Organosiloxane, curable silicone composition, and semiconductor device

Patent metadata

Field	Value
Publication number	US-9944772-B2
Application number	US-201515315750-A
Country	US
Kind code	B2
Filing date	May 29, 2015
Priority date	Jun 4, 2014
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.

First claim

The invention claimed is:

1. An organosiloxane represented by the general formula:

wherein, R 1 are the same or different monovalent hydrocarbon groups each having from 1 to 12 carbons but having no aliphatic unsaturated bond, R 2 is an alkenyl group having from 2 to 12 carbons, R 3 are the same or different alkyl groups each having from 1 to 3 carbons, X is a group represented by the general formula:

wherein, R 1 are the same as those described above, R 4 are the same or different alkylene groups, p is an integer of 0 to 50, and q is 0 or 1,
wherein, m is an integer of 0 to 50, and n is an integer of 1 to 50.

2. The organosiloxane according to claim 1 , wherein R 4 is an ethylene group or a propylene group.

3. An adhesion promoter comprising the organosiloxane according to claim 1 .

4. A curable silicone composition comprising the organosiloxane according to claim 1 as an adhesion promoter.

5. The curable silicone composition according to claim 4 , wherein the curable silicone composition is cured by a hydrosilylation reaction.

6. The curable silicone composition according to claim 5 , the hydrosilylation reaction curable silicone composition comprising:
(A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups in a molecule;
(B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, in an amount such that provides from 0.1 to 10 mol of silicon atom-bonded hydrogen atom per 1 mol total of alkenyl groups contained in components (A) and (C);
(C) from 0.1 to 10 parts by mass of an adhesion promoter containing the organosiloxane; and
(D) a catalyst for hydrosilylation reaction, in an amount that is sufficient to promote curing of the composition.

7. The curable silicone composition according to claim 6 , further comprising (E) a hydrosilylation reaction inhibitor, in an amount from 0.0001 to 5 parts by mass of per 100 parts by mass total of components (A) to (D).

8. A semiconductor device comprising a semiconductor element encapsulated with a cured product of the curable silicone composition according to claim 4 .

9. The semiconductor device according to claim 8 , wherein the semiconductor element is a light emitting element.

10. An adhesion promoter comprising the organosiloxane according to claim 2 .

Assignees

• Dow Corning Toray Co Ltd

Inventors

• Iimura Tomohiro
• Toda Nohno
• INAGAKI Sawako
• Miyamoto Yusuke
• Furukawa Haruhiko

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title