Method and apparatus for scoring thin glass and scored thin glass
US-2016185647-A1 · Jun 30, 2016 · US
US9931757B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9931757-B2 |
| Application number | US-201213688382-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 29, 2012 |
| Priority date | Jul 23, 2012 |
| Publication date | Apr 3, 2018 |
| Grant date | Apr 3, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a display device by using a cell cutting device that includes a fixing unit, a cutter, a cutter driving unit, a buffer member, and a support member, the method comprising: positioning a first surface of a mother substrate adjacent to the cutter, the mother substrate including a plurality of cells for forming display devices; moving the fixing unit toward the cutter in a first direction parallel with the first surface of mother substrate in a state where the mother substrate is fixed to the fixing unit; disposing the buffer member on a second surface of the mother substrate that is opposite to the first surface, the buffer member being disposed directly opposite the cutter, the buffer member being interposed between the second surface and the support member, a portion of the support member that faces the buffer member having a width in the first direction that is smaller than a width of the mother substrate in the first direction; and cutting and separating the cells of the mother substrate by repeatedly moving the cutter in a thickness direction of the mother substrate by driving the cutter driving unit, the buffer member directly underlying the cutter when the cutter repeatedly moves in the thickness direction of the mother substrate, wherein: the cutter includes a blade having a length that is equal to or greater than a width of the mother substrate in a second direction orthogonal to the first direction, the blade contacting the entire width of the mother substrate at one time at a start of the cutting and cutting the entire width of the mother substrate through one cutting process, and the buffer member has a width that is equal to or greater than the length of the cutter, and the buffer member has a width in the first direction that is greater than that of the support member. 2. The method of claim 1 , further comprising: providing a display panel on the mother substrate; disposing a first protective film on a first surface of the display panel; and disposing a second protective film on a second surface of the display panel, the second surface being opposite the first surface. 3. The method of claim 2 , further comprising performing a cutting process for forming cutting recesses in the first protective film without affecting the display panel by controlling movement of the cutter. 4. The method of claim 3 , wherein each of the cells on the mother substrate is formed to include a pad unit, and the method further includes removing the protective film disposed on the pad unit by using the cutting recesses. 5. The method of claim 2 , wherein the display panel includes: a display panel substrate; a first electrode disposed on the display panel substrate; an intermediate layer disposed on the first electrode; and a second electrode disposed on the intermediate layer. 6. The method of claim 5 , wherein the display panel substrate is formed to include a flexible material. 7. The method of claim 1 , wherein the buffer member is a flexible mat. 8. The method of claim 1 , wherein the buffer member is movable relative to the support member by a roll-to-roll operation using a supply roll and a recovery roll.
With receptacle or support for cut product · CPC title
wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work · CPC title
On sheet material · CPC title
With work-constraining means on work conveyor [i.e., "work-carrier"] · CPC title
With means to orient or position work carrier relative to tool station · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.