Molded fluid flow structure

Patent metadata

Field	Value
Publication number	US-9944080-B2
Application number	US-201314769994-A
Country	US
Kind code	B2
Filing date	Feb 28, 2013
Priority date	Feb 28, 2013
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

In one example, a fluid flow structure includes a micro device embedded in a molding having a channel therein through which fluid may flow directly into the device and/or onto the device.

First claim

What is claimed is:

1. A fluid flow structure, comprising:
a monolithic molding;
a micro device molded into the monolithic molding, the micro device comprising at least one electrical terminal;
a conductor electrically coupled to the at least one terminal and embedded in the monolithic molding; and
a channel defined in the molding through which fluid flows directly to the micro device,
wherein the channel tapers from a first end distal from the micro device to a second end proximal to the micro device, the first end comprising a larger cross section relative to the second end.

2. The structure of claim 1 , wherein the micro device comprises a fluid flow passage connected directly to the channel.

3. The structure of claim 1 , wherein the channel comprises an open channel exposed to an external surface of the micro device.

4. The structure of claim 1 , wherein the micro device comprises a microelectromechanical system (MEMS) device.

5. The structure of claim 4 , wherein the MEMS device comprises a printhead die sliver that comprises a fluid flow passage connected directly to the channel.

6. The structure of claim 1 , wherein the micro device comprises:
an orifice plate; and
a silicon substrate coupled to the orifice plate,
wherein a number of through ports are defined in the silicon substrate to allow fluid to flow through the through ports to the orifice plate, and
wherein the through ports taper from a first through port end distal from the orifice plate to a second through port end proximal to the orifice plate, the first through port end comprising a larger cross section relative to the second through port end.

7. The structure of claim 1 , wherein the channels are formed using transfer molding.

8. A printhead structure, comprising:
a monolithic body molded around multiple printhead die slivers,
wherein the monolithic body comprises a channel molded therein through which fluid flows directly to the slivers, each printhead die sliver comprises a fluid flow passage connected directly to a least one of a plurality of channels, and each channel of the plurality of channels is located next to a thickness of one or more of the printhead die slivers,
wherein the molding encapsulates each of the printhead die slivers on three sides other than a side of the micro devices comprising an orifice plate, the monolithic molding comprising a channel molded therein in contact with each of the printhead die slivers such that a fluid can flow through the channel directly to the micro devices, and
wherein the channel tapers from a first channel end distal from the printhead die slivers to a second channel end proximal to the printhead die slivers, the first channel end comprising a larger cross section relative to the second channel end.

9. The structure of claim 8 , wherein the channel comprises multiple channels through each of which fluid flows directly to one or more of the slivers.

10. The structure of claim 8 , wherein each channel is located next to a width of one or more of the printhead die slivers.

11. A system, comprising:
a source of fluid;
a fluid flow structure comprising a micro device embedded in a monolithic molding comprising a channel molded therein through which fluid flows directly to the micro device;
a fluid pump to move fluid from the fluid source to the channel in the fluid flow structure;
an orifice plate; and
a silicon substrate coupled to the orifice plate,
wherein a number of through ports are defined in the silicon substrate to allow fluid to flow through the through ports to the orifice plate, and
wherein the through ports taper from a first through port end distal from the orifice olate to a second through port end proximal to the orifice plate, the first through port end comprising a larger cross section relative to the second through port end.

12. The system of claim 11 , wherein:
the source of fluid comprises a supply of printing fluid;
the micro device comprises a printhead die; and
the fluid pump comprises a device to regulate the flow of printing fluid from the supply to the printhead die.

13. An in-process wafer assembly for making multiple fluid flow structures, the wafer assembly comprising:
a wafer;
multiple individual micro devices supported on the wafer, wherein each of the micro devices comprise:
an orifice plate; and
a silicon substrate coupled to the orifice plate,
wherein a number of through ports are defined in the silicon substrate to allow fluid to flow through the through ports to the orifice plate,
wherein the through ports taper from a first through port end distal from the orifice plate to a second through port end proximal to the orifice plate, the first through port end comprising a larger cross section relative to the second through port end; and
at least one electrical terminal; and

a monolithic molding molded over the wafer, the molding encapsulating each of the micro devices on three sides other than a side of the micro devices comprising the orifice plate, the monolithic molding comprising a channel molded therein in contact with each of the micro devices such that a fluid can flow through the channel directly to the micro devices; and
a conductor electrically coupled to the at least one terminal of each of the multiple individual micro devices and embedded in the monolithic molding,
wherein the channel tapers from a first channel end distal from the micro device to a second channel end proximal to the micro device, the first channel end comprising a larger cross section relative to the second channel end.

14. The wafer assembly of claim 13 , wherein:
the channel comprises multiple channels each in contact with one or more of the micro devices; and
each micro device comprises a micro device sliver, wherein the wafer assembly comprises at least 200 slivers on the wafer.

15. The wafer assembly of claim 13 , wherein the channels are formed using transfer molding.

Assignees

• Hewlett Packard Development Co

Inventors

• Chen Chien-Hua
• Cumbie Michael W

Classifications

• B41J2/1607

  Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence) · CPC title

• B41J2/1637

  molding · CPC title

• B41J2/145

  Arrangement thereof · CPC title

• B41J2/155 Primary

  for line printing · CPC title

• B41J2/1603

  of the front shooter type · CPC title