Flexible interconnect

Patent metadata

Field	Value
Publication number	US-9930773-B2
Application number	US-201615188453-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	Jun 21, 2016
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

First claim

The invention claimed is:

1. A flexible circuit element, comprising:
a flexible insulating support structure;
a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure; the solid metal trace comprising a gap in the region of the solid metal trace configured to repeatedly flex;
a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device, the liquid metal conductor bridging the gap in the region of the solid metal trace; and
an encapsulate at least partially encapsulating the liquid metal conductor.

2. The flexible circuit element of claim 1 , wherein the solid metal trace extends fully between the first connector and the second connector.

3. The flexible circuit element of claim 1 , wherein the solid metal trace comprises a core material and a barrier material between the core material and the liquid metal.

4. The flexible circuit element of claim 1 , wherein the liquid metal conductor comprises a gallium alloy.

5. The flexible circuit element of claim 1 , further comprising a plurality of solid metal traces extending between the first connector and the second connector, each solid metal trace of the plurality of solid metal traces having a respective segment of liquid metal conductor disposed in contact with the solid metal trace.

6. The flexible circuit element of claim 1 , wherein the liquid metal conductor extends fully between the first connector and the second connector.

7. The flexible circuit element of claim 1 , wherein the flexible circuit element is installed in a device comprising a first electrical component and a second electrical component, the flexible circuit element extending between the first electrical component and the second electrical component.

8. A flexible circuit element configured to couple a first electrical component and a second electrical component, the flexible circuit element comprising:
a flexible, non-stretchable insulating support structure comprising a channel formed in a surface; and
an electrical trace formed on the support structure, the electrical trace extending between a first connector located at a first location on the support structure and a second connector located at a second location on the support structure, and the electrical trace being formed at least partially from a liquid metal conductor, wherein the liquid metal conductor extends a portion of a length of the solid metal along the trace, and wherein the liquid metal conductor is disposed in the channel.

9. The flexible circuit element of claim 8 , wherein the electrical trace comprises a solid metal with a liquid metal disposed over and in contact with at least a portion of the solid metal.

10. The flexible circuit element of claim 9 , wherein the liquid metal comprises a gallium alloy, and wherein the solid metal comprises copper.

11. The flexible circuit element of claim 8 , further comprising an encapsulant at least partially encapsulating the liquid metal.

12. A method of manufacturing a flexible circuit element the method comprising:
forming, on a flexible support structure, a solid metal trace in contact with a liquid metal conductor, such that the solid metal trace and the liquid metal conductor form a conductive path along the flexible support structure to electrically connect a first electrical connector of a flexible circuit element and a second electrical connector of the flexible circuit element; and
forming an encapsulating layer over the liquid metal conductor.

13. The method of claim 12 , wherein the liquid metal conductor is deposited in a channel formed in the encapsulating layer.

14. The method of claim 12 , wherein the liquid metal conductor is deposited after the solid metal trace.

15. A flexible circuit element, comprising:
a flexible insulating support structure;
a solid metal trace extending fully between a first connector and a second connector on the flexible insulating support structure;
a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device, wherein the liquid metal conductor comprises a gallium alloy; and
an encapsulant at least partially encapsulating the liquid metal conductor.

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Holbery James David
• Ma Siyuan
• Dickey Michael David

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/0283

  Stretchable printed circuits · CPC title

• H05K1/0281 Primary

  Reinforcement details thereof · CPC title

• H05K1/0272 Primary

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K2201/09009

  Substrate related · CPC title