Laser diode unit with enhanced thermal conduction to slider

Patent metadata

Field	Value
Publication number	US-9947358-B1
Application number	US-201715678427-A
Country	US
Kind code	B1
Filing date	Aug 16, 2017
Priority date	Feb 23, 2015
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

An apparatus comprises a slider having a trailing edge and a leading edge. A laser diode unit comprises a submount and a laser diode mounted to the submount. The submount includes a mounting surface affixed to a first surface of the slider at the trailing edge such that a first surface of the submount faces toward the leading edge of the slider. A thermally conductive material covers the first surface of the submount and at least a portion of the first surface of the slider. The thermally conductive material serves as a thermal conduction pathway between the submount and the slider.

First claim

What is claimed is:

1. An apparatus, comprising:
a slider having a trailing edge, a leading edge, and a trench provided on a first surface of the slider near the trailing edge, a first metallization layer disposed in the trench;
a laser diode unit comprising a submount and a laser diode mounted to the submount, the trench dimensioned to receive the laser diode unit, the submount having a mounting surface comprising thermally conductive material coupled to the first metallization layer within the trench such that a first surface of the submount faces toward the leading edge of the slider; and
a thermally conductive material covering the first surface of the submount and at least a portion of the first surface of the slider, the thermally conductive material serving as a thermal conduction pathway between the submount and the slider.

2. The apparatus of claim 1 , wherein the thermally conductive material on the mounting surface of the submount contacts the first metallization layer in the trench.

3. The apparatus of claim 1 , wherein:
the laser diode unit comprises a second metallization layer disposed on the thermally conductive material on the mounting surface; and
the second metallization layer contacts the first metallization layer in the trench.

4. The apparatus of claim 3 , wherein the first and second metallization layers define under bump metallization (UBM) layers.

5. The apparatus of claim 3 , wherein thermally conductive material on the mounting surface serves as a wetting layer for a solder connection defined between the laser diode unit and the slider.

6. The apparatus of claim 1 , wherein the thermally conductive material covers all of the mounting surface of the submount.

7. The apparatus of claim 6 , wherein a second metallization layer extends over less than all of the thermally conductive material.

8. The apparatus of claim 1 , wherein the thermally conductive material covers a second surface of the submount opposing the first surface.

9. The apparatus of claim 1 , wherein the thermally conductive material covers at least three surfaces of the submount.

10. The apparatus of claim 1 , wherein the thermally conductive material covers at least four surfaces of the submount.

11. The apparatus of claim 1 , wherein the thermally conductive material covers at least five surfaces of the submount.

12. An apparatus, comprising:
a slider having a trailing edge, a leading edge, and a trench provided on a first surface of the slider near the trailing edge, a first metallization layer disposed in the trench;
a submount having a polygonal shape with exterior surfaces including a mounting surface configured to be received by the trench and attached to the slider via the first metallization layer, the submount having a first surface that faces toward the leading edge of the slider and a second surface that faces toward the trailing edge of the slider;
a laser diode mounted on the second surface of the submount; and
thermally conductive material covering a plurality of the surfaces of the submount including the mounting surface and the first surface of the submount, the thermally conductive material serving as a thermal conduction pathway between the submount and the slider, and the thermally conductive material covering the mounting surface of the submount serves as a wetting layer.

13. The apparatus of claim 12 , wherein the thermally conductive material on the mounting surface of the submount contacts the first metallization layer in the trench.

14. The apparatus of claim 12 , wherein the thermally conductive material covers all of the mounting surface of the submount.

15. The apparatus of claim 12 , wherein:
a second metallization layer is disposed on the thermally conductive material on the mounting surface; and
the second metallization layer contacts the first metallization layer in the trench.

16. The apparatus of claim 15 , wherein the first and second metallization layers define under bump metallization (UBM) layers.

17. The apparatus of claim 12 , wherein the thermally conductive material covers the second surface of the submount.

18. The apparatus of claim 12 , wherein the thermally conductive material covers at least three surfaces of the submount.

19. The apparatus of claim 12 , wherein the thermally conductive material covers at least four surfaces of the submount.

20. The apparatus of claim 12 , wherein the thermally conductive material covers at least five surfaces of the submount.

Assignees

• Seagate Technology Llc

Inventors

• Cheng Yuhang
• Franzen Scott
• Jandric Zoran
• Wessel James Gary
• Shi Ning

Classifications

• G11B5/105

  Mounting of head within housing {or assembling of head and housing (G11B5/3103 takes precedence)} · CPC title

• G11B5/4826

  Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive (G11B5/484 takes precedence; details of head housings or structures G11B5/10, G11B5/127; adjustment relative to the record carrier G11B5/56) · CPC title

• G11B5/6088 Primary

  Optical waveguide in or on flying head · CPC title

• G11B5/314

  where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title