Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition

Patent metadata

Field	Value
Publication number	US-9932473-B2
Application number	US-201615075227-A
Country	US
Kind code	B2
Filing date	Mar 21, 2016
Priority date	Mar 31, 2015
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

An encapsulating resin composition contains a thermosetting resin component, a curing accelerator, an inorganic filler, an ion trapping agent, and an aromatic monocarboxylic acid having one or more electron-withdrawing functional groups selected from a nitro group and a cyano group. The encapsulating resin composition is solid at 25° C., and has a sulfur content, measured by X-ray fluorescence analysis, of 0.1 mass % or less in terms of SO 3 .

First claim

What is claimed is:

1. An encapsulating resin composition comprising:
a thermosetting resin component;
a curing accelerator;
an inorganic filler;
an ion trapping agent; and
an aromatic monocarboxylic acid having an aromatic ring, one carboxyl group directly bonded to the aromatic ring, and one or more electron-withdrawing functional groups selected from a nitro group and a cyano group and directly bonded to the aromatic ring, wherein:
the encapsulating resin composition is solid at 25° C., and has a sulfur content, measured by X-ray fluorescence analysis, of 0.025 mass % or less in terms of SO 3 ,
the ion trapping agent includes at least one of a hydrotalcite ion trapping agent and an aluminum-magnesium ion trapping agent, and
with respect to a whole amount of the encapsulating resin composition, a content of the aromatic monocarboxylic acid is in a range from 0.001 mass % to 0.6 mass %, inclusive, and a content of the ion trapping agent is in a range from 0.05 mass % to 0.6 mass %, inclusive.

2. The encapsulating resin composition according to claim 1 ,
wherein the thermosetting resin component contains at least one component selected from the group consisting of epoxy resin, cyanate ester resin, benzoxazine resin, and maleimide resin.

3. The encapsulating resin composition according to claim 1 ,
wherein the thermosetting resin component contains epoxy resin, and at least one component of a phenol compound, benzoxazine resin, acid anhydride, and an imidazole compound.

4. The encapsulating resin composition according to claim 1 ,
wherein the thermosetting resin component is free from a nitro group.

5. The encapsulating resin composition according to claim 1 ,
wherein the ion trapping agent contains a carbonate ion or a hydroxide ion.

6. The encapsulating resin composition according to claim 1 ,
wherein a pH value of the encapsulation resin composition is in a range from 5.0 to 7.5, inclusive.

7. A method for manufacturing a semiconductor device, the method comprising:
preparing the encapsulating resin composition as defined in claim 1 ; and
molding the encapsulating resin composition by a pressure-molding process to produce an encapsulation resin encapsulating a semiconductor element,
wherein the semiconductor element is mounted on a lead frame, and electrically coupled to the lead frame by a wire.

8. The method for manufacturing a semiconductor device according to claim 7 ,
wherein when the encapsulating resin composition is molded by a pressure-molding process, a molding pressure is 3.0 MPa or more and a molding temperature is 120° C. or more.

9. The encapsulating resin composition according to claim 1 , wherein the thermosetting resin component contains epoxy resin.

10. The encapsulating resin composition according to claim 9 , wherein a content of the epoxy resin is in a range from 5 mass % to 35 mass %, inclusive, with respect to a whole amount of the encapsulating resin composition.

11. The encapsulating resin composition according to claim 9 , wherein the epoxy resin contains at least one of biphenyl aralkyl-type epoxy resin and biphenyl-type epoxy resin.

12. The encapsulating resin composition according to claim 1 , wherein a content of the inorganic filler is in a range from 60 mass % to 93 mass %, inclusive, with respect to a whole amount of the encapsulating resin composition.

13. The encapsulating resin composition according to claim 1 ,
wherein the aromatic monocarboxylic acid includes at least one selected from the group consisting of 2-nitrobenzoic acid, 3-nitrobenzoic acid, 4-nitrobenzoic acid, 3-methyl-4-nitrobenzoic acid, 2-methyl-3-nitrobenzoic acid, 4-methyl-3-nitrobenzoic acid, 2-methyl-6-nitrobenzoic acid, 3-methyl-2-nitrobenzoic acid, 2-methyl-5-nitrobenzoic acid, 5-methyl-2-nitrobenzoic acid, 2-cyanobenzoic acid, 3-cyanobenzoic acid, 4-cyanobenzoic acid, 4-hydroxy-3-nitrobenzoic acid, 5-hydroxy-2-nitrobenzoic acid, 3-hydroxy-4-nitrobenzoic acid, 3-hydroxy-2-nitrobenzoic acid, 2-hydroxy-4-nitrobenzoic acid, and 2-hydroxy-5-nitrobenzoic acid.

14. The encapsulating resin composition according to claim 1 ,
wherein the aromatic monocarboxylic acid includes at least one selected from the group consisting of 3-nitrobenzoic acid, 2-methyl-3-nitrobenzoic acid, and 3-cyanobenzoic acid.

15. A semiconductor device comprising:
a lead frame;
a semiconductor element mounted on the lead frame; and
a wire electrically connecting the semiconductor element to the lead frame;
wherein the semiconductor element is encapsulated by the encapsulating resin composition as defined in claim 1 .

16. The semiconductor device according to claim 15 ,
wherein the lead frame has a plated layer including at least one component of silver, nickel, and palladium.

17. The semiconductor device according to claim 15 ,
wherein the wire includes at least one of copper and silver.

18. The semiconductor device according to claim 15 , wherein pH of the encapsulating resin composition is in a range from 5.0 to 7.5, inclusive.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Iwatani Emi
• Ogawa Kazuto
• Ishikawa Kota
• Tsuji Takayuki

Classifications

• H10W72/522

  Multilayered bond wires, e.g. having a coating concentric around a core · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title