Package for a differential pressure sensing die
US-2015247776-A1 · Sep 3, 2015 · US
US9945747B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9945747-B1 |
| Application number | US-201615293043-A |
| Country | US |
| Kind code | B1 |
| Filing date | Oct 13, 2016 |
| Priority date | Oct 13, 2016 |
| Publication date | Apr 17, 2018 |
| Grant date | Apr 17, 2018 |
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Embodiments relate generally to methods and systems for detecting pressure. A pressure sensor assembly may comprise a sensor unit having a pressure input port on one side, the sensor unit comprising a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor.
Opening claim text (preview).
What is claimed is: 1. A pressure sensor assembly comprising: a sensor unit having a pressure input port on one side, the sensor unit comprising: a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port, wherein the media isolation layer is configured to transfer a pressure caused by a sense media to the pressure sensor. 2. The pressure sensor assembly of claim 1 , wherein the first media isolation layer comprises a first gel material, and wherein the second media isolation layer comprises a second gel material. 3. The pressure sensor assembly of claim 1 , wherein the second media isolation layer comprises a chemically resistant gel material. 4. The pressure sensor assembly of claim 1 , wherein the media isolation layer is contained by the support. 5. The pressure sensor assembly of claim 1 , further comprising a pressure port having a fluid path that extends from an external side of the pressure port to the pressure input port, wherein the support is secured relative to the pressure port such that the fluid path of the pressure port is in fluid communication with the media isolation layer. 6. The pressure sensor assembly of claim 5 , wherein the support is secured to a raised portion of the pressure port via adhesive. 7. The pressure sensor assembly of claim 5 , further comprising a snubber located within the fluid path of the pressure port. 8. The pressure sensor assembly of claim 1 , further comprising an electrical connector including one or more electrical terminals, wherein at least one of the one or more electrical terminals are electrically connected to an output of the sensor unit. 9. The pressure sensor assembly of claim 1 , wherein the support comprises a metal ring. 10. The pressure sensor assembly of claim 1 , wherein the support comprises a plastic ring. 11. A pressure sensor assembly comprising: a sensor unit having a pressure input port on one side, the sensor unit comprising: a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and at least one media isolation layer contained by the support, the media isolation layer configured to transfer a pressure caused by a sense media to the pressure sensor. 12. The pressure sensor assembly of claim 11 , wherein the at least one media isolation layer comprises a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port. 13. The pressure sensor assembly of claim 12 , wherein the second media isolation layer comprises a chemically resistant gel material. 14. The pressure sensor assembly of claim 11 , further comprising a pressure port having a fluid path that extends from an external side of the pressure port to the pressure input port, wherein the support is secured relative to the pressure port such that the fluid path of the pressure port is in fluid communication with the at least one media isolation layer. 15. The pressure sensor assembly of claim 11 , wherein the circumference of the support is less than the circumference of the printed circuit board. 16. The pressure sensor assembly of claim 11 , wherein the support comprises a lip configured to be secured to the printed circuit board via adhesive. 17. The pressure sensor assembly of claim 11 , further comprising an electrical connector including one or more electrical terminals, wherein at least one of the one or more electrical terminals are electrically connected to an output of the sensor unit. 18. A method of sensing pressure comprising: applying pressure to a pressure port of a sensor assembly, the sensor assembly comprising a sensor unit having a pressure input port on one side, the sensor unit comprising: a printed circuit board; a pressure sensor secured to a side of the printed circuit board; a support secured to the side of the printed circuit board, the support circumferentially surrounding the pressure sensor and defining the pressure input port; and a media isolation layer comprising a first media isolation layer applied adjacent to the pressure sensor, and a second media isolation layer comprising a material different from the first media isolation layer located between the first media isolation layer and the pressure input port; deflecting at least a portion of the pressure sensor with the applied pressure; measuring the deflection of the pressure sensor; and determining a magnitude of the applied pressure based on the measured deflection of the sensor. 19. The method of claim 18 , wherein deflecting at least a portion of the pressure sensor comprises compressing the first media isolation layer and the second media isolation layer. 20. The method of claim 18 , further comprising electrically communicating the determined magnitude of the applied pressure via an electrical connector.
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