Method for manufacturing light-emitting device

Patent metadata

Field	Value
Publication number	US-9929323-B2
Application number	US-201715480416-A
Country	US
Kind code	B2
Filing date	Apr 6, 2017
Priority date	Apr 6, 2016
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

The method for manufacturing a light-emitting device includes flip-chip mounting a first light-emitting element and a second light-emitting element on a substrate separately from each other, bonding a first light-transmissive member to the first light-emitting element, the first light-transmissive member having a first lateral surface, and bonding a second light-transmissive member to the second light-emitting element, the second light-transmissive member having a second lateral surface, with the second lateral surface being separated from and facing the first lateral surface, scraping at least one of the first lateral surface and the second lateral surface to expose at least one of a modified first lateral surface and a modified second lateral surface, forming a light-reflective covering member on the substrate to cover the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface, and cutting the substrate and the covering member between the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface.

First claim

What is claimed is:

1. A method for manufacturing a light-emitting device, the method comprising in order:
flip-chip mounting a first light-emitting element and a second light-emitting element on a substrate separately from each other;
bonding a first light-transmissive member having a first lateral surface to the first light-emitting element;
bonding a second light-transmissive member having a second lateral surface to the second light-emitting element such that the second lateral surface is separated from and faces to the first lateral surface;
scraping at least one of the first lateral surface and the second lateral surface to expose at least one of a modified first lateral surface and a modified second lateral surface;
providing a light-reflective covering member on the substrate to cover the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface; and
cutting the substrate and the covering member between the first lateral surface or the modified first lateral surface, and the second lateral surface or the modified second lateral surface.

2. The method according to claim 1 ,
wherein a cutting tool having a thickness larger than a gap between the first lateral surface and the second lateral surface on completion of bonding the first light-transmissive member and the second light-transmissive member is used in scraping at least one of the first lateral surface and the second lateral surface.

3. The method according to claim 1 ,
wherein the first light-transmissive member and the second light-transmissive member each comprise:
a matrix; and
a wavelength conversion substance in the matrix, the wavelength conversion substance absorbing primary light from the first light-emitting element and the second light-emitting element to emit secondary light different in wavelengths from the primary light,

wherein the first lateral surface and the second lateral surface each have at least one projection before scraping at least one of the first lateral surface and the second lateral surface, the at least one projection being attributable to existence of the wavelength conversion substance, and
wherein the at least one projection is chipped off in scraping at least one of the first lateral surface and the second lateral surface.

4. The method according to claim 3 ,
wherein the matrix comprises a silicone resin or a modified silicone resin,
wherein the wavelength conversion substance comprises a first fluorescent material, and
wherein the first fluorescent material comprises a SiAlON fluorescent material.

5. The method according to claim 1 ,
wherein the first light-transmissive member and the second light-transmissive member each comprise:
a matrix; and
a wavelength conversion substance in the matrix, the wavelength conversion substance absorbing primary light from the first light-emitting element and the second light-emitting element to emit secondary light different in wavelengths from the primary light,

wherein the wavelength conversion substance comprises a second fluorescent material,
wherein the second fluorescent material comprises a manganese-activated fluoride fluorescent material, and
wherein at least one of the first lateral surface and the second lateral surface is scraped with a dry cutting device in scraping at least one of the first lateral surface and the second lateral surface.

6. The method according to claim 1 ,
wherein shapes in a top view of the first light-emitting element, the second light-emitting element, the first light-transmissive member, and the second light-transmissive member each comprise:
two long lateral surfaces extending in a first direction; and
two short lateral surfaces extending in a second direction perpendicular to the first direction, the short lateral surfaces being shorter than the long lateral surfaces, and

wherein the first lateral surface and the second lateral surface are the long lateral surfaces.

7. The method according to claim 1 ,
wherein a gap between the modified first lateral surface and the modified second lateral surface is equal to or more than 0.05 mm and equal to or less than 0.4 mm.

Assignees

• Nichia Corp

Inventors

• Hashimoto Toru

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/0198

  batch processes · CPC title

• C09K11/617

  Silicates · CPC title

• C09K11/7734

  Aluminates · CPC title

• H01L33/54 Primary

  Electricity · mapped topic