Electronic component case and electronic component device

Patent metadata

Field	Value
Publication number	US-9933822-B2
Application number	US-201615083396-A
Country	US
Kind code	B2
Filing date	Mar 29, 2016
Priority date	Sep 27, 2013
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

First claim

What is claimed is:

1. An electronic component case, comprising:
a lower case including
a bottom plate,
a side wall,
an engaging projection formed on an outer face of the side wall, and
a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, wherein a cavity hole which is opened in an outer surface side of the bottom plate is formed in an inner part of the substrate positioning projection; and

an upper case including
a top plate,
a side wall in which an engaging hole is formed, and
a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, wherein a cavity hole which is opened in an outer surface side of the top plate is formed in an inner part of the substrate pushing projection, wherein

when an electronic component is to be housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and
the engaging projection of the lower case is engaged to the engaging hole of the upper case.

2. An electronic component device, comprising:
a lower case including
a bottom plate,
a side wall,
an engaging projection formed on an outer face of the side wall, and
a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, wherein a cavity hole which is opened in an outer surface side of the bottom plate is formed in an inner part of the substrate positioning projection,

an upper case including
a top plate,
a side wall in which an engaging hole is formed, and
a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, a cavity hole which is opened in an outer surface side of the top plate is formed in an inner part of the substrate pushing projection, and

an electronic component housed between the lower case and the upper case, wherein
when the electronic component is housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and
the engaging projection of the lower case is engaged to the engaging hole of the upper case.

3. An electronic component case, comprising:
a lower case including
a bottom plate,
a side wall,
an engaging projection formed on an outer face of the side wall, and
a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side; and

an upper case including
a top plate,
a side wall in which an engaging hole is formed, and
a substrate positioning projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, wherein

when an electronic component is to be housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and
the engaging projection of the lower case is engaged to the engaging hole of the upper case,
wherein
the substrate positioning projection of the lower case has a large diameter portion located to a lower side and a small diameter portion located to an upper side,
the substrate pushing projection of the upper case has a concave portion formed from a tip to an inner part of the substrate pushing projection, and
the small diameter portion of the substrate positioning projection is inserted in the datum hole of the substrate of the electronic component, and a tip of the small diameter portion is arranged in the concave portion of the substrate pushing projection.

4. An electronic component device, comprising:
a lower case including
a bottom plate,
a side wall,
an engaging projection formed on an outer face of the side wall, and
a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, and

an upper case including
a top plate,
a side wall in which an engaging hole is formed, and
a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, and

an electronic component housed between the lower case and the upper case, wherein
when the electronic component is housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and
the engaging projection of the lower case is engaged to the engaging hole of the upper case,
wherein
the substrate positioning projection of the lower case has a large diameter portion located to a lower side and a small diameter portion located to an upper side,
the substrate pushing projection of the upper case has a concave portion formed from a tip to an inner part of the substrate pushing projection, and
the small diameter portion of the substrate positioning projection is inserted in the datum hole of the substrate of the electronic component, and a tip of the small diameter portion is arranged in the concave portion of the substrate pushing projection.

Assignees

• Shinko Electric Ind Co

Inventors

• Tan Minshong
• Aoki Syuzo
• Oda Takuya

Classifications

• G06F1/183

  Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title

• G06F1/181 Primary

  Enclosures (for portable computers G06F1/1613) · CPC title

• H05K5/0008

  Electricity · mapped topic

• H05K5/13 Primary

  assembled by screws · CPC title