Method of manufacture MEMS switches with reduced voltage

US9944518B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9944518-B2
Application numberUS-201514883843-A
CountryUS
Kind codeB2
Filing dateOct 15, 2015
Priority dateApr 22, 2008
Publication dateApr 17, 2018
Grant dateApr 17, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An approach includes a method of fabricating a switch. The approach includes forming a first fixed electrode and a second fixed electrode, forming a first cantilevered electrode aligned vertically over the first fixed electrode, forming a second cantilevered electrode aligned vertically over the first fixed electrode and which has an end that overlaps the first cantilevered electrode, forming a third cantilevered electrode aligned vertically over the second fixed electrode and operable to directly contact the first cantilevered electrode upon an application of a voltage to the second fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.

First claim

Opening claim text (preview).

It is claimed: 1. A method of fabricating a switch comprising: forming a first fixed electrode and a second fixed electrode; forming a first cantilevered electrode aligned vertically over the first fixed electrode; forming a second cantilevered electrode aligned vertically over the first fixed electrode, and which has an end that overlaps and is parallel to an end of the first cantilevered electrode; forming a third cantilevered electrode aligned vertically over the second fixed electrode and operable to directly contact the first cantilever electrode upon an application of a positive voltage to the second fixed electrode; forming an extending protrusion which extends upward from an upper surface of an arm of the first cantilever electrode which is positioned under the third cantilevered electrode; and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode. 2. The method of claim 1 , wherein the hermetically sealed volume is a dome. 3. The method of claim 2 , wherein the dome is oval shaped. 4. The method of claim 1 , wherein overlapping portions of the end of the first cantilevered electrode and the end of the second cantilevered electrode are separated by a vertical distance of about two microns. 5. The method of claim 1 , wherein the third cantilevered electrode is formed above the second cantilevered electrode. 6. The method of claim 1 , wherein the second cantilevered electrode is formed above the first cantilevered electrode. 7. The method of claim 1 , wherein the first cantilevered electrode is formed such that upon application of a negative voltage to the first fixed electrode and a positive voltage to the second cantilevered electrode, the first cantilevered electrode is operable to directly contact the third cantilevered electrode. 8. The method of claim 7 , wherein the negative voltage is about −30 volts and the positive voltage is about 30 volts. 9. The method of claim 1 , wherein the hermetically sealed volume comprises nitride. 10. The method of claim 1 , wherein the positive voltage is about 30 volts. 11. A method of fabricating a switch comprising: forming a first fixed electrode and a second fixed electrode; forming a first cantilevered electrode aligned vertically over the first fixed electrode; forming a second cantilevered electrode aligned vertically over the first fixed electrode, and which has an end that overlaps the first cantilevered electrode; forming a third cantilevered electrode aligned vertically over the second fixed electrode and operable to directly contact the first cantilever electrode upon an application of a voltage to the second fixed electrode; and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode, wherein the forming the hermetically sealed volume comprises: forming at least one hole in a nitride liner to gain access to a sacrificial resist; etching the sacrificial resist; and closing the at least one hole by deposition of additional liner material.

Assignees

Inventors

Classifications

  • Electrical characteristics, e.g. by doping materials · CPC title

  • Switches making use of microelectromechanical systems [MEMS] (for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009) · CPC title

  • making use of micromechanics · CPC title

  • Electric connections to or between contacts; Terminals {(for high tension switches H01H33/025; for electromagnetic relays H01H50/14; for circuit breakers H01H71/08)} · CPC title

  • Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling · CPC title

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What does patent US9944518B2 cover?
An approach includes a method of fabricating a switch. The approach includes forming a first fixed electrode and a second fixed electrode, forming a first cantilevered electrode aligned vertically over the first fixed electrode, forming a second cantilevered electrode aligned vertically over the first fixed electrode and which has an end that overlaps the first cantilevered electrode, forming a…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification B81C1/00698. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).