Electronic device, liquid ejecting head, and electronic device manufacturing method

Patent metadata

Field	Value
Publication number	US-9937716-B2
Application number	US-201615273420-A
Country	US
Kind code	B2
Filing date	Sep 22, 2016
Priority date	Sep 25, 2015
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

An electronic device includes a plurality of substrates joined together in a stacked state, a space formed in one substrate out of the plurality of substrates, and a movable region configured by one face out of faces bounding the space. The movable region includes a recess indented from a space side to partway along a thickness direction of the movable region. An internal dimension of the recess in a direction perpendicular to a substrate stacking direction is larger than an internal dimension of the space in the direction perpendicular to the substrate stacking direction, and a wall bounding the space in the one substrate, and at least a portion of a bottom face of the recess, are adhered together by an adhesive.

First claim

What is claimed is:

1. An electronic device comprising:
a plurality of substrates joined together in a stacked state;
a space formed in a first substrate out of the plurality of substrates;
a movable region defined by a second substrate out of the plurality of substrates that is stacked on the first substrate and configured by a surface of the second substrate that forms a first face out of faces bounding the space;
the movable region including a recess indented from a space side to partway along a thickness direction of the movable region;
an internal dimension of the recess in a direction perpendicular to a substrate stacking direction being larger than an internal dimension of the space in the direction perpendicular to the substrate stacking direction; and
a wall defined by the first substrate and bounding the space and a portion of the recess, being adhered together by an adhesive.

2. The electronic device of claim 1 , wherein the adhesive between the first substrate and a third substrate out of the plurality of substrates that is joined to a face of the first substrate on the opposite side to the movable region side, and the adhesive adhering the wall and the recess together, are continuous to each other across the wall.

3. A liquid ejecting head comprising:
the electronic device of claim 2 ;
a pressure chamber formed in the one substrate as the space in communication with a nozzle that ejects a liquid; and
a piezoelectric element provided to displace the movable region bounding a portion of the pressure chamber.

4. The electronic device of claim 1 , wherein the adhesive is an organic compound containing an epoxide group.

5. A liquid ejecting head comprising:
the electronic device of claim 4 ;
a pressure chamber formed in the one substrate as the space in communication with a nozzle that ejects a liquid; and
a piezoelectric element provided to displace the movable region bounding a portion of the pressure chamber.

6. A liquid ejecting head comprising:
the electronic device of claim 1 ;
a pressure chamber formed in the one substrate as the space in communication with a nozzle that ejects a liquid; and
a piezoelectric element provided to displace the movable region bounding a portion of the pressure chamber.

Assignees

• Seiko Epson Corp

Inventors

• Mikoshiba Masanori
• Matsumoto Yasuyuki

Classifications

• B41J2002/14241

  having a cover around the piezoelectric thin film element · CPC title

• B41J2/045

  by pressure, e.g. electromechanical transducers · CPC title

• B41J2/1631

  photolithography · CPC title

• B41J2002/1425

  Embedded thin film piezoelectric element · CPC title

• B41J2/14209 Primary

  of finger type, chamber walls consisting integrally of piezoelectric material · CPC title