Semiconductor device and fault detecting method

Patent metadata

Field	Value
Publication number	US-9935577-B2
Application number	US-201615098052-A
Country	US
Kind code	B2
Filing date	Apr 13, 2016
Priority date	Jun 30, 2015
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

A method of detecting a fault of a semiconductor device including a power device mounted on a metal base and a drive circuit for driving the power device, the method detecting a fault of the semiconductor device beforehand based on an increase in thermal resistance between the metal base and the power device. A state of the power device is measured immediately before and after the power device is driven by the drive circuit. A temperature difference of the power device before and after driving is calculated according to the result of measurement. An increase in thermal resistance between the metal base and the power device is detected based on the temperature difference and an amount of electricity inputted to the power device in the driving period, and a fault of the semiconductor device is detected beforehand according to the increase.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a power device mounted on a metal base;
a drive circuit for driving the power device;
a measuring circuit that measures a state of the power device immediately before and after a driving period in which the drive circuit drives the power device; and
a control circuit that detects, according to a result of the measurement by the measuring circuit, an increase in a thermal resistance between the metal base and the power device based on a temperature difference before and after the driving of the power device and an input power to the power device in the driving period,
wherein the drive circuit drives the power device in response to a driving signal with pulse width modulation, a condition is specified by a parameter including a duty ratio of the pulse width modulation, and the input power is calculated based on a power supply voltage applied to the power device, an amplitude and a frequency of the driving signal, and the duty ratio, and
wherein the control circuit detects that the increase in the thermal resistance has reached at least a predetermined value, and then the control circuit reduces at least one of the duty ratio, the amplitude and the frequency of the driving signal to reduce a capability of driving the power device by the drive circuit.

2. The semiconductor device according to claim 1 , wherein the control circuit causes the drive circuit to perform the driving on the condition that the input power is set at the predetermined value.

3. The semiconductor device according to claim 1 , wherein the measuring circuit measures a voltage applied to the power device and a current passing through the power device in the driving period, and supplies a measurement result to the control circuit, and the control circuit calculates the input power from the measurement result.

4. The semiconductor device according to claim 3 , wherein the current includes an on current when the power device is turned on, and the voltage includes an on voltage and an off voltage of the power device.

5. The semiconductor device according to claim 1 , wherein the measuring circuit includes a temperature sensor that is provided in or next to the power device, and the temperature difference is calculated from a value measured by the temperature sensor.

6. The semiconductor device according to claim 2 , wherein the predetermined value includes a first predetermined value,
wherein the measurement of the state of the power device by the measuring circuit immediately before and after the driving period involves additional driving of the power device by the drive circuit on a condition that the input power is set at a second predetermined value smaller than the first predetermined value, and
wherein the control circuit calculates the temperature difference based on a measurement result of the state of the power device by the measuring circuit immediately before and after the driving period.

7. The semiconductor device according to claim 1 , wherein the power device includes an insulated gate bipolar transistor.

8. The semiconductor device according to claim 1 , wherein the control circuit detects that the increase in the thermal resistance has reached at least the predetermined value, and then the control circuit reduces the capability of driving the power device by the drive circuit.

9. The semiconductor device according to claim 8 , wherein the power device includes an insulated gate bipolar transistor, the drive circuit drives, for the power device, a gate electrode of the insulated gate bipolar transistor in response to a driving signal with pulse width modulation.

10. The semiconductor device according to claim 1 , wherein the power device mounted is on a metal base through a solder layer disposed on a surface of a metal pattern that is located between the power device and the metal base, and
wherein the input power is provided to the power device through a wire connected to the surface of the metal pattern.

11. The semiconductor device according to claim 10 , wherein, between the power device and the metal base, an insulating substrate is disposed on another surface of the metal pattern and another metal pattern is disposed between the insulating substrate and the metal base, and
wherein the thermal resistance between the metal base and the power device includes thermal resistances of the power device, the solder layer, the metal pattern, the insulating substrate, said another metal pattern, and the metal base.

12. A method of detecting a fault of a semiconductor device comprising a power device mounted on a metal base and a drive circuit for driving the power device, the method comprising:
measuring a state of the power device immediately before and after a driving period in which the drive circuit drives the power device;
detecting, by a control circuit, according to a result of the measurement, an increase in a thermal resistance between the metal base and the power device based on a temperature difference before and after the driving of the power device and an input power to the power device in the driving period; and
detecting the fault of the semiconductor device beforehand based on the increase in the thermal resistance between the metal base and the power device,
wherein the drive circuit drives the power device in response to a driving signal with pulse width modulation, a condition is specified by a parameter including a duty ratio of the pulse width modulation, and an amount of electricity is calculated based on a power supply voltage applied to the power device, an amplitude and a frequency of the driving signal, and the duty ratio, and
wherein the control circuit detects that the increase in the thermal resistance has reached at least a predetermined value, and then the control circuit reduces at least one of the duty ratio, the amplitude and the frequency of the driving signal to reduce a capability of driving the power device by the drive circuit.

13. The method of detecting a fault according to claim 12 , wherein the driving is performed on the condition that the input power is set at the predetermined value, and
wherein the increase in the thermal resistance is detected based on the temperature difference and the predetermined value.

14. The method of detecting a fault according to claim 12 , wherein a voltage applied to the power device and a current passing through the power device are measured in the driving period, and the input power is calculated from a result of the measurement.

15. The method of detecting a fault according to claim 14 , wherein the current includes an on current when the power device is turned on, and the voltage includes an on voltage and an off voltage of the power device.

16. The method of detecting a fault according to claim 12 , wherein the semiconductor device includes a temperature sensor that is provided in or next to the power device, and the temperature difference is calculated from a value measured by the temperature sensor.

17. The method of detecting a fault according to claim 13 , wherein the predetermined value includes a first predetermined value,
wherein the measurement of the state of the power device by the measuring circuit immediately before and after the driving period involves additional driving of the power device by the drive circuit on a condition that the input power is set at a second predetermined value smaller than the first predetermined value, and
wherein the temperature difference is calculated based on a measurement result of the state of the power device

Assignees

• Renesas Electronics Corp

Inventors

• Bito Katsutoshi
• Iijima Daisuke
• Takehara Yuji

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title