Microelectromechanical system and methods of use
US-2015177272-A1 · Jun 25, 2015 · US
US9945734B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9945734-B1 |
| Application number | US-201715601431-A |
| Country | US |
| Kind code | B1 |
| Filing date | May 22, 2017 |
| Priority date | Sep 9, 2011 |
| Publication date | Apr 17, 2018 |
| Grant date | Apr 17, 2018 |
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A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.
Opening claim text (preview).
What is claimed is: 1. A micromachined apparatus comprising: a substrate having first and second anchor structures; and a micromachined thermistor having (i) first and second ends physically and thermally coupled to the substrate via the first and second anchor structures, respectively, to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate, and (ii) a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures. 2. The micromachined apparatus of claim 1 wherein the micromachined thermistor comprises a loop shape. 3. The micromachined thermistor of claim 1 wherein the micromachined thermistor comprises a beam that extends, from the first anchor structure to the second anchor structure, along a path that deviates from an axis between the first and second anchor structures. 4. The micromachined apparatus of claim 1 further comprising an encapsulation structure secured to the substrate and forming a cavity in which the micromachined thermistor is disposed. 5. The micromachined apparatus of claim 4 wherein the encapsulation structure forms a vacuum cavity in which the micromachined thermistor is disposed. 6. The micromachined apparatus of claim 1 further comprising measurement circuitry, electrically coupled to the micromachined thermistor, to generate information indicative of temperature based at least in part on the temperature-dependent resistance of the micromachined thermistor. 7. The micromachined apparatus of claim 6 wherein the measurement circuitry is electrically coupled to the micromachined thermistor via the first and second anchor structures. 8. The micromachined apparatus of claim 1 further comprising a microelectromechanical structure thermally coupled to the micromachined thermistor via the substrate such that the time-varying temperature of the substrate and temperature-dependent resistance of the micromachined thermistor is indicative of a time-varying temperature of the microelectromechanical structure. 9. The micromachined apparatus of claim 8 wherein the microelectromechanical structure is anchored to the substrate by at least one of the first and second anchor structures and thermally coupled to the micromachined thermistor via the substrate by virtue of sharing the at least one of the first and second anchor structures with the micromachined thermistor. 10. The micromachined apparatus of claim 8 further comprising circuitry electrically coupled to the micromachined thermistor and microelectromechanical structure, the circuitry including (i) measurement circuitry to generate temperature information based at least in part on the temperature-dependent resistance of the micromachined thermistor and (ii) output-generating circuitry to generate an output signal in accordance with a signal indicative of mechanical motion of the microelectromechanical structure and dependent, at least in part, on the temperature information.
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