Metal nanoplate, a method for preparing the same, a conductive ink composition, and a conductive film comprising the same

Patent metadata

Field	Value
Publication number	US-9944813-B2
Application number	US-201414898401-A
Country	US
Kind code	B2
Filing date	Jun 12, 2014
Priority date	Jun 14, 2013
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

The present invention relates to a metal nanoplate, a method for manufacturing same, and a conductive ink composition and a conductive film comprising metal nanoplate. The metal nanoplate does not require application of a high temperature and high pressure and thus can be easily manufactured at a low temperature and at normal pressure, and a conductive film or a conductive pattern, among others, having excellent conductivity can be formed even when the conductive ink composition comprising the metal nanoplate is printed on a substrate and then heat-treated or dried at a low temperature. As a result, the metal nanoplate and the conductive ink composition comprising same can be very appropriately applied to various semiconductor elements, display devices, or when forming a conductive pattern or a conductive film for a solar cell in an environment requiring low-temperature firing.

First claim

The invention claimed is:

1. A metal nanoplate comprising a metal connected by a medium of a conductive polymer and having a thickness of 0.5 nm to 100 nm, a diameter of 200 nm or more, and a width larger than the thickness and equal to or less than the diameter, wherein a ratio of width/diameter is 0.6 to 1, wherein a ratio of diameter/thickness is 100 to 2000, and wherein the conductive polymer comprises polyaniline, polypyrrole, or a copolymer thereof.

2. The metal nanoplate of claim 1 , wherein the diameter is 200 nm to 100 μm.

3. The metal nanoplate of claim 1 , wherein the width is 120 nm to 100 μm.

4. The metal nanoplate of claim 1 , wherein the metal nanoplate has a plate shape of polygon, circle, or oval.

5. The metal nanoplate of claim 1 , wherein the metal nanoplate comprises a metal oxide less than 1 wt %.

6. The metal nanoplate of claim 1 , wherein the metal comprises one or more metals selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), palladium (Pd), iridium (Ir), ruthenium (Ru), rhodium (Rh), copper (Cu), and nickel (Ni).

7. The metal nanoplate of claim 1 , wherein the metal is silver (Ag).

8. A method for preparing the metal nanoplate of claim 1 , comprising reacting a conductive polymer and a metal salt.

9. The method of claim 8 , wherein the reacting the conductive polymer and the metal salt is carried out at −40° C. to 30° C.

10. The method of claim 9 , wherein the reacting the conductive polymer and the metal salt is carried out for 10 minutes to 250 hours.

11. The method of claim 8 , wherein the method comprises
forming a dispersion solution comprising the conductive polymer; and
reacting the conductive polymer and the metal salt by putting the metal salt in the dispersion solution.

12. The method of claim 8 , wherein the metal salt is one or more metal salts selected from the group consisting of silver (Ag), gold (Au), platinum (Pt), palladium (Pd), iridium (Ir), ruthenium (Ru), rhodium (Rh), copper (Cu), and nickel (Ni).

13. The method of claim 12 , wherein the salt of silver is one or more salts selected from the group consisting of silver nitrate (AgNO 3 ), silver sulfate (Ag 2 SO 4 ), silver acetate (Ag(CH 3 COO)), silver fluoride (AgF), silver chloride (AgCl ), silver bromide (AgBr), silver iodide (AgI), cyanide (AgCN), silver cyanate (AgOCN), silver lactate (Ag(CH 3 CHOHCOO)), silver carbonate (Ag 2 CO 3 ), silver perchlorate (AgClO 4 ), silver trifluoroacetate (Ag(CF 3 COO)), and silver trifluorosulfonate (Ag(CF 3 SO 3 )).

14. The method of claim 8 , wherein the reaction of the conductive polymer and the metal salt is carried out in a first solvent comprising one or more solvents selected from the group consisting of water, alcohol, acetone, methyl ethyl ketone (MEK), ethylene glycol, formamide HCONH 2 , dimethylformamide (DMF), dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N-methyl pyrrolidone (NMP).

15. A conductive ink composition comprising the metal nanoplate according to claim 1 , and a second solvent.

16. The conductive ink composition of claim 15 , further comprising one or more components selected from the group consisting of a dispersant, a binder, and a pigment.

17. The conductive ink composition of claim 15 , wherein the second solvent comprises one or more solvent selected from the group consisting of water, an alcohol-based solvent, an alcoholalkylether-based solvent, an alcoholarylether-based solvent, an ester-based solvent, an amide-based solvent, an amine-based solvent, an aliphatic hydrocarbon-based solvent, and an aromatic hydrocarbon-based solvent.

18. A conductive film, comprising the metal nanoplate according to claim 1 .

19. The conductive film of claim 18 , wherein the conductive film is a conductive membrane or a conductive pattern of a display device, a semiconductor device, or a solar cell.

20. The conductive film of claim 19 , wherein the conductive film is a transparent conductive film of a touch panel.

Assignees

• Lg Chemical Ltd

Inventors

• Kwon Won Jong
• Park Se-Ho
• Yoon Sung-Ho
• Jeon Yeo-Jin

Classifications

• B22F1/10

  Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

• B22F1/102

  Metallic powder coated with organic material · CPC title

• B22F1/056

  Submicron particles having a size above 100 nm up to 300 nm · CPC title

• B22F1/0551

  Flake form nanoparticles · CPC title

• B22F1/00

  Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title