Electronic assembly and assemblying method

US9946306B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9946306-B2
Application numberUS-201414149808-A
CountryUS
Kind codeB2
Filing dateJan 8, 2014
Priority dateJan 8, 2014
Publication dateApr 17, 2018
Grant dateApr 17, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic assembly includes a transparent adhesive layer, a transparent cover, a display module and a frame. The transparent adhesive layer has a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, the second adhesive surface having a central region and a peripheral region around the central region. The transparent cover is adhered to the first adhesive surface of the transparent adhesive layer. The display module is adhered to the central region of the transparent adhesive layer. The frame has a border carrying part which is adhered to the peripheral region of the transparent adhesive layer.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic assembly comprising: a transparent adhesive layer having a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, the second adhesive surface having a central region and a peripheral region around the central region; a transparent cover adhered to the first adhesive surface of the transparent adhesive layer; a display module adhered to the central region of the transparent adhesive layer; a frame having a border carrying part, the border carrying part being adhered to the peripheral region of the transparent adhesive layer, wherein the frame has a receiving slot for installing the transparent cover and the display module, a decorative layer, the transparent cover and the display module are accommodated inside the receiving slot, and the border carrying part adhered to the transparent adhesive layer forms a bottom surface of the receiving slot; and a touch module disposed between the transparent cover and the transparent adhesive layer, wherein the touch module directly contacts with the decorative layer, and a thickness of the touch module in the central region is equal to a thickness of the decorative layer, wherein the decorative layer, the touch module and the transparent adhesive layer are stacked between the transparent cover and the border carrying part, wherein a total thickness of the decorative layer, the touch module and the transparent adhesive layer is equal to a distance between the border carrying part and a surface of the transparent cover facing the first adhesive surface of the transparent adhesive layer. 2. The electronic assembly according to claim 1 , wherein the decorative layer is disposed on the periphery of the transparent cover, located between the transparent cover and the transparent adhesive layer, and extending from the peripheral region to the central region. 3. The electronic assembly according to claim 1 , further comprising: a buffer layer installed and compressed between a bottom of the receiving slot and a bottom surface of the display module, and applied force at a bottom of the display module. 4. The electronic assembly according to claim 3 , wherein the thickness of the uncompressed buffer layer is 1 to 3 times the thickness of the compressed buffer layer. 5. An electronic assembly comprising: a transparent adhesive layer having a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, the second adhesive surface having a central region and a peripheral region around the central region; a transparent cover; a touch module, one surface thereof adhered to the transparent cover, and another surface adhered to the first adhesive surface of the transparent adhesive layer, wherein the touch module is disposed between the transparent cover and the transparent adhesive layer, wherein the touch module directly contacts with a decorative layer, and a thickness of the touch module in the central region is equal to a thickness of the decorative layer; a display module adhered to the central region of the transparent adhesive layer; and a frame having a border carrying part, the border carrying part being adhered to the peripheral region of the transparent adhesive layer, wherein the frame has a receiving slot for installing the transparent cover and the display module, the decorative layer, the transparent cover and the display module are accommodated inside the receiving slot, and the border carrying part adhered to the transparent adhesive layer forms a bottom surface of the receiving slot, wherein the decorative layer, the touch module and the transparent adhesive layer are stacked between the transparent cover and the border carrying part, wherein a total thickness of the decorative layer, the touch module and the transparent adhesive layer is equal to a distance between the border carrying part and a surface of the transparent cover facing the first adhesive surface of the transparent adhesive layer. 6. The electronic assembly according to claim 5 , wherein the decorative layer is disposed on the periphery of the transparent cover, located between the transparent cover and the transparent adhesive layer, and extending from the peripheral region to the central region. 7. The electronic assembly according to claim 5 , further comprising: a buffer layer installed between a bottom of the receiving slot and a bottom surface of the display module and leaning against a bottom of the display module. 8. The electronic assembly according to claim 7 , wherein the thickness of the uncompressed buffer layer is 1 to 3 times the thickness of the compressed buffer layer.

Assignees

Inventors

Classifications

  • the display being associated to a digitizer, e.g. laptops that can be used as penpads (details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615) · CPC title

  • characterised by using adhesives · CPC title

  • G06F1/1658Primary

    related to the mounting of internal components, e.g. disc drive or any other functional module · CPC title

  • Touch screens · CPC title

  • Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

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Frequently asked questions

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What does patent US9946306B2 cover?
An electronic assembly includes a transparent adhesive layer, a transparent cover, a display module and a frame. The transparent adhesive layer has a first adhesive surface and a second adhesive surface opposite to the first adhesive surface, the second adhesive surface having a central region and a peripheral region around the central region. The transparent cover is adhered to the first adhes…
Who is the assignee on this patent?
Htc Corp
What technology area does this patent fall under?
Primary CPC classification G06F1/1658. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).