Illumination apparatus

Patent metadata

Field	Value
Publication number	US-9933149-B2
Application number	US-201514691594-A
Country	US
Kind code	B2
Filing date	Apr 21, 2015
Priority date	Jan 15, 2015
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

An illumination apparatus includes a thermal conductivity substrate, a package carrier, at least one light emitting element, at least one wire, a light transmission cap, a first sealing ring and a second sealing ring. The package carrier is disposed on an upper surface of the thermal conductivity substrate and has an opening exposing a portion of the upper surface. The light emitting element is disposed on the upper surface exposed by the opening and is electrically connected to the package carrier by wire. The light transmission cap is disposed above the thermal conductivity substrate. The first sealing ring is disposed between the light transmission cap and the package carrier. The second sealing ring is disposed between the package carrier and the thermal conductivity substrate. The thermal conductivity substrate, the light transmission cap, the first and the second sealing rings and the package carrier encapsulate the light emitting element.

First claim

What is claimed is:

1. An illumination apparatus, comprising:
a thermal conductivity substrate having an upper surface;
a package carrier disposed on the upper surface of the thermal conductivity substrate and having an opening, the opening exposing a portion of the upper surface of the thermal conductivity substrate, wherein the package carrier comprises at least one insulating layer, a plurality of conductive layers, and a solder mask layer, the insulating layer and the conductive layers are alternatively stacked up, the solder mask layer exposes a part of one conductive layer to define at least one bonding pad;
at least one light emitting element disposed on the upper surface of the thermal conductivity substrate exposed by the opening of the package carrier;
at least one bonding wire electrically connecting the light emitting element to the package carrier, wherein a terminal of the bonding wire is disposed on the bonding pad;
a light transmission cap disposed above the thermal conductivity substrate, wherein the light emitting element and the package carrier are located between the light transmission cap and the thermal conductivity substrate;
a first seal ring disposed between the light transmission cap and the package carrier; and
a second seal ring disposed between the package carrier and the thermal conductivity substrate, wherein the thermal conductivity substrate, the light transmission cap, the first seal ring, the second seal ring and the package carrier completely seal the light emitting element.

2. The illumination apparatus as recited in claim 1 , wherein the thermal conductivity substrate comprises a heat spreader or a heat dissipation plate.

3. The illumination apparatus as recited in claim 1 , wherein the first seal ring and the second seal ring are respectively O-shaped rings.

4. The illumination apparatus as recited in claim 1 , wherein the light transmission cap comprises a light transmission cap portion and a flat portion connected to the light transmission cap portion, and the light transmission cap portion is disposed correspondingly to the light emitting element.

5. The illumination apparatus as recited in claim 4 , further comprising:
a cover comprising a top portion and a plurality of side portions connected to the top portion, wherein the top portion is disposed on the flat portion of the light transmission cap;
a heat dissipation fin set disposed on a lower surface of the thermal conductivity substrate, the lower surface being opposite to the upper surface, and the side portions of the cover being fixed on the heat dissipation fin set; and
an electric wire electrically connected to the package carrier and located among the first seal ring, the second seal ring and the cover.

6. The illumination apparatus as recited in claim 5 , wherein a material of the cover comprises a metal or a plastic.

7. The illumination apparatus as recited in claim 5 , comprising:
a wire fixing structure penetrating through the package carrier and located among the first seal ring, the second seal ring and the cover, wherein the electric wire is stored by the wire fixing structure.

8. The illumination apparatus as recited in claim 7 , wherein the wire fixing structure comprises a wire fixing terminal portion and a wire storage portion, one terminal of the electric wire is plugged in the wire fixing terminal portion and another terminal of electric wire passes through the wire storage portion and the cover.

9. The illumination apparatus as recited in claim 1 , wherein one of the conductive layers that is closest to the thermal conductivity substrate has a rough surface structure and the rough surface structure contacts with the thermal conductivity substrate.

10. An illumination apparatus, comprising:
a thermal conductivity substrate having an upper surface;
a package carrier disposed on the upper surface of the thermal conductivity substrate and having an opening, the opening exposing a portion of the upper surface of the thermal conductivity substrate, wherein the package carrier comprises at least one insulating layer, a plurality of conductive layers, and a solder mask layer, the insulating layer and the conductive layers are alternatively stacked up, the solder mask layer exposes a part of one conductive layer to define at least one bonding pad;
at least one light emitting element disposed on the upper surface of the thermal conductivity substrate exposed by the opening of the package carrier;
at least one bonding wire electrically connecting the light emitting element to the package carrier, wherein a terminal of the bonding wire is disposed on the bonding pad;
a light transmission cap disposed above the thermal conductivity substrate, wherein the light emitting element and the package carrier are located between the light transmission cap and the thermal conductivity substrate;
a first seal ring disposed between the light transmission cap and the package carrier;
a second seal ring disposed between the package carrier and the thermal conductivity substrate, wherein the thermal conductivity substrate, the light transmission cap, the first seal ring, the second seal ring and the package carrier completely seal the light emitting element; and
a wire fixing structure penetrating through the package carrier and located among the first seal ring, the second seal ring and a cover, wherein an electric wire is stored by the wire fixing structure, wherein the wire fixing structure comprises a wire fixing terminal portion and a wire storage portion, one terminal of the electric wire is plugged in the wire fixing terminal portion and another terminal of electric wire passes through the wire storage portion and the cover.

11. An illumination apparatus, comprising:
a thermal conductivity substrate having an upper surface and a lower surface being opposite to the upper surface;
a package carrier disposed on the upper surface of the thermal conductivity substrate and having an opening, the opening exposing a portion of the upper surface of the thermal conductivity substrate, wherein the package carrier comprises at least one insulating layer, a plurality of conductive layers, and a solder mask layer, the insulating layer and the conductive layers are alternatively stacked up, the solder mask layer exposes a part of one conductive layer to define at least one bonding pad;
at least one light emitting element disposed on the upper surface of the thermal conductivity substrate exposed by the opening of the package carrier;
at least one bonding wire electrically connecting the light emitting element to the package carrier, wherein a terminal of the bonding wire is disposed on the bonding pad;
a light transmission cap disposed above the thermal conductivity substrate, wherein the light emitting element and the package carrier are located between the light transmission cap and the thermal conductivity substrate, wherein the light transmission cap comprises a light transmission cap portion and a flat portion connected to the light transmission cap portion, and the light transmission cap portion is disposed correspondingly to the light emitting element;
a first seal ring disposed between the light transmission cap and the package carrier;
a second seal ring disposed between the package carrier and the thermal conductivity substrate, wherein the thermal conductivity substrate, the light transmission cap, the first seal ring, the second seal ring and the package carrier completely seal the light emitting element;
a cover comprising a top portion and a plurality of side portions connected to the top portion, wherein the top portion is disposed on the flat portion of the light transmission cap

Assignees

• Subtron Technology Co Ltd

Inventors

• Tseng Tzyy-Jang
• Shen Tzu-Shih

Classifications

• F21V31/005 Primary

  Sealing arrangements therefor · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V27/02

  Cable inlets · CPC title

• F21V29/85

  characterised by the material (liquid coolants F21V29/56) · CPC title

• F21V29/70

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title