Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
US9929463B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9929463-B2 |
| Application number | US-201514802684-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 17, 2015 |
| Priority date | Apr 7, 2015 |
| Publication date | Mar 27, 2018 |
| Grant date | Mar 27, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A dual-band antenna disposed on the both sides of a substrate, including: a substrate, a first radiator and a second radiator. The substrate includes a first surface and a second surface; a feeding point is disposed at the edge of the first surface which may have a penetration hole electrically connected the first surface to the second surface. The first radiator extends from the first direction of the feeding point to the edge of the substrate, bend at the first corner, continues to extend toward the edge of the substrate, bends again at the second corner and then extend toward the third corner along the edge of the substrate. The second radiator straightly extends toward the second direction of the feeding point and the second direction's projection on the first surface is vertical to the first direction.
Opening claim text (preview).
What is claimed is: 1. A dual-band antenna disposed on both sides of a substrate, comprising: a substrate, formed with a first surface and a second surface in a manner that there is a feeding point disposed at a first edge of the first surface while the feeding point is further formed with a penetration hole to be used for electrically connecting the first surface to the second surface; a first radiator, arranged extending in a first direction from the feeding point along the first edge of the substrate, and then to be bended at a first corner so as to continue the extension along a second edge of the substrate, and then to be bended again at a second corner where it is further extending toward a third corner along a third edge of the substrate; and a second radiator, arranged on the second surface for allowing the same to extend in a straight line from the feeding point in a second direction while enabling the projection of the second direction on the first surface to be perpendicular to the first direction, i.e. the second radiator is arranged extending from the feeding point to the portion of the first radiator that is disposed neighboring to the third edge, and the projection of the second radiator does not overlap the first radiator. 2. The dual-band antenna of claim 1 , wherein the straight extension of the second radiator is extending over the center of the substrate. 3. The dual-band antenna of claim 1 , wherein the first radiator is further bended again at the third corner for allowing the extension of the first radiator to extend further toward a fourth corner along a fourth edge of the substrate by a length. 4. The dual-band antenna of claim 3 , wherein the length of the portion of the first radiator that is extending toward the fourth corner is not longer than half of edge length of the substrate. 5. The dual-band antenna of claim 1 , wherein the substrate is substantially a printed circuitboard. 6. The dual-band antenna of claim 1 , wherein the feeding point is provided for connecting electrically to a 50 Ω transmission line or a cable. 7. A dual-band antenna disposed on both sides of a substrate, comprising: a substrate, formed with a first surface and a second surface in a manner that there is a feeding point disposed at a first edge of the first surface while the feeding point is further formed with a penetration hole to be used for electrically connecting the first surface to the second surface; a first radiator, disposed on the first surface and arranged extending in a first direction from the feeding point along the first edge of the substrate, and then to be bended at a first corner so as to continue the extension toward a second edge of the substrate, and then to be bended again at a second corner where it is further extending toward a third corner along a third edge of the substrate; a second radiator, arranged on the second surface for allowing the same to extend in a straight line from the feeding point in a second direction while enabling the projection of the second direction on the first surface to be perpendicular to the first direction, i.e. the second radiator is arranged extending from the feeding point to the portion of the first radiator that is disposed neighboring to the third edge, and the projection of the second radiator does not overlap the first radiator; a first matching unit, disposed on the first surface while being arranged extending in a third direction from the feeding point, and then to be bended at a first bend so as to continue the extension in a direction opposite to the first direction toward the fourth edge of the substrate, and then to be bended again at a second bend for enabling the same to extend toward a fourth corner along a fourth edge of the substrate; and a second matching unit, disposed on the first surface while being arranged extending in the third direction from the second bend, and then to be bended at a third bend so as to continue the extension in the first direction, i.e. the extension of the second matching unit in the first direction is the portion of the second matching unit that is extending toward the portion of the first radiator arranged neighboring to the second edge, and the projection of the portion of the second matching unit that is extending along the first direction is disposed intersecting with the second radiator; wherein, the third direction is arranged perpendicular to the first direction. 8. The dual-band antenna of claim 7 , wherein the first matching unit is arranged extending to a ground region formed at an end of the fourth corner, and the ground region is further formed with a through-hole via at the center thereof. 9. The dual-band antenna of claim 8 , wherein the ground region is provided for connecting to a system ground of an electronic device. 10. The dual-band antenna of claim 7 , wherein the substrate is substantially a printed circuitboard. 11. The dual-band antenna of claim 7 , wherein the feeding point is provided for connecting electrically to a 50 Ω transmission line or a cable.
with folded element, the folded parts being spaced apart a small fraction of the operating wavelength · CPC title
formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} · CPC title
Branching current paths · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.