Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatus

Patent metadata

Field	Value
Publication number	US-9949402-B2
Application number	US-201615269182-A
Country	US
Kind code	B2
Filing date	Sep 19, 2016
Priority date	Oct 30, 2015
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.

First claim

What is claimed is:

1. A liquid loop cooling apparatus comprising:
an evaporator thermally coupled to a heating element;
a condenser configured to be cooled by an airflow;
a pump configured to circulate a refrigerant between the evaporator and the condenser;
a first piping configured to couple the evaporator and the condenser;
a second piping configured to couple the condenser and the pump; and
a third piping configured to couple the pump and the evaporator,
the second piping outputs from a first surface of the condenser which faces an air outlet of a fan, which is provided on an opposite side of the evaporator across the condenser, extends along the air outlet between the air outlet and the first surface, and is coupled to a sidewall of the pump which is provided along a second surface of the condenser perpendicular to the first surface,
the first piping is provided between a third surface of the condenser opposite to the first surface and the evaporator.

2. The liquid loop cooling apparatus according to claim 1 , wherein the evaporator is arranged on a leeward side of the condenser.

3. The liquid loop cooling apparatus according to claim 1 , wherein the pump is arranged at a side of the condenser when viewed from the source side of the airflow.

4. The liquid loop cooling apparatus according to claim 1 , wherein the refrigerant changes in state from liquid to gas by heat transmitted from the heating element, and is cooled by the airflow and changes in state from gas to liquid inside the condenser.

5. The liquid loop cooling apparatus according to claim 1 , wherein the first piping, the second piping, and the third piping are each made of metal.

6. An electronic instrument comprising:
a circuit board equipped with an electronic part;
a blower fan;
a liquid loop cooling apparatus; and
a housing configured to house the circuit board, the blower fan, and the liquid loop cooling apparatus,
the liquid loop cooling apparatus includes:
an evaporator thermally coupled to the electronic part;
a condenser configured to be cooled by an airflow produced by the blower fan;
a pump configured to circulate a refrigerant between the evaporator and the condenser;
a first piping configured to be couple the evaporator and the condenser;
a second piping configured to couple the condenser and the pump; and
a third piping configured to couple the pump and the evaporator,
the second piping outputs from a first surface of the condenser which faces an air outlet of the blower fan, which is provided on an opposite side of the evaporator across the condenser, extends along the air outlet between the air outlet and the first surface, and is coupled to a sidewall of the pump which is provided along a second surface of the condenser perpendicular to the first surface,
the first piping is provided between a third surface of the condenser opposite to the first surface and the evaporator.

7. The electronic instrument according to claim 6 , wherein the evaporator is arranged on a leeward side of the condenser.

8. The electronic instrument according to claim 6 , wherein the pump is arranged at a side of the condenser when viewed from the source side of the airflow.

9. The electronic instrument according to claim 6 , wherein the refrigerant changes in state from liquid to gas by heat transmitted from the heating element, and is cooled by the airflow and changes in state from gas to liquid inside the condenser.

10. The electronic instrument according to claim 6 , wherein the first piping, the second piping, and the third piping are each made of metal.

11. A method of manufacturing a liquid loop cooling apparatus, the method comprising:
arranging a condenser that is cooled by an airflow produced by a fan in such a manner that a first surface of the condenser faces an air outlet of the fan;
arranging an evaporator thermally coupled to a heating element on an opposite side of the fan across the condenser;
arranging a pump adjacent to the condenser;
arranging a second piping in such a manner that the second piping outputs from a first surface of the condenser which faces the air outlet, extends along the air outlet between the air outlet and the first surface, and is coupled to a sidewall of the pump which is provided along a second surface of the condenser perpendicular to the first surface;
coupling the evaporator and the condenser by a first piping which is provided between a third surface of the condenser opposite to the first surface and the evaporator; and
coupling the evaporator and the delivery port of the pump by a third piping.

12. The method according to claim 11 , wherein the coupling by the first piping, the coupling by the second piping, and the coupling by the third piping are performed by brazing.

13. The method according to claim 11 , wherein the pump is arranged at a side of the condenser when viewed from the source side of the airflow.

14. The method according to claim 11 , wherein the pump circulates a refrigerant between the evaporator and the condenser.

15. The method according to claim 14 , wherein the refrigerant changes in state from liquid to gas by heat transmitted from the heating element, and is cooled by the airflow and changes in state from gas to liquid inside the condenser.

16. The method according to claim 11 , wherein the first piping, the second piping, and the third piping are each made of metal.

Assignees

• Fujitsu Ltd

Inventors

• So Tsuyoshi
• Kubo Hideo
• Uzuka Yoshinori
• Aoki Nobumitsu

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20809

  within server blades for removing heat from heat source · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• H05K7/20309 Primary

  Evaporators · CPC title