Electro chemical deposition apparatus

Patent metadata

Field	Value
Publication number	US-9945043-B2
Application number	US-201113994198-A
Country	US
Kind code	B2
Filing date	Dec 8, 2011
Priority date	Dec 15, 2010
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

This invention relates to apparatus for electrochemical deposition onto the surface of a substrate. The apparatus includes an anode electrode 13 a support 12 for supporting the substrate 11 with its one surface 21 exposed at a location, the support 12 and the anode electrode 13 being relatively movable to alter the gap between the anode 13 and the location to define a chamber 23 between them and an electrical power source 18 with an ohmic contact to the seed layer 20 for creating a potential difference across the gap. The apparatus further includes a seal 14 for sealing with the seed layer 20 to define the fluid chamber 23 ; and the fluid inlet 16 and a fluid outlet 17 to the chamber 13.

First claim

The invention claimed is:

1. Apparatus for electrochemical deposition on to a surface of a substrate having features formed in said surface, the substrate having a conductive seed layer pre-deposited on said surface;
the apparatus including an anode electrode;
a support for supporting the substrate with said surface exposed at a location having the features, the support and the anode electrode being relatively movable to alter a gap between the anode and the location to define a chamber between them;
a seal carried by the anode electrode or by a dielectric container where the anode electrode is retained for sealing with the seed layer encircling all of the features to form said chamber, the substrate in sealed opposed relationship with the anode electrode;
a fluid inlet and outlet to the chamber for passing an electrolyte through the chamber; and
an ohmic contact to the seed layer for creating a potential difference across the gap between the anode electrode and the seed layer when the ohmic contact is coupled to an electrical power source, wherein when an electrolyte is passed through the chamber the electrolyte passes over a predetermined, fixed area of said surface of the substrate which includes the features.

2. Apparatus as claimed in claim 1 wherein said fluid inlet and outlet are formed in the anode electrode or other part of the chamber.

3. Apparatus as claimed in claim 1 wherein the depth of the chamber is at least an order of magnitude less than its cross-sectional dimension.

4. Apparatus as claimed in claim 1 wherein the anode electrode carries an electrically isolated electrical contact for contacting the seed layer to form the ohmic contact and to complete an electrical circuit.

5. Apparatus as claimed in claim 1 further comprising a fluid supply for the chamber.

6. Apparatus as claimed in claim 5 further comprising a control for varying the chemical composition of the fluid in accordance with the degree to which the features have been plated.

7. Apparatus as claimed in claim 6 further comprising a control for pulsing fluid into and out of the chamber.

8. Apparatus as claimed in claim 1 wherein the electrical power source is a pulsed supply.

9. Apparatus as claimed in claim 1 wherein the anode electrode is at least coextensive with the support.

Assignees

• Macneil John
• Spts Technologies Ltd

Inventors

• Macneil John

Classifications

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/02

  Heating or cooling · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title

• C25D5/022

  using masking means · CPC title