Structural bonding compositions and attachment brackets, and their use in photovoltaic solar modules

Patent metadata

Field	Value
Publication number	US-9941441-B2
Application number	US-201515512942-A
Country	US
Kind code	B2
Filing date	Sep 23, 2015
Priority date	Sep 23, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

The present disclosure relates to structural bonding compositions and attachment brackets, and their use in photovoltaic solar modules. Another aspect of the present disclosure relates to methods of affixing an attachment bracket to a solar module during the lamination step used to manufacture the module.

First claim

We claim:

1. A method of affixing an attachment bracket to a solar module comprising:
providing a pre-lamination solar module comprising:
one or more photovoltaic cells each comprising a first major surface and a second major surface,
a glazing pane adjacent one of the major surfaces of the one or more photovoltaic cells,

providing an attachment bracket,
providing a thermosettable adhesive composition,
forming a solar module assembly by positioning the thermosettable adhesive composition between the glazing pane of the pre-lamination solar module and the attachment bracket, and
heating the solar module assembly, thereby forming a bond between the glazing pane and the attachment bracket via the thermosettable adhesive composition.

2. The method according to claim 1 , wherein the thermosettable adhesive composition comprises an intermediate bonding composition, wherein the intermediate bonding composition comprises:
a thermosettable epoxy composition comprising one or more epoxy resins, and
an acrylic composition comprising the polymerization reaction product of a mixture comprising:
an acrylic ester, and
a polymerizable monomer.

3. The method according to claim 2 , wherein the thermosettable epoxy composition comprises one or more epoxy resins each comprising di(glycidyl ether) of bisphenol A.

4. The method according to claim 2 , wherein the acrylic ester in the acrylic composition is chosen from n-butyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, dodecyl acrylate, lauryl acrylate, octadecyl acrylate, and mixtures thereof.

5. The method according to claim 2 , wherein the polymerizable monomer in the acrylic composition is chosen from isobornyl acrylate, N-vinyl pyrrolidone, N-vinyl caprolactam, N-vinyl piperidine, N,N-dimethylacrylamide, acrylonitrile, and mixtures thereof.

6. The method according to claim 2 , wherein the intermediate bonding composition further comprises one or more additives chosen from adhesion promoters, photoinitiators, acrylate crosslinking agent, hardeners, pigments, curative agents, curing accelerators, and fillers.

7. The method according to claim 2 , wherein the intermediate bonding composition comprises from 10% to 40% of the thermosettable epoxy composition by weight with respect to the total weight of the intermediate bonding composition.

8. The method according to claim 1 , wherein the thermosettable adhesive composition is a structural bonding tape.

9. The method according to claim 1 , wherein the thermosettable adhesive composition is a pressure sensitive adhesive.

10. The method according to claim 1 , wherein the thermosettable adhesive composition further comprises one or more support materials chosen from glass beads, glass bubbles, fibers, wires, non-woven scrims, and meshes.

11. The method according to claim 1 , wherein the solar module assembly shows bowing after 7 days in the glass panel bowing test from 0 mm to 2.5 mm.

12. The method according to claim 1 , wherein the thermosettable adhesive composition is a structural bonding tape and the structural bonding tape has a stress at 100% strain in the overlap shear stress strain test from 0 N/cm 2 to 150 N/cm 2 .

13. The method according to claim 1 , wherein the thermosettable adhesive composition is a structural bonding tape and the structural bonding tape has a pluck adhesion in the pluck adhesion test from 35 N/cm 2 to 350 N/cm 2 .

14. The method according to claim 1 , wherein the thermosettable adhesive composition is a structural bonding tape and the structural bonding tape has a storage modulus at 25° C. from 0.5 MPa to 30 MPa.

15. The method according to claim 1 , wherein the heating occurs at temperatures form 100° C. to 200° C.

Assignees

• 3M Innovative Properties Co

Inventors

• Anderson Cyrus A
• Duda Christopher J
• Meyer Scott R

Classifications

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J5/06 Primary

  involving heating of the applied adhesive · CPC title

• C09J2463/00

  Presence of epoxy resin · CPC title

• H01L31/18 Primary

  Electricity · mapped topic

• C09J2203/322

  for the production of solar panels · CPC title