Laser processing machine

US9937590B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9937590-B2
Application numberUS-201113703723-A
CountryUS
Kind codeB2
Filing dateJul 21, 2011
Priority dateJul 22, 2010
Publication dateApr 10, 2018
Grant dateApr 10, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm ( 1 ) with a laser cutting head ( 2 ). Laser cutting head ( 2 ) includes nozzle receiving device ( 7 ) and nozzle (D). Via nozzle (D) laser beam ( 11 ) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm ( 1 ) and/or the laser cutting head ( 2 ) on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam ( 11 ). An adjusting station ( 3 ) includes receiving unit ( 31 ) fixing nozzle (D) and/or the nozzle receiving device ( 7 ) during centering of nozzle (D). The alignment unit has head element ( 5 B) in laser cutting head ( 2 ). Head element ( 5 B) receives nozzle (D) and/or the nozzle receiving device ( 7 ) and is slidable in X-Y directions, via the main drives. Head element ( 5 B) may be fixed in a selected position, within the laser cutting head ( 2 ), via clamping device ( 12 ) releasable during nozzle centering at adjusting station ( 3 ).

First claim

Opening claim text (preview).

What is claimed is: 1. A laser processing machine comprising: a work arm; a laser cutting head mounted on said work arm; a nozzle receiver arranged in said work arm; a nozzle configured to pass a laser beam, said nozzle connected to said nozzle receiver; an alignment unit for adjusting the laser beam relative to said nozzle, said alignment unit including a head arrangement receiving said nozzle receiver; an upper head section in said head arrangement; a nozzle adjusting station, said nozzle adjusting station including a nozzle receiving unit configured to fix said nozzle against movement; said alignment unit including a releasable clamping device configured to controllably release said nozzle for relative movement relative to said work arm and said laser cutting head; laser head main drives operatively connected to controllably move said work arm and said laser cutting head relative to said nozzle when said nozzle receiving unit fixes said nozzle against movement and said clamping device releases said nozzle, said laser head main drives operatively connected to controllably move said work arm, said laser cutting head, and said nozzle for laser processing of workpieces; and, a lower head section in said head arrangement, said lower head section including a laterally-slidable head piece connected to said nozzle receiver. 2. The laser processing machine as claimed in claim 1 , wherein: said head piece is a cylindrical-core piece connected to said nozzle receiver. 3. A laser processing machine as claimed in claim 1 , further comprising: said lower head section including an exterior housing operatively connected to said work arm through said upper head section, for movement with said work arm. 4. A laser processing machine as claimed in claim 1 , further comprising: said releasable clamping device including an annular piston, said annular piston being arranged in an axially-extending annular space and being moveable between, (a) a first position in which said annular piston fixes said laterally-slidable head piece, and (b) a second position in which said annular piston releases said laterally-slidable head piece. 5. A laser processing machine as claimed in claim 4 , further comprising: said annular piston is pneumatically biased to said second position; and, at least one clamping surface is connected to said annular piston to release said laterally-slidable head piece in said second position. 6. A laser processing machine as claimed in claim 4 , further comprising: said annular piston is spring-biased to said first position; and, at least one clamping surface is connected to said annular piston to clamp said laterally-slidable head piece in said first position. 7. A laser processing machine as claimed in claim 4 , further comprising: said annular piston is pneumatically biased to said second position, and a first clamping surface is connected to said annular piston to release said laterally-slidable head piece in said second position; said annular piston is spring-biased to said first position, and a second clamping surface is connected to said annular piston to clamp said laterally-slidable head piece in said first position; and, an interior flange of said annular piston forms said first and second clamping surfaces. 8. A laser processing machine as claimed in claim 7 , further comprising: said laterally-slidable head piece has an exterior flange, and said annular piston has an interior flange circumferentially spaced from said exterior flange. 9. A laser processing machine as claimed in claim 1 , further comprising: said releasable clamping device includes a clamping unit; and, said clamping unit includes at least one spring unit. 10. A laser processing machine as claimed in claim 9 , further comprising: said clamping unit includes three spring assemblies. 11. The laser processing machine as claimed in claim 1 , wherein: said laterally-slidable head piece is arranged with a radial play having value in the range of 1.0 to 5.0 mm. 12. The laser processing machine as claimed in claim 1 , wherein: said laterally-slidable head piece is integral with said nozzle receiver. 13. A laser processing machine as claimed in claim 1 , further comprising: a work table for receiving material to be processed. 14. A laser processing machine as claimed in claim 1 , further comprising: a camera system provided underneath said nozzle receiving unit of said nozzle adjusting station, said camera system having a target for laser beam, said camera system having a removable absorption plate, and said camera system having a camera. 15. A laser processing machine as claimed in claim 14 , further comprising: an image processing unit operatively communicating with said camera to process laser penetration hole images. 16. A laser processing machine beam alignment system comprising: a work arm; a laser cutting head mounted on said work arm; a nozzle receiver arranged in said work arm; a nozzle configured to pass a laser beam, said nozzle connected to said nozzle receiver; an alignment unit for adjusting the laser beam relative to said nozzle, said alignment unit including a head arrangement receiving said nozzle receiver; an upper head section in said head arrangement; laser head main drives operatively connected to controllably move said work arm and said head arrangement in an X-Y coordinate space relative to said nozzle when said nozzle receiving unit fixes said nozzle against movement and said clamping device releases said nozzle, said laser head main drives operatively connected to controllably move said work arm, said laser cutting head, and said nozzle for laser processing of workpieces; a nozzle adjustment station disposed in the X-Y coordinate space, said nozzle adjustment station having a nozzle receiving unit fixing said nozzle against movement in the X-Y coordinate space; said alignment unit including a releasable clamping device configured to controllably release said head arrangement for controlled X-Y coordinate positioning alignment by said at least one main laser head drive, relative to said work arm and said nozzle fixed in said nozzle adjustment station; and a lower head section in said head arrangement, said lower head section including a laterally-slidable head piece connected to said nozzle receiver. 17. A laser processing machine beam alignment system as claimed in claim 16 , further comprising: a laterally-slidable head piece included in said releasable clamping device; said releasable clamping device including an annular piston, said annular piston being arranged in an axially-extending annular space and being moveable between, (a) a first position in which said annular piston fixes said laterally-slidable head piece, and (b) a second position in which the said annular piston releases said laterally-slidable head piece.

Assignees

Inventors

Classifications

  • Automatically aligning the laser beam · CPC title

  • with aligning, guiding, or instruction · CPC title

  • Maintenance of nozzles · CPC title

  • Beam measuring devices · CPC title

  • along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9937590B2 cover?
Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm ( 1 ) with a laser cutting head ( 2 ). Laser cutting head ( 2 ) includes nozzle receiving device ( 7 ) and nozzle (D). Via nozzle (D) laser beam ( 11 ) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm ( 1 ) and/or the laser cutting hea…
Who is the assignee on this patent?
Cathry Daniel, Imboden Ernest, Bugmann Tobias, and 3 more
What technology area does this patent fall under?
Primary CPC classification B23K26/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).