Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Patent metadata

Field	Value
Publication number	US-9929097-B2
Application number	US-201514719764-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	Mar 31, 2008
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.

First claim

What is claimed is:

1. An assembly, comprising:
a die;
an IC package substrate, including:
one or more organic dielectric layers, wherein at least one dielectric layer has a plurality of cavities located at a surface of the dielectric layer, the plurality of cavities having a substantially circular cross-section;
wherein the at least one dielectric layer further includes a distribution of spheres within the dielectric layer that include a resin interior that is less than fully cured, and are less etch resistant than a dielectric material surrounding the spheres; and
a metallization layer coupled to the one or more dielectric layers.

2. The assembly of claim 1 , further comprising a plating layer coupled to the dielectric layer, wherein the plating layer mechanically interfaces with the plurality of cavities located at the surface of the dielectric layer.

3. The assembly of claim 2 , wherein the plating layer includes copper.

4. The assembly of claim 1 , further comprising a via opening, the via opening exposing a portion of the metallization layer.

5. The assembly of claim 1 , further comprising a plating layer coupled to the dielectric layer and the metallization layer wherein the plating layer mechanically interfaces with the plurality of cavities located at the surface of the dielectric layer.

6. The assembly of claim 5 , wherein the plating layer includes copper.

7. The assembly of claim 1 , wherein the cavities comprise a diameter of from about 1 to about 2 micrometers.

8. The assembly of claim 1 , wherein the cavities comprise concentration within the dielectric of from about 3 to about 5 volume percent.

9. The assembly of claim 1 , wherein the metallization layer includes copper.

Assignees

• Nalla Ravi
• Bchir Omar
• Jomaa Houssam
• Intel Corp

Inventors

• Nalla Ravi
• Bchir Omar
• Jomaa Houssam

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W20/425 Primary

  Barrier, adhesion or liner layers · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K3/181

  by electroless plating (adhesives therefor H05K3/387) · CPC title

• H05K1/0298

  Multilayer circuits · CPC title