Light-emitting dies incorporating wavelength-conversion materials and related methods

Patent metadata

Field	Value
Publication number	US-9941448-B2
Application number	US-201715647928-A
Country	US
Kind code	B2
Filing date	Jul 12, 2017
Priority date	Feb 5, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

First claim

What is claimed is:

1. An electronic device comprising:
a polymeric binder;
suspended within the polymeric binder, a semiconductor die having (i) a first face, (ii) a second face opposite the first face, and (iii) at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-detecting element comprising at least one semiconductor layer configured to absorb light over a detected wavelength range and produce electrical charge therefrom;
disposed on the first face of the semiconductor die, at least two spaced-apart contacts each (i) having a free terminal end not covered by the polymeric binder, and (ii) being available for electrical connection; and
a frame (i) having a bottom surface, (ii) having a top surface opposite the bottom surface, (iii) having a thickness spanning the top and bottom surfaces, and (iv) defining an aperture (a) extending fully through the thickness and (b) having a sidewall, the top surface of the frame surrounding the aperture,
wherein at least a portion of the polymeric binder is transparent to a wavelength of light within the detected wavelength range and the semiconductor die is disposed within the aperture of the frame such that (i) the second face of the semiconductor die is opposite the bottom surface of the frame, (ii) the sidewall of the aperture redirects light toward the semiconductor die, and (iii) the free terminal ends of the contacts of the semiconductor die are (a) not covered by the polymeric binder and (b) available for electrical connection.

2. The electronic device of claim 1 , wherein the polymeric binder contains therein a wavelength-conversion material for absorption of at least a portion of light incident on the electronic device and emission of converted light having a different wavelength.

3. The electronic device of claim 1 , wherein the polymeric binder comprises therein an absorbing material for absorption of at least a portion of the spectrum of light incident upon the electronic device.

4. The electronic device of claim 1 , wherein the semiconductor die comprises at least one of a bare-die photovoltaic cell, a bare-die infrared detector, a bare-die ultraviolet detector, a bare-die visible light detector, or a bare-die x-ray detector.

5. The electronic device of claim 1 , wherein the sidewall of the aperture is not perpendicular to the bottom surface of the frame.

6. The electronic device of claim 1 , wherein at least portions of the contacts protrude from the polymeric binder.

7. The electronic device of claim 1 , wherein the polymeric binder comprises at least one of silicone or epoxy.

8. The electronic device of claim 1 , further comprising an optical element positioned to couple light to the semiconductor die.

9. The electronic device of claim 1 , further comprising a first conductive pad electrically coupled to one of the two spaced-apart contacts and disposed over at least a portion of the bottom surface of the frame.

10. The electronic device of claim 1 , further comprising at least one of an active or passive electronic component disposed over or on the bottom surface of the frame.

11. The electronic device of claim 1 , wherein the frame comprises a semiconductor material, and at least one of an active or a passive electronic component is formed within or on the semiconductor material.

12. The electronic device of claim 1 , wherein the frame comprises at least one of a semiconductor, a plastic, a polymer, a glass, a ceramic, or a metal.

13. The electronic device of claim 1 , wherein the frame is substantially transparent to a wavelength of light within the detected wavelength range.

14. The electronic device of claim 2 , wherein substantially all of the light absorbed by the light-detecting element is converted light.

15. The electronic device of claim 2 , wherein the different wavelength of the converted light is within the detected wavelength range.

16. The electronic device of claim 2 , wherein the wavelength-conversion material comprises at least one of a phosphor or quantum dots.

17. The electronic device of claim 2 , wherein the polymeric binder comprises a plurality of discrete regions, at least one of which comprises the polymeric binder without wavelength-conversion material therein.

18. The electronic device of claim 2 , wherein at least a portion of the sidewall of the aperture is reflective to a wavelength of light within the detected wavelength range and/or light emitted by the wavelength-conversion material.

19. The electronic device of claim 18 , wherein the at least a portion of the sidewall of the aperture is coated with a reflective coating that is reflective to a wavelength of light within the detected wavelength range and/or light emitted by the wavelength-conversion material.

20. The electronic device of claim 9 , further comprising a second conductive pad (i) electrically coupled to the other of the two spaced-apart contacts, (ii) electrically insulated from the first conductive pad, and (iii) disposed over at least a portion of the bottom surface of the frame.

Assignees

• Tischler Michael A
• Amini Alborz
• Pinnington Thomas
• Ip Henry
• Spiga Gianmarco
• Cooledge Lighting Inc

Inventors

• Tischler Michael A
• Amini Alborz
• Pinnington Thomas
• Ip Henry
• Spiga Gianmarco

Classifications

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W90/00

  Package configurations · CPC title