High performance, rapid thermal/UV curing epoxy resin for additive manufacturing of short and continuous carbon fiber epoxy composites

US9944016B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9944016-B2
Application numberUS-201514802029-A
CountryUS
Kind codeB2
Filing dateJul 17, 2015
Priority dateJul 17, 2015
Publication dateApr 17, 2018
Grant dateApr 17, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additive manufacturing resin system including an additive manufacturing print head; a continuous carbon fiber or short carbon fibers operatively connected to the additive manufacturing print head; and a tailored resin operatively connected to the print head, wherein the tailored resin has a resin mass and wherein the tailored resin includes an epoxy component, a filler component, a catalyst component, and a chain extender component; wherein the epoxy component is 70-95% of the resin mass, wherein the filler component is 1-20% of the resin mass, wherein the catalyst component is 0.1-10% of the resin mass, and wherein the chain extender component is 0-50% of the resin mass.

First claim

Opening claim text (preview).

The invention claimed is: 1. A system for additive manufacturing a carbon fiber epoxy product, comprising: an additive manufacturing print head; a reservoir in said additive manufacturing print head; a movable ram in said reservoir; short carbon fibers in said reservoir, wherein said short carbon fibers are dispersed and randomly aligned in a tailored epoxy resin in said reservoir; a tapered nozzle in said additive manufacturing print head operatively connected to said reservoir wherein said tapered nozzle has a direction of taper, said tapered nozzle producing an extruded material that forms the carbon fiber epoxy product; angled resin sweat holes in said nozzle angled against said direction of taper; baffles in said tapered nozzle that receive said tailored epoxy resin with said short carbon fibers dispersed in said epoxy resin; wherein said tailored epoxy resin provides a resin carrier and wherein said tailored epoxy resin has a resin mass and wherein said tailored epoxy resin includes an epoxy component, a filler component, a catalyst component, and a chain extender component; wherein said epoxy component is 70-95% of said resin mass, wherein said filler component is 1-20% of said resin mass, wherein said catalyst component is 0.1-10% of said resin mass, wherein said chain extender component is 0-50% of said resin mass; and said movable ram positioned to provide separation of said resin carrier through said angled resin sweat holes in said nozzle and said movable ram positioned for driving said tailored epoxy resin with said short carbon fibers dispersed in said tailored epoxy resin from said reservoir through said tapered nozzle wherein said randomly aligned short carbon fibers in said tailored epoxy resin are aligned by said baffles and wherein said extruded material has said short carbon fibers aligned in said tailored epoxy resin that forms said carbon fiber epoxy product. 2. The system for additive manufacturing a carbon fiber epoxy product of claim 1 wherein said epoxy component has a Bis-phenyl F diglycidyl ether core. 3. The system for additive manufacturing a carbon fiber epoxy product of claim 2 wherein said Bis-phenyl F diglycidyl ether core is chemically modified or partially polymerized to form a higher viscosity oligomer with formaldehyde. 4. The system for additive manufacturing a carbon fiber epoxy product of claim 1 wherein said filler component is an inorganic oxide filler. 5. The system for additive manufacturing a carbon fiber epoxy product of claim 4 wherein said filler component is an inorganic silica filler. 6. The system for additive manufacturing a carbon fiber epoxy product of claim 1 wherein said tapered nozzle is made of stainless steel. 7. The system for additive manufacturing a carbon fiber epoxy product of claim 1 wherein said tapered nozzle is coated internally with a non-reactive polymer. 8. The system for additive manufacturing a carbon fiber epoxy product of claim 1 wherein said tapered nozzle has a nozzle tip wherein said nozzle tip can be of variable sizes and shapes. 9. The system for additive manufacturing a carbon fiber epoxy product of claim 1 further comprising a secondary outer sheathe positioned outside of said tapered nozzle and outside of said angled resin sweat holes that collects said resin carrier from said angled resin sweat holes.

Assignees

Inventors

Classifications

  • Heads; Nozzles · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Use of inorganic materials not provided for in groups {B29K2503/00 - B29K2507/00,} as filler · CPC title

  • Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material · CPC title

  • Carbon · CPC title

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Frequently asked questions

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What does patent US9944016B2 cover?
An additive manufacturing resin system including an additive manufacturing print head; a continuous carbon fiber or short carbon fibers operatively connected to the additive manufacturing print head; and a tailored resin operatively connected to the print head, wherein the tailored resin has a resin mass and wherein the tailored resin includes an epoxy component, a filler component, a catalyst …
Who is the assignee on this patent?
Lawrence Livermore Nat Securty Llc, L Livermore Nat Security Llc
What technology area does this patent fall under?
Primary CPC classification B29C64/118. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).