Electronic component for guiding a magnetic field

Patent metadata

Field	Value
Publication number	US-9934900-B2
Application number	US-201214354127-A
Country	US
Kind code	B2
Filing date	Oct 22, 2012
Priority date	Oct 25, 2011
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

An electronic component for guiding a magnetic field comprises a core ( 20 ) of a magnetizable material, which has at least two spaced-apart legs ( 11 a, 11 b ) with opposing surfaces (O 11 a , O 11 b ) separated from one another by a gap (S). The component comprises at least one compressible molding ( 20 ), which is arranged compressed in the gap (S), the at least one molding ( 20 ) being in contact with the respective surfaces (O 11 a , O 11 b ) of the at least two spaced-apart legs ( 11 a, 11 b ).

First claim

The invention claimed is:

1. An electronic component for guiding a magnetic field, comprising:
a core ( 10 ) of a magnetizable material, which has at least two spaced-apart legs ( 11 a , 11 b ) with opposing surfaces (O 11 a , O 11 b ) separated from one another by a gap (S); and
at least one compressible and prefabricated molding ( 20 ), being cut out from a material web, which is arranged compressed in the gap (S), the at least one molding ( 20 ) being in contact with the respective surfaces (O 11 a , O 11 b ) of the at least two spaced-apart legs ( 11 a , 11 b ),
wherein the surface of the molding ( 20 ) is tacky and the molding ( 20 ) is arranged in a self-adhesive manner on the respective surfaces (O 11 a , O 11 b ) of the at least two spaced-apart legs ( 11 a , 11 b ),
wherein the at least one molding ( 20 ) has a thickness in the non-compressed state that is greater than a spacing (D) between the respective surfaces (O 11 a , O 11 b ) of the at least two spaced-apart legs ( 11 a , 11 b ),
wherein the at least one molding ( 20 ) includes a base material from silicone, acrylic or polyurethane and a filler material mixed in with the base material,
wherein the filler material comprises stone, sand or quartz,
wherein by admixing the filler material with the base material, the thermal expansion of the at least one molding ( 20 ) is adapted to the thermal expansion of other parts of the electronic component, and
wherein the filler material has a configuration which provides for energy conversion of a mechanical movement of the legs ( 11 a , 11 b ) and for noise damping during the activation of the electronic component by an electronic signal.

2. The electronic component according to claim 1 , the molding ( 20 ) including a carrier material, which has a greater strength than the base material, the base material being arranged on the carrier material.

3. The electronic component according to claim 1 , the filler material further comprising at least one of an industrial filler, an organic filler, or a silicon compound.

4. The electronic component according to claim 3 , comprising:
a coil former ( 40 ) with a wire winding ( 50 , 60 );
the core ( 10 ) having at least two legs ( 12 a , 13 a , 12 b , 13 b ) that are in contact at their end faces,
the core ( 10 ) comprising a first part-body ( 10 a ), which has the leg ( 11 a ) of the at least two spaced-apart legs and the leg ( 12 a , 13 a ) of the at least two in-contact legs, and a second part-body ( 10 b ), which has the other leg ( 11 b ) of the at least two spaced-apart legs and the other leg ( 12 b , 13 b ) of the at least two in-contact legs,
the second part-body ( 10 a ) being arranged on the first part-body ( 10 b ),
the coil former ( 40 ) being arranged partly on the leg of the at least two spaced-apart legs ( 11 a ) and partly on the other leg ( 11 b ) of the at least two spaced-apart legs.

5. The electronic component according to claim 3 ,
wherein the industrial filler comprises glass, ceramic or glass-ceramic.

Assignees

• Epcos Ag

Inventors

• Bichler Martin

Classifications

• Y10T29/4902

  Electromagnet, transformer or inductor · CPC title

• H01F3/14 Primary

  Constrictions; Gaps, e.g. air-gaps (in magnetic shunt paths H01F3/12) · CPC title

• H01F27/33

  Arrangements for noise damping · CPC title

• H01F41/02

  for manufacturing cores, coils, or magnets (H01F41/14 takes precedence; for dynamo-electric machines H02K15/00) · CPC title

• H01F27/263

  Fastening parts of the core together · CPC title