LED lead frame array for general illumination

Patent metadata

Field	Value
Publication number	US-9941258-B2
Application number	US-201414572911-A
Country	US
Kind code	B2
Filing date	Dec 17, 2014
Priority date	Dec 17, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

An LED lead frame assembly includes a circuit strip assembly, a plastic dam member overmolded onto the circuit strip assembly and a LED chip assembly disposed in a pocket of the plastic dam member. The LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.

First claim

What is claimed is:

1. An LED lead frame assembly, comprising:
a circuit strip assembly;
a plastic dam member configured to be overmoulded onto the circuit strip assembly, the plastic dam member including side members and a bottom member;
a pocket formed in a top surface of the bottom member; and
a LED chip assembly disposed in the pocket, wherein the LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly,
wherein the circuit strip assembly comprises a first conducting member, a second conducting member and a heat dissipation member, the first conducting member and the second conducting member configured to be connected to respective power connections of the LED chip assembly, the first conducting member having a first end and a second end, and the second conducting member having a first end and a second end, the first end of the first conducting member and the first end of the second conducting member configured to be connected to respective conducting members of a first adjacent LED lead frame assembly, and the second end of the first conducting member and the second end of the second conducting member are configured to be connected to respective conducting members of a second adjacent LED lead frame assembly, the first adjacent LED frame assembly being on an opposite side the LED lead frame assembly from the second adjacent LED frame assembly,
wherein the first conducting member, second conducting member, and the heat dissipation member extend completely through the plastic dam member of the first adjacent LED frame assembly and the second adjacent LED frame assembly.

2. The LED lead frame assembly of claim 1 , wherein the circuit strip assembly comprises a pair of electrically conducting members and a heat dissipation member, the LED chip assembly being electrically coupled to the electrically conducting members and thermally coupled to the heat dissipation member.

3. The LED lead frame assembly of claim 2 , wherein the plastic dam member electrically isolates the pair of electrically conducting members.

4. The LED lead frame assembly of claim 2 , wherein the electrically conducting members are disposed on a first plane within the plastic dam member and a top surface of the heat dissipation member is disposed on a second plane underneath the plastic dam member, wherein the first plane is in a different plane than the second plane.

5. The LED lead frame assembly of claim 2 , wherein the heat dissipation member is thermally coupled to a bottom of the plastic dam member below the pocket.

6. The LED lead frame assembly of claim 2 , wherein a bottom of the pocket of the plastic dam member includes an opening, and a top surface of the heat dissipation strip is disposed in the opening.

7. The LED lead frame assembly of claim 1 , wherein the plastic dam member comprises a thermal-set plastic.

8. The LED lead frame assembly of claim 1 , further comprising a heat dissipation member connected to a bottom of the plastic dam member, the heat dissipation member further configured to be connected to a bottom of the first adjacent LED lead frame assembly and a bottom of the second adjacent LED lead frame array assembly.

9. The LED frame assembly according to claim 1 , further comprising a heat dissipation member disposed along an outer surface of the bottom member of the plastic dam member and below the pocket.

10. The LED frame assembly according to claim 9 wherein the pocket includes a bottom portion, side portions and an open top, the bottom portion being thermally coupled to the heat dissipation member.

11. The LED frame assembly according to claim 1 , further comprising a heat dissipation member, wherein the plastic dam member is disposed on top of the heat dissipation member and the LED chip assembly is thermally coupled to the heat dissipation member.

12. The LED frame assembly according to claim 1 , wherein the circuit strip assembly comprises an anode conductor disposed on one side of the plastic dam member and a cathode conductor disposed on an opposite side of the plastic dam member, the anode conductor extending out of a first end and a second end of the plastic dam member on the one side and the cathode conductor extending out of the first end and the second end of the plastic dam on the other side.

13. A LED light, comprising:
a lighting fixture; and
an LED lead frame array attached directly to the lighting fixture, wherein the LED lead frame array comprises one more LED modules, wherein an LED module comprises:
a circuit strip assembly;
a plastic dam member configured to be overmoulded onto the circuit strip assembly, the plastic dam member including side members and a bottom member, the plastic dam member including a pocket formed in a top surface of the bottom member; and
a LED chip assembly disposed in the pocket of the plastic dam member, wherein the LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly,

wherein the circuit strip assembly comprises: an anode conductor disposed on one side of the plastic dam member; a cathode conductor disposed on an opposite side of the plastic dam member, the anode conductor extending out of a first end and a second end of the plastic dam member on the one side and the cathode conductor extending out of the first end and the second end of the plastic dam on the other side; and wherein: the cathode conductor extending out of the first end is configured to be electrically connected to a cathode conductor of a first adjacent LED module; the cathode conductor extending out of the second end is configured to be electrically connected to a cathode conductor of a second adjacent LED module; the anode conductor extending out of the first end is configured to be electrically connected to an anode conductor of the first adjacent LED module; and the anode conductor extending out of the second end is configured to be electrically connected to an anode conductor of the second adjacent LED module,
wherein the circuit strip assembly further comprises a heat dissipation member between the anode conductor and the cathode conductor,
wherein the anode conductor, the cathode conductor, and the heat dissipation member extend completely through the plastic dam member of the first adjacent LED module and the second adjacent LED module.

14. The LED light of claim 13 , wherein the circuit strip assembly comprises a pair of electrically conducting members and a heat dissipation member disposed underneath the bottom member of the plastic dam member, the LED chip assembly being electrically coupled to the electrically conducting members and thermally coupled to the heat dissipation member.

15. The LED light of claim 13 , wherein the lighting fixture comprises a heat sink and the LED lead frame array is attached to the heat sink.

16. The LED light of claim 13 , wherein the lighting fixture includes a channel, the channel being configured to receive the LED lead frame array.

17. The LED light according to claim 13 , further comprising a heat dissipation member, wherein the plastic dam member of the LED module is disposed on top of the heat dissipation member and the LED chip assembly of the LED module is thermally coupled to the heat dissipation member; and
wherein the heat dissipation member is configured to be disposed along and connected to a bottom of each plastic dam member, and thermally coupled to a bottom of the one or LED modules, in the LED frame array.

Assignees

• Ge Lighting Solutions Llc

Inventors

• Kong Ming
• Bisberg Jeffrey
• Powell John

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• F21V3/02

  characterised by the shape · CPC title

• F21K9/232 Primary

  specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb · CPC title

• F21S4/22

  flexible or deformable, e.g. into a curved shape · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title