Systems for module interfacing of modular mobile electronic devices

Patent metadata

Field	Value
Publication number	US-9929515-B2
Application number	US-201514834199-A
Country	US
Kind code	B2
Filing date	Aug 24, 2015
Priority date	Aug 22, 2014
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A module interface of a modular electronic device includes a data interface, coupled to a module communication network of the modular electronic device, that enables data transfer between the module communication network and modules coupled to the data interface; a power interface, coupled to a module power network of the modular electronic device, that enables power transfer between the module power network and modules coupled to the power interface; and a mechanical interface, coupled to a chassis of the modular mobile electronic device, that enables modules to be removably and mechanically coupled to the modular electronic device.

First claim

We claim:

1. A module interface of a modular electronic device comprising:
a data interface, coupled to a module communication network of the modular electronic device, that enables data transfer between the module communication network and modules coupled to the data interface, wherein the data interface comprises a first set of conductive contacts, and wherein data transfer between the module communication network and the modules coupled to the data interface is enabled by conductive coupling between the first set of contacts and the modules coupled to the data interface;
a power interface, coupled to a module power network of the modular electronic device, that enables power transfer between the module power network and modules coupled to the power interface, wherein the power interface comprises a second set of conductive contacts, and wherein power transfer between the module power network and the modules coupled to the power interface is enabled by conductive coupling between the second set of contacts and the modules coupled to the power interface; and
a mechanical interface, coupled to a chassis of the modular electronic device, that enables a plurality of modules to be removably and mechanically coupled to the modular electronic device, wherein the mechanical interface includes mechanical rails that aid in module retention through friction, wherein the mechanical interface includes an electropermanent magnet that aids in module retention, and wherein the electropermanent magnet is coupled to the modular electronic device by EPM circuitry, the EPM circuitry comprising a voltage booster and a capacitor.

2. The module interface of Claim 1 , further comprising conductive coupling circuitry coupled to a wake/detect contact of the first set of conductive contacts, the conductive coupling circuitry including two voltage comparators.

3. The module interface of claim 2 , wherein the first set of conductive contacts and the second set of conductive contacts comprise flexible metal pins that deform temporarily when the module interface is coupled to a module.

4. The module interface of claim 1 , wherein the first set of conductive contacts and the second set of conductive contacts comprise flexible metal pins that deform temporarily when the module interface is coupled to a module.

5. The module interface of claim 1 , wherein the data interface comprises a set of inductive coupling pads and inductive coupling circuitry; wherein the set of inductive coupling pads is coupled to the module communication network by the inductive coupling circuitry; wherein data transfer between the module communication network and modules coupled to the data interface is enabled by inductive coupling between the set of inductive coupling pads and the modules coupled to the data interface.

6. The module interface of claim 5 , wherein the set of inductive coupling pads is coupled to the module communication network by a set of tuned LC circuits.

7. The module interface of Claim 1 , wherein the data interface comprises a set of capacitive coupling pads and capacitive coupling circuitry; wherein the set of capacitive coupling pads is coupled to the module communication network by the capacitive coupling circuitry; wherein data transfer between the module communication network and modules coupled to the data interface is enabled by capacitive coupling between the set of capacitive coupling pads and the modules coupled to the data interface.

8. The module interface of claim 7 , wherein the capacitive coupling circuitry comprises switched transmit/receive circuitry; wherein the capacitive coupling circuitry enables both transmission and reception of data for a capacitive coupling pad of the set of capacitive coupling pads.

9. A module interface of a module comprising:
a data interface, coupled to the module, that enables data transfer between the module and a module communication network of a modular electronic device coupled to the data interface;
a power interface, coupled to the module, that enables power transfer between the module and a module power network of the modular electronic device coupled to the power interface; and
a mechanical interface, coupled to the module, that enables the module to be removably and mechanically coupled to a modular electronic device comprising a plurality of removable modules, wherein the mechanical interface includes mechanical rails that aid in module retention through friction, wherein the mechanical interface includes an electropermanent magnet that aids in module retention, wherein the electropermanent magnet is coupled to the module by EPM circuitry, the EPM circuitry comprising a voltage booster and a capacitor.

10. The module interface of claim 9 , wherein the data interface comprises a first set of conductive contacts; wherein data transfer between the module communication network and the module is enabled by conductive coupling between the first set of contacts and the modular electronic device; wherein the power interface comprises a second set of conductive contacts; wherein power transfer between the module power network and the module is enabled by conductive coupling between the second set of contacts and the modular electronic device.

11. The module interface of claim 10 , wherein the first set of conductive contacts and the second set of conductive contacts comprise flexible metal pins that deform temporarily when the module interface is coupled to the modular electronic device.

12. The module interface of claim 9 , wherein the data interface comprises a set of inductive coupling pads and inductive coupling circuitry; wherein the set of inductive coupling pads is coupled to the module by the inductive coupling circuitry; wherein data transfer between the module communication network and the module is enabled by inductive coupling between the set of inductive coupling pads and the modular electronic device.

13. The module interface of claim 12 , wherein the set of inductive coupling pads is coupled to the module by a set of tuned LC circuits.

14. The module interface of claim 9 , wherein the data interface comprises a. set of capacitive coupling pads and capacitive coupling circuitry; wherein the set of capacitive coupling pads is coupled to the module by the capacitive coupling circuitry; wherein data transfer between the module communication network and the module is enabled by capacitive coupling between the set of capacitive coupling pads and the modular electronic device.

15. The module interface of claim 14 , wherein the capacitive coupling circuitry comprises switched transmit/receive circuitry; wherein the capacitive coupling circuitry enables both transmission and reception of data for a capacitive coupling pad of the set of capacitive coupling pads.

Assignees

• Google Inc
• Google Llc

Inventors

• Eremenko Paul
• Fishman David Nathaniel
• Newburg Seth
• Knaian Ara N
• Kurtovich Boyan
• Khushrushahi Shahriar
• Amit Gad
• Etgar Inbal
• Clifton Daniel Joseph

Classifications

• H04B5/0012

  Electricity · mapped topic

• H01R13/629

  Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure {electrical locking indicators, manufacturing tolerances (separate tools or apparatus H01R43/26)} · CPC title

• H01R24/60

  Contacts spaced along planar side wall transverse to longitudinal axis of engagement · CPC title

• H01R13/665 Primary

  with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title

• H01R13/6205

  Two-part coupling devices held in engagement by a magnet · CPC title