Display module and multi-display device having the same

Patent metadata

Field	Value
Publication number	US-9933644-B2
Application number	US-201414547693-A
Country	US
Kind code	B2
Filing date	Nov 19, 2014
Priority date	Jun 19, 2014
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

A display module for a multi-display device includes an array substrate, connectors disposed on the array substrate and configured to transmit signals for driving the array substrate, a printed circuit board (PCB) electrically connected to the connectors and configured to transmit signals to the connectors, and connecting members that extend through the array substrate and configured to electrically connect the connectors and the PCB.

First claim

What is claimed is:

1. A multi-display device, comprising:
a first array substrate;
a second array substrate disposed adjacent to the first array substrate;
first connectors disposed on the first array substrate and configured to transmit signals for driving the first array substrate;
second connectors disposed on the second array substrate and configured to transmit signals for driving the second array substrate;
a printed circuit board (PCB) configured to electrically connect and transmit signals to the first connectors and the second connectors;
first connecting members penetrating through the first array substrate and configured to electrically connect the first connectors and the PCB; and
second connecting members penetrating through the second array substrate and configured to electrically connect the second connectors and the PCB,
wherein:
the first and second array substrates each comprises a display region and a non-display region surrounding the display region; and
the first and second connectors are disposed only in the non-display region of the first and second array substrates, respectively.

2. The multi-display device of claim 1 , further comprising:
a driver IC chip disposed on the PCB.

3. The multi-display device of claim 1 , wherein the first connectors and the second connectors are disposed on opposite sides, respectively, of the first array substrate and the second array substrate.

4. The multi-display device of claim 1 , wherein the PCB is disposed along a boundary between the first array substrate and the second array substrate.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Jong Seong
• Kim Sang Ii
• Kim Tae Hwan

Classifications

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/10128

  Display · CPC title

• G02F1/13336 Primary

  Combining plural substrates to produce large-area displays, e.g. tiled displays · CPC title