Heat spreading module

Patent metadata

Field	Value
Publication number	US-9939204-B2
Application number	US-201615165518-A
Country	US
Kind code	B2
Filing date	May 26, 2016
Priority date	May 26, 2016
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

First claim

What is claimed is:

1. A heat spreading module comprising a heating portion, to which heat is transferred from an outside, disposed in a portion of a thin plate-shaped main body and dissipating the heat transferred to the heating portion from the heating portion into another portion in the main body, wherein:
a plurality of hollow paths is formed in the main body so as to pass though the heating portion, and the hollow paths communicate with each other in the heating portion;
a working fluid which evaporates by heating and condenses by heat dissipation is enclosed in the hollow paths;
a wick which generates a capillary force by permeation of the working fluid in a liquid phase is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths;
a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion; and
the wick comprises two thin wire bundles disposed along a longitudinal direction of each of the hollow paths and a porous body disposed between the thin wire bundles, and a thickness of the porous body is smaller than a height of each of the thin wire bundles and the porous body is recessed with respect to each of the thin wire bundles.

2. The heat spreading module according to claim 1 , wherein
the main body comprises an upper plate, a lower plate disposed facing the upper plate, and a middle plate sandwiched between the upper plate and the lower plate, in which a portion corresponding to at least one of the hollow paths is a penetrating portion.

3. The heat spreading module according to claim 2 , wherein
at least the upper plate and the lower plate among the upper plate, the lower plate, and the middle plate are formed of a clad material obtained by laminating copper plates on a front surface and a back surface of a stainless steel plate or an aluminum plate.

4. The heat spreading module according to claim 2 , wherein the height of each of the thin wire bundles and the thickness of the porous body are each thicknesses in a direction from the lower plate to the upper plate, and
the height of the thin wire bundles and a thickness of the porous body are each less than a shortest distance from the lower plate to the upper plate.

5. The heat spreading module according to claim 1 , wherein each hollow path extends in an alternate direction from the heating portion and is in communication with each other of the hollow paths at the heating portion,
each hollow path comprises at least one of the vapor flow paths which extend over the two thin wire bundles and the porous body in a direction of the main body in which the thickness of the porous body and the height of each of the thin wire bundles are arranged, and
each of the vapor flow paths is open to each other of the vapor flow paths at the heating portion.

6. The heat spreading module according to claim 1 , wherein the thin wire bundles and the porous body are in direct contact along a length of at least one of the plurality of hollow paths.

Assignees

• Fujikura Ltd

Inventors

• PHAN Thanhlong
• Kawahara Youji
• Yokoyama Yuichi
• Saito Yuji
• Ahamed Mohammad Shahed
• Mashiko Koichi

Classifications

• F28F21/085

  from copper or copper alloys · CPC title

• F28F21/089

  Coatings, claddings or bonding layers made from metals or metal alloys (F28F19/06 takes precedence) · CPC title

• F28F21/083

  from stainless steel · CPC title

• F28D2021/0028

  for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title

• F28D15/0283

  Means for filling or sealing heat pipes · CPC title