Probe card and method for performing an unclamped inductive switching test using multiple equal-length interconnection lines emanating from a common connection node

Patent metadata

Field	Value
Publication number	US-9933476-B2
Application number	US-201514817829-A
Country	US
Kind code	B2
Filing date	Aug 4, 2015
Priority date	Aug 5, 2014
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

A probe card with a ground contact, a first contact element and a second contact element is provided. The first contact element is coupled to an interconnection node via a first interconnection line having a definite length and the second contact element is coupled to the interconnection node via a second interconnection line having the same definite length. The interconnection node is directly connected to the ground contact.

First claim

The invention claimed is:

1. A probe card, comprising:
a ground contact;
an interconnection node directly connected to the ground contact;
a first contact element configured to contact a first contact pad on a wafer, the first contact element coupled to the interconnection node via a first interconnection line having a definite length;
a second contact element configured to contact a second contact pad on the wafer, the second contact element coupled to the interconnection node via a second interconnection line having the same definite length as the first interconnection line;
a third contact element configured to contact the first contact pad on the wafer and coupled to a first probe card terminal so as to provide electrical connection external to the probe card; and
a fourth contact element configured to contact the second contact pad on the wafer and coupled to a second probe card terminal so as to provide electrical connection external to the probe card.

2. The probe card of claim 1 , further comprising:
a driver circuit coupled to the ground contact within the probe card and having a driver output, wherein said driver output is coupled to a control contact element that is configured to contact a control contact pad on the wafer.

3. The probe card of claim 1 , wherein the first interconnection line comprises a first resistor having a definite resistance and the second interconnection line comprises a second resistor having the same definite resistance.

4. The probe card of claim 3 , wherein the definite resistance is between 25 Ohm and 60 Ohm.

5. The probe card of claim 1 , wherein the first and the third contact elements form a first pair of contact elements configured to contact the first contact pad on the wafer, the second and the fourth contact elements form a second pair of contact elements configured to contact the second contact pad on the wafer, and the probe card further comprises additional pairs of contact elements,
wherein each additional pair is configured to contact an additional contact pad on the wafer,
wherein each additional pair comprises a first additional contact element and a second additional contact element, and
wherein the first additional contact element of each additional pair is coupled to the interconnection node via an additional interconnection line having the same definite length as the first interconnection line.

6. The probe card of claim 5 , comprising at least seven pairs of contact elements configured to contact at least seven separate contact pads on the wafer.

7. The probe card of claim 1 , wherein the first and the second contact elements are sense needles.

8. The probe card of claim 1 , wherein the third and the fourth contact elements are force needles.

9. The probe card of claim 1 , wherein the third and the fourth contact elements are configured to carry a current of about 5 Amperes.

10. The probe card of claim 1 , wherein the definite length is between 2 cm and 20 cm.

11. A probe card, comprising:
a ground contact;
an interconnection node directly connected to the ground contact;
a first contact element configured to contact a first contact pad on a wafer, the first contact element coupled to the interconnection node via a first interconnection line having a definite length;
a second contact element configured to contact a second contact pad on the wafer, the second contact element coupled to the interconnection node via a second interconnection line having the same definite length as the first interconnection line; and
a driver circuit coupled to the ground contact within the probe card and having a driver output, wherein said driver output is configured to contact a control contact pad on the wafer.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Leutschacher Michael
• Rieser Norbert

Classifications

• G01R1/0408

  Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets (G01R1/067 takes precedence; mass production testing systems G01R31/59; testing of connections G01R31/66; for testing printed circuit boards G01R31/2808) · CPC title

• G01R31/2621 Primary

  for testing field effect transistors, i.e. FET's · CPC title

• G01R31/2601

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title