Thermal flow meter

Patent metadata

Field	Value
Publication number	US-9933292-B2
Application number	US-201715653360-A
Country	US
Kind code	B2
Filing date	Jul 18, 2017
Priority date	Jun 15, 2012
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721 , which is used to hold and fix a circuit package 400 with respect to a housing 302 , to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721 , whereby the circuit package 400 is held by and fixed to the housing 302 . In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721 , on the circuit package 400 , the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710 . Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.

First claim

The invention claimed is:

1. A flow meter comprising:
a processing unit configured to processing a signal of a flow sensing element;
a circuit package molding the processing unit with a first resin,
wherein a part of the circuit package is molded with a second resin, a thermal expansion coefficient of the second resin is larger than that of the first resin,
wherein the second resin comprising a thick portion and a thin portion that is thinner than the thick portion, the thin portion is formed closer to the processing unit than the thick portion.

2. The flow meter according to claim 1 , wherein
an area of a surface of the circuit package where the thin portion covers the circuit package is larger than that of the circuit package where the thick portion covers the circuit package.

3. The flow meter according to claim 1 , further comprising:
A bypass passage in which the flow sensing element is disposed, and
wherein the thick portion and the thin portion fix the flow sensing element in the bypass passage.

4. The flow meter according to claim 1 , wherein
the first resin is thermosetting and the second resin is thermoplastic.

5. The method for forming the flow meter according to claim 1 , comprising:
a first molding process in which the circuit package is formed by molding with the first resin,
a second molding process in which the part of the circuit package is molded with the second resin, after the first molding process.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Tashiro Shinobu
• Hanzawa Keiji
• Tokuyasu Noboru
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira

Classifications

• G01F1/698

  Feedback or rebalancing circuits, e.g. self heated constant temperature flowmeters · CPC title

• G01F15/14

  Casings, e.g. of special material · CPC title

• G01F1/6842 Primary

  with means for influencing the fluid flow · CPC title

• F02D41/187

  using a hot wire flow sensor · CPC title

• G01F1/696

  Circuits therefor, e.g. constant-current flow meters · CPC title