Materials, systems and methods for optoelectronic devices
US-2016155882-A1 · Jun 2, 2016 · US
US9941316B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9941316-B2 |
| Application number | US-201514735866-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2015 |
| Priority date | Jun 10, 2014 |
| Publication date | Apr 10, 2018 |
| Grant date | Apr 10, 2018 |
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Various embodiments include methods and apparatuses for forming and using pixels for image sensors. In one embodiment, an image sensor is disclosed. The image sensor includes an optically sensitive material; a plurality of electrodes proximate the optically sensitive material, including at least a first electrode, a second electrode and a third electrode; and a charge store. The first electrode is coupled to the charge store, and the first electrode and the second electrode are configured to provide a bias to the optically sensitive material to direct photocarriers to the charge store. Other methods and apparatuses are disclosed.
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What is claimed is: 1. An image sensor, comprising: an integrated circuit comprising an array of readout circuits, defining respective pixels of the image sensor; a pixel electrode atop the integrated circuit in each of the pixels and electrically connected to a respective one of the readout circuits; a first biasing electrode atop the integrated circuit; an optically sensitive layer in electrical communication with the pixel electrodes and configured to generate photocarriers in response to light absorbed in the optically sensitive layer; a second biasing electrode atop the optically sensitive layer; and a bias circuit configured to apply an electrical potential between the first biasing electrode and the second biasing electrode with a polarity and amplitude selected so as to direct the photocarriers of one type from the optically sensitive layer into the pixel electrode in each of the pixels for readout by the respective one of the readout circuits. 2. The image sensor of claim 1 , wherein the first biasing electrode is in electrical communication with the optically sensitive layer. 3. The image sensor of claim 1 , wherein the second biasing electrode is in electrical communication with the optically sensitive layer. 4. The image sensor of claim 1 , wherein the first biasing electrode is configured to be at an electrical potential that lies between the electrical potential of the pixel electrode and the second biasing electrode. 5. The image sensor of claim 1 , wherein the first biasing electrode is electrically isolated from the optically sensitive layer. 6. The image sensor of claim 1 , wherein the photocarriers are of type electrons. 7. The image sensor of claim 1 , wherein the photocarriers are of type holes. 8. The image sensor of claim 1 , wherein the first and second biasing electrodes are disposed at locations selected so that the potential applied between the first biasing electrode and the second biasing electrode inhibits crosstalk between adjacent pixel electrodes.
by combining or binning pixels · CPC title
applied to dark current · CPC title
comprising storage means other than floating diffusion · CPC title
Electricity · mapped topic
Electricity · mapped topic
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