Printed circuit board

Patent metadata

Field	Value
Publication number	US-9936571-B2
Application number	US-201514843115-A
Country	US
Kind code	B2
Filing date	Sep 2, 2015
Priority date	Sep 2, 2015
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

A PCB includes a PCB body at least including a first metal layer, a second metal layer, and a first ground layer sandwiched therebetween; and a pair of transmission lines including a first transmission line conductor and a second transmission line conductor. The first transmission line conductor is located in the first metal layer which has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends which are located in the first metal layer and a cross-via structure at the middle which has a buried trace buried in the second metal layer, and the curved line section and the buried trace are isolated by the first ground layer. Skew effect of the differential transmission circuit is reduced, thereby improving the signal transmission quality and improve signal transmission speed.

First claim

What is claimed is:

1. A printed circuit board comprising:
a printed circuit board body including at least a first metal layer, a second metal layer formed below the first metal layer, and a first ground layer sandwiched between the first metal layer and the second metal layer; and
a pair of transmission lines provided to transmit differential signals, the pair of transmission lines including a first transmission line conductor and a second transmission line conductor;
wherein the first transmission line conductor is located in the first metal layer, the first transmission line conductor has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends and a cross-via structure including a buried trace at its middle, and the curved line section of the first transmission line conductor and the buried trace of the cross-via structure of the second transmission line conductor are isolated by the first ground layer, wherein the total physical length of the first transmission line conductor is longer than that of the second transmission line conductor.

2. A printed circuit board comprising:
a printed circuit board body including at least a first metal layer, a second metal layer formed below the first metal layer, and a first ground layer sandwiched between the first metal layer and the second metal layer; and
a pair of transmission lines provided to transmit differential signals, the pair of transmission lines including a first transmission line conductor and a second transmission line conductor;
wherein the first transmission line conductor is located in the first metal layer, the first transmission line conductor has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends and a cross-via structure including a buried trace at its middle, and the curved line section of the first transmission line conductor and the buried trace of the cross-via structure of the second transmission line conductor are isolated by the first ground layer, wherein the curved line section serving as a delay line is roughly S-shaped with two curved portions.

3. The printed circuit board according to claim 2 , wherein the cross-via structure of the second transmission line conductor comprises two via pins extended from the first metal layer to the second metal layer without contacting the first ground layer, and the buried trace of the second transmission line conductor connects the two via pins.

4. The printed circuit board according to claim 3 , wherein two first cut-out regions are formed on the first ground layer to accept the via pins, and a second cut-out region is formed on the second metal layer to accept the buried trace, and the area of each first cut-out region is smaller than that of the second cut-out region.

5. The printed circuit board according to claim 4 , further comprising a second ground layer under the second metal layer, and several grounding paths extending from the first ground layer to the second ground layer under the second metal layer, connecting to the second metal layer outside the second cut-out region, and located around the second cut-out region.

6. The printed circuit board according to claim 4 , wherein a region of the ground layer located on the first ground layer and between the two first cut-out regions is not hollowed.

7. The printed circuit board according to claim 2 , wherein the total physical length of the first transmission line conductor is longer than that of the second transmission line conductor.

8. The printed circuit board according to claim 2 , further comprising multiple inner layers formed between the first ground layer and the second metal layer, and a support layer.

9. A printed circuit board comprising:
a printed circuit board body including at least a first metal layer, a first ground layer formed below the first metal layer, and a bottom layer formed below the first ground layer; and
a pair of transmission lines provided to transmit differential signals, the pair of transmission lines including a first transmission line conductor and a second transmission line conductor;
wherein the first transmission line conductor is located in the first metal layer, the first transmission line conductor has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends and a cross-via structure at its middle, the two straight line sections of the second transmission line conductors are located in the first metal layer, the cross-via structure of the second transmission line conductor has a trace located in an outer surface of the bottom layer of the printed circuit board body, and the curved line section of the first transmission line conductor and the trace of the cross-via structure of the second transmission line conductor are isolated by the first ground layer, wherein the curved line section serving as a delay line is roughly S-shaped with two curved portions.

10. The printed circuit board according to claim 9 , wherein the printed circuit board body further comprises a second metal layer sandwiched between the first ground layer and the bottom layer.

Assignees

• Sae Magnetics Hk Ltd

Inventors

• Lam Fuk Ming

Classifications

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0245 Primary

  Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

• H05K1/0215

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K1/0248

  Skew reduction or using delay lines · CPC title

• H05K2201/09245

  Crossing layout · CPC title