System with field-assisted conductive adhesive bonds

Patent metadata

Field	Value
Publication number	US-9942986-B1
Application number	US-201715400677-A
Country	US
Kind code	B1
Filing date	Jan 6, 2017
Priority date	Sep 23, 2016
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.

First claim

What is claimed is:

1. An apparatus, comprising:
a first component having a first substrate with first metal contacts;
a second component having a second substrate with second metal contacts;
a polymer layer that attaches the first and second components together; and
conductive particles in the polymer layer, wherein the conductive particles have a first density overlapping the first contacts and have a second density overlapping gaps between the first contacts, and wherein the first density divided by the second density is at least five.

2. The apparatus defined in claim 1 wherein each conductive particle includes a dielectric core and a metal coating.

3. The apparatus defined in claim 1 wherein each conductive particle is a solid metal particle.

4. The apparatus defined in claim 1 wherein each of the first contacts includes a magnetic material.

5. The apparatus defined in claim 3 wherein each of the conductive particles includes a magnetic material.

6. The apparatus defined in claim 1 wherein each of the first contacts includes a copper layer and a metal coating on the copper layer.

7. The apparatus defined in claim 6 wherein the each of the first contacts includes a magnetic material and wherein the each of the conductive particles includes a magnetic material.

8. The apparatus defined in claim 7 wherein each of the conductive particles includes a dielectric core and wherein the magnetic material that is included in the conductive particle is a coating on the dielectric core.

9. The apparatus defined in claim 1 wherein the first substrate is a flexible polymer substrate and wherein the second substrate comprises a substrate selected from the group consisting of: a touch sensor substrate and a display substrate.

10. The apparatus defined in claim 9 wherein the first density divided by the second density is at least twenty.

11. The apparatus defined in claim 1 wherein each of the first metal contacts includes a metal material, wherein each of the conductive particles includes a magnetic material, and wherein the magnetic material in each of the first metal contacts is configured to align the conductive particles with the first metal contacts.

12. An apparatus, comprising:
a first substrate with first contacts;
a second substrate with second contacts;
a polymer layer that attaches the first and second substrates together; and
conductive particles in the polymer layer that short each of the first contacts to a respective one of the second contacts, wherein the conductive particles have a first density overlapping the first contacts and have a second density overlapping gaps between the first contacts and wherein the first density divided by the second density is at least ten.

13. The apparatus defined in claim 12 wherein each conductive particle comprises a conductive particle selected from the group consisting of: a conductive particle that includes a dielectric core and a metal coating and a solid metal particle without a coating.

14. The apparatus defined in claim 12 wherein the each conductive particle comprises a core covered with a metal coating.

15. The apparatus defined in claim 12 wherein the first contacts comprise a magnetic material.

16. The apparatus defined in claim 12 wherein the first substrate comprises a flexible polymer layer and wherein the second substrate comprises a display substrate.

17. The apparatus defined in claim 12 wherein the conductive particles each have at least one conductive layer.

18. The apparatus defined in claim 17 wherein the conductive layer comprises a conductive layer selected from the group consisting of: a magnetic material layer and a dielectric layer.

19. A method for forming an anisotropic conductive adhesive bond between first contacts on a first substrate and respective second contacts on a second substrate, wherein the first contacts include magnetic material, the method comprising:
dispensing a layer of conductive particles that include magnetic material on the first substrate;
concentrating the conductive particles on the first contacts using an electromagnetic field and the magnetic material in the first contacts; and
after concentrating the conductive particles, forming a solid polymer layer between the first and second substrates, wherein the solid polymer layer includes the conductive particles, wherein the solid polymer layer attaches the first substrate to the second substrate, and wherein each of the first contacts is shorted to a respective one of the second contacts by a respective portion of the conductive particles.

20. The method defined in claim 19 wherein concentrating the conductive particles comprises generating a magnetic field with a magnet.

21. The method defined in claim 19 wherein concentrating the conductive particles comprises applying a voltage to the first contacts with a signal source and wherein the voltage causes the first contacts to generate an electric field that attracts the conductive particles to the first contacts.

Assignees

• Apple Inc

Inventors

• Han Koohee
• Chen Hui
• Sung Kuo-Hua
• Liu Cyrus Y
• Tan To C

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K1/144 Primary

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K3/365

  by abutting, i.e. without alloying process · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title