrier has a smooth surface characterized by the absence of depressions or elevations which are greater than ±3% of the film thickness.

13. The method of claim 1 , further comprising pretreating the carrier with a release coating which facilitates release of the thin silicone film from the carrier.

14. The method of claim 13 , further comprising polishing the surface of the pretreated carrier by contact with a polishing roll prior to applying the crosslinkable silicone composition.

15. The method of claim 1 , further comprising parting the thin silicone film from the carrier.

16. The method of claim 15 , further comprising transferring a parted silicone film to another carrier.

17. The method of claim 1 , wherein the crosslinkable silicone composition is a moisture curing RTV-2 composition.

18. The method of claim 1 , wherein an organic solvent is present.

19. The method of claim 18 , wherein the organic solvent is present in an amount of from 1 to 50 weight percent based on the total weight of the coating composition.

20. The method of claim 1 , wherein the reinforcing filler particles are hydrophobicized by surface treatment.

Assignees

• Wacker Chemie Ag

Inventors

• Koellnberger Andreas
• Schwinghammer Alfred

Classifications

• B29K2083/00

  Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material · CPC title

• C08J2383/04

  Polysiloxanes · CPC title

• C08J5/18 Primary

  Manufacture of films or sheets · CPC title

• B29C41/003

  characterised by the choice of material · CPC title

• B29L2007/008

  Wide strips, e.g. films, webs · CPC title