Transversely-excited film bulk acoustic resonator with a back-side dielectric layer
US-2024396526-A1 · Nov 28, 2024 · US
US9929714B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9929714-B2 |
| Application number | US-201414251637-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 13, 2014 |
| Priority date | Apr 13, 2014 |
| Publication date | Mar 27, 2018 |
| Grant date | Mar 27, 2018 |
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The dominant frequency of a solidly mounted resonator ( 100/280/300/400 ) is substantially increased by reducing the thickness of each layer of each Bragg acoustic reflector ( 112/160/224/274 ) to have a thickness than is substantially equal to one-quarter of the wavelength of a frequency that is a higher harmonic resonant frequency of the fundamental resonant frequency of the solidly mounted resonator ( 100/280/300/400 ).
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What is claimed is: 1. A solidly mounted resonator (SMR) comprising: a substrate; a lower Bragg acoustic reflector that touches the substrate, the lower Bragg acoustic reflector having alternating layers of a low-acoustic material and a high-acoustic material, each layer of material within the lower Bragg acoustic reflector having a thickness substantially equal to one-quarter of a wavelength of a frequency that is a higher harmonic resonant frequency of a fundamental resonant frequency of the SMR; a lower electrode that touches the lower Bragg acoustic reflector; a piezoelectric structure that touches the lower electrode, wherein the piezoelectric structure has a thickness substantially equal to one-half of the wavelength of the fundamental resonant frequency of the SMR; and an upper electrode that touches the piezoelectric structure. 2. The SMR of claim 1 and further comprising an upper Bragg acoustic reflector that touches the upper electrode, the upper Bragg acoustic reflector having alternating layers of a low-acoustic material and a high-acoustic material, each layer of material within the upper Bragg acoustic reflector having a thickness substantially equal to one-quarter of the wavelength of the frequency that is the higher harmonic resonant frequency of the fundamental resonant frequency of the SMR. 3. The SMR of claim 2 and further comprising: a lower isolation layer that lies between and touches the lower Bragg acoustic reflector and the lower electrode; and an upper isolation layer that lies between and touches the upper electrode and the upper Bragg acoustic reflector. 4. The SMR of claim 2 and further comprising an isolation layer that lies between and touches the piezoelectric structure and the upper electrode. 5. The SMR of claim 2 , wherein the piezoelectric structure includes a material selected from a list of materials that includes AlN, ZnO, and PZT. 6. The SMR of claim 5 wherein the low-acoustic material is selected from a list of materials that includes MSQ, SiO 2 , and HSQ. 7. The SMR of claim 6 wherein the high-acoustic material is selected from a list of materials that includes SiC, Si-DLC, and DLC. 8. A method of forming a solidly mounted resonator (SMR) comprising: forming a lower Bragg acoustic reflector to touch a substrate, the lower Bragg acoustic reflector having alternating layers of a low-acoustic material and a high-acoustic material, each layer of material within the lower Bragg acoustic reflector having a thickness substantially equal to one-quarter of a wavelength of a frequency that is a higher harmonic resonant frequency of a fundamental resonant frequency of the SMR; forming a lower electrode that touches the lower Bragg acoustic reflector; forming a piezoelectric structure that touches the lower electrode; wherein the piezoelectric structure has a thickness substantially equal to one-half of the wavelength of the fundamental resonant frequency of the SMR; and forming an upper electrode that touches the piezoelectric structure. 9. The method of claim 8 and further comprising forming an upper Bragg acoustic reflector that touches the upper electrode, the upper Bragg acoustic reflector having alternating layers of a low-acoustic material and a high-acoustic material, each layer of material within the upper Bragg acoustic reflector having a thickness substantially equal to one-quarter of the wavelength of the frequency that is the higher harmonic resonant frequency of the fundamental resonant frequency of the SMR. 10. The method of claim 9 and further comprising: forming a lower isolation layer that lies between and touches the lower Bragg acoustic reflector and the lower electrode; and forming an upper isolation layer that lies between and touches the upper electrode and the upper Bragg acoustic reflector. 11. The method of claim 9 and further comprising forming an isolation layer that lies between and touches the piezoelectric structure and the upper electrode. 12. The method of claim 8 , wherein the piezoelectric structure includes a material selected from a list of materials that includes AlN, ZnO, and PZT. 13. The method of claim 12 wherein the low-acoustic material is selected from a list of materials that includes MSQ, SiO 2 , and HSQ. 14. The method of claim 13 wherein the high-acoustic material is selected from a list of materials that includes SiC, Si-DLC, and DLC. 15. A solidly mounted resonator (SMR) comprising: a substrate; a lower Bragg acoustic reflector that touches the substrate, the lower Bragg acoustic reflector having alternating layers of a low-acoustic material and a high-acoustic material, each layer of material within the lower Bragg acoustic reflector having a thickness substantially equal to one-quarter of a wavelength of a frequency that is a higher harmonic resonant frequency of a fundamental resonant frequency of the SMR; a lower isolation layer that touches the lower Bragg acoustic reflector; a lower electrode that touches the lower isolation layer; a piezoelectric structure that touches the lower electrode, wherein the piezoelectric structure has a thickness substantially equal to one-half of the wavelength of the fundamental resonant frequency of the SMR; an upper electrode that touches the piezoelectric structure; an upper isolation layer that touches the upper electrode; and an upper Bragg acoustic reflector that touches the upper isolation layer, the upper Bragg acoustic reflector having alternating layers of a low-acoustic material and a high-acoustic material, each layer of material within the upper Bragg acoustic reflector having a thickness substantially equal to one-quarter of the wavelength of the frequency that is a higher harmonic resonant frequency of the fundamental resonant frequency of the SMR. 16. The SMR of claim 15 , wherein the piezoelectric structure includes a material selected from a list of materials that includes AlN, ZnO, and PZT. 17. The SMR of claim 16 wherein: the low-acoustic material is selected from a list of materials that includes MSQ, SiO 2 , and HSQ; and the high-acoustic material is selected from a list of materials that includes SiC, Si-DLC, and DLC. 18. The SMR of claim 1 , wherein the higher harmonic resonant frequency is a non-integer multiple of the fundamental resonant frequency. 19. The SMR of claim 8 , wherein the higher harmonic resonant frequency is a non-integer multiple of the fundamental resonant frequency. 20. The SMR of claim 15 , wherein the higher harmonic resonant frequency is a non-integer multiple of the fundamental resonant frequency.
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