Photosensitive resin composition and cured article of same, and optical component

US9932439B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9932439-B2
Application numberUS-201415023174-A
CountryUS
Kind codeB2
Filing dateSep 16, 2014
Priority dateSep 18, 2013
Publication dateApr 3, 2018
Grant dateApr 3, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A photosensitive resin composition comprising components as follows: (A) a cationically polymerizable compound at least comprising a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; (C) a light-shielding material; and (D) a hydroxyl-containing compound having a molecular weight of 500 or more, wherein the component (D) comprises at least one of a hydroxyl-containing compound having a polycarbonate skeleton in the molecule, a hydroxyl-containing compound having a polyester skeleton in the molecule, or a hydroxyl-containing compound having a polydiene skeleton in the molecule. 2. The photosensitive resin composition according to claim 1 , wherein the compound containing an alicyclic epoxy group and devoid of ester bonds in the component (A) is a compound represented by Formula (a-1): wherein R 1 to R 18 are identical or different and are independently selected from the group consisting of a hydrogen atom, a halogen atom, a hydrocarbon group optionally containing at least one of oxygen and halogen, and an optionally substituted alkoxy group; and X is selected from a single bond and a linkage group, excluding ester-bond-containing linkage groups. 3. The photosensitive resin composition according to claim 2 , wherein the anionic moiety of the component (B) is an anion represented by Formula (1): [Chem. 2] [(R) n BF 4−n ] −   (1) wherein R represents a monovalent hydrocarbon group or a monovalent fluorinated hydrocarbon group; and n represents an integer from 1 to 4. 4. The photosensitive resin composition according to claim 2 , wherein the anionic moiety of the component (B) is an anion represented by Formula (2): wherein X1 to X4 are identical or different, each represent an integer from 0 to 5, and the total of all of X1 to X4 is one or more. 5. The photosensitive resin composition according to claim 2 , wherein the component (C) is a carbon black. 6. A cured product of the photosensitive resin composition according to claim 2 . 7. The photosensitive resin composition according to claim 1 , wherein the anionic moiety of the component (B) is an anion represented by Formula (1): [Chem. 2] [(R) n BF 4−n ] −   (1) wherein R represents a monovalent hydrocarbon group or a monovalent fluorinated hydrocarbon group; and n represents an integer from 1 to 4. 8. The photosensitive resin composition according to claim 7 , wherein the anionic moiety of the component (B) is an anion represented by Formula (2): wherein X1 to X4 are identical or different, each represent an integer from 0 to 5, and the total of all of X1 to X4 is one or more. 9. The photosensitive resin composition according to claim 7 , wherein the component (C) is a carbon black. 10. A cured product of the photosensitive resin composition according to claim 7 . 11. The photosensitive resin composition according to claim 1 , wherein the anionic moiety of the component (B) is an anion represented by Formula (2): wherein X1 to X4 are identical or different, each represent an integer from 0 to 5, and the total of all of X1 to X4 is one or more. 12. The photosensitive resin composition according to claim 11 , wherein the component (C) is a carbon black. 13. A cured product of the photosensitive resin composition according to claim 11 . 14. The photosensitive resin composition according to claim 1 , wherein the component (C) is a carbon black. 15. A cured product of the photosensitive resin composition according to claim 14 . 16. A cured product of the photosensitive resin composition according to claim 1 . 17. An optical component comprising the cured product according to claim 16 .

Assignees

Inventors

Classifications

  • Carbon · CPC title

  • C08G59/24Primary

    carbocyclic · CPC title

  • Light absorbing elements · CPC title

  • Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes · CPC title

  • Optical elements characterised by the material of which they are made; Optical coatings for optical elements · CPC title

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What does patent US9932439B2 cover?
Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a com…
Who is the assignee on this patent?
Daicel Corp
What technology area does this patent fall under?
Primary CPC classification C08G59/24. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 03 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).