Electronic devices with internal moisture-resistant coatings

Patent metadata

Field	Value
Publication number	US-9949377-B2
Application number	US-201514593614-A
Country	US
Kind code	B2
Filing date	Jan 9, 2015
Priority date	Jan 10, 2012
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

First claim

What is claimed:

1. An electronic device, comprising:
a housing comprising an interior surface that defines an interior cavity;
a substrate within the interior cavity, the substrate having a first substrate surface and a second substrate surface opposite to the first substrate surface:
at least one component of the electronic device within the interior cavity formed on the first substrate surface of the substrate, the at least one component having a first surface;
a first water-resistant film formed directly on the interior surface of the housing; and
a second water-resistant film separated from the first water-resistant film and formed directly on the first surface of the at least one component,
wherein an empty void is defined between the first water-resistant film and the second water-resistant film.

2. The electronic device of claim 1 , wherein the first water-resistant film and the second water-resistant film have different chemical properties.

3. The electronic device of claim 1 , wherein at least one discernible boundary separates the first water-resistant film from the second water-resistant film, the at least one discernible boundary located wholly between the interior surface of the housing and the first surface of the at least one component.

Assignees

• Hzo Inc

Inventors

• Sorenson Max
• Stevens Blake
• Rae Alan
• Chason Marc

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K13/00

  Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components · CPC title

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• H05K2201/09872

  Insulating conformal coating · CPC title

• Y10T29/49002

  Electrical device making · CPC title