Method for enhancing bond strength through in-situ peening

Patent metadata

Field	Value
Publication number	US-9938624-B2
Application number	US-201415025427-A
Country	US
Kind code	B2
Filing date	Oct 17, 2014
Priority date	Oct 24, 2013
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

One embodiment includes a method for enhancing bond strength between a powder deposit and a substrate. Powder is deposited on the substrate. Powder is shot peened with peening media that is harder than both the powder and the substrate to produce bond strength between the powder and the substrate that is at least twice bond strength between the powder and the substrate without shot peening.

First claim

The invention claimed is:

1. A method comprising:
depositing a powder on a substrate to form a coating; and
shot peening the coating with a peening media that is harder than both the coating and the substrate to produce a bond strength between the coating and the substrate that is at least twice a bond strength between the coating and the substrate without shot peening;
wherein the depositing and the shot peening occur simultaneously and wherein a ratio of peening media to powder is varied as the coating is formed, the ratio being varied from comprising a majority of peening media initially to comprising a majority of powder with subsequent deposition.

2. The method of claim 1 further comprising:
mixing the powder and the peening media to form a mixture; and
directing the mixture at the substrate to simultaneously deposit the powder and shot peen.

3. The method of claim 1 , wherein the powder and the peening media are directed out of a supersonic nozzle.

4. The method of claim 1 further comprising:
controlling feed rate of powder delivered from a first hopper; and
controlling feed rate of peening media delivered from a second hopper.

5. The method of claim 1 wherein a peening media size distribution does not overlap a powder size distribution such that a smallest peening particle in the peening media size distribution is larger than a largest powder particle in the powder size distribution.

6. The method of claim 1 wherein the peening media comprises particles that do not fracture upon impact.

7. The method of claim 6 wherein the peening media comprises spherical or spheroidal shaped ceramic particles.

8. The method of claim 1 , wherein the initial mixture ratio of peening media to powder is at least 7.5:2.5.

9. The method of claim 1 , wherein the subsequent mixture ratio of peening media to powder is at most 2.5:7.5.

10. A method comprising:
depositing a powder on a substrate to form a coating layer; and
shot peening the coating layer with a peening media that is at least 1.5 times a hardness of the coating layer to cause an increase in densification of the coating layer:
wherein the depositing and the shot peening occur simultaneously and wherein a ratio of peening media to powder is varied as the coating is formed, the ratio being varied from comprising a majority of peening media initially to comprising a majority of powder with subsequent deposition.

11. The method of claim 10 wherein depositing powder comprises directing the powder out of a first supersonic nozzle toward the substrate, and shot peening the coating layer comprises directing the peening media out of a second supersonic nozzle toward the coating layer.

12. The method of claim 10 wherein depositing powder and shot peening comprise directing the powder and the peening media out of a common supersonic nozzle toward the substrate.

13. The method of claim 10 wherein a peening media size distribution does not overlap a powder size distribution such that a smallest peening particle in the peening media size distribution is larger than a largest powder particle in the powder size distribution.

14. The method of claim 10 wherein the peening media comprises particles that that do not fracture upon impact.

15. The method of claim 14 wherein the peening media comprises spherical or spheroidal shaped ceramic particles.

16. An article comprising:
a substrate;
a coating formed by simultaneously depositing a powder on the substrate to form a coating layer and shot peening the coating layer with a peening media that is harder than both the coating and the substrate, wherein a ratio of peening media to powder is varied as the coating is formed, the ratio being varied from comprising a majority of peening media initially to comprising a majority of powder with subsequent deposition; and
a bond between the coating and the substrate, the bond having a bond strength that is at least 50% of the lesser of a strength of the coating and a strength of the substrate.

17. The article of claim 16 wherein the substrate and the coating are both metal.

18. The article of claim 16 wherein the coating is a shot peened coating.

19. The article of claim 18 wherein the shot peened coating is formed by shot peening with a peening media that is harder than both the coating and the substrate.

Assignees

• United Technologies Corp

Inventors

• Nardi Aaron T
• El-Wardany Tahany Ibrahim
• Werkheiser William
• Klecka Michael A

Classifications

• C23C24/04 Primary

  Impact or kinetic deposition of particles · CPC title

• B24C1/10

  for compacting surfaces, e.g. shot-peening (for deforming sheet metal, tubes or profiles B21D31/06; as a metallurgical treatment C21D7/00, C22F1/00) · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title