Coil component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9928953-B2
Application number	US-201514973110-A
Country	US
Kind code	B2
Filing date	Dec 17, 2015
Priority date	Dec 30, 2014
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A coil component may include a core element, a coil conductor embedded in a surface of the core element, and a cover element bonded to the surface of the core element in which the coil conductor is embedded. Since the core element and the cover element are integrally formed, common failures, such as delamination or cracks, may be suppressed, and thereby product reliability may be improved.

First claim

What is claimed is:

1. A coil component, comprising:
a core element;
a coil conductor embedded in the core element; and
a cover element bonded to a surface of the core element in which the coil conductor is embedded,
wherein the coil conductor includes:
an upper double coil structure including a first coil conductor and a second coil conductor alternately disposed in a single layer, the first and second coil conductors each embedded in and contacting an upper surface of the core element,
a lower double coil structure including a third coil conductor and a fourth coil conductor alternately disposed in another single layer, the third and fourth coil conductors each embedded in and contacting a lower surface of the core element, and
vias configured to connect the first coil conductor of the upper double coil structure and the third coil conductor of the lower double coil structure, and to connect the second coil conductor of the upper double coil structure and the fourth coil conductor of the lower double coil structure, and

wherein the first, second, third, and fourth coil conductors each have a trapezoidal cross-section whose width decreases from a surface of the core element contacted by the first, second, third, or fourth coil conductor, respectively, toward a virtual horizontal center line of the coil component.

2. The coil component of claim 1 , wherein the core element and the cover element are formed of a magnetic resin composite.

3. The coil component of claim 1 , wherein a content of magnetic powder included in the core element is the same as a content of magnetic powder included in the cover element.

4. The coil component of claim 1 , wherein the upper double coil structure and the lower double coil structure are symmetrical, based on a virtual horizontal center line of the coil component.

5. The coil component of claim 1 , wherein an entire portion between the upper and lower double coil structures, except the vias, and the cover element are formed of a same magnetic resin composite.

6. The coil component of claim 1 , further comprising first, second, third, and fourth external terminals each electrically connected to an end of a corresponding one of the first, second, third, and fourth coil conductors exposed externally.

7. The coil component of claim 1 , wherein the vias connect the first and third coil conductors, and the second and fourth coil conductors, such that levels of magnetic flux produced by current flow through the coil conductors are reinforced by each other to increase common mode impedance when currents are applied to the first and second coil conductors in the same direction, and levels of magnetic flux are compensated by each other to decrease differential mode impedance when currents are applied to the first and second coil conductors in opposite directions.

8. The coil component of claim 1 , wherein the cover element includes an upper cover element contacting the upper surface of the core element and a lower cover element contacting the lower surface of the core element.

9. The coil component of claim 8 , wherein the upper cover element contacts the upper double coil structure and the lower cover element contacts the lower double coil structure.

10. A coil component, comprising:
a core element;
upper and lower cover elements respectively bonded to opposite upper and lower surfaces of the core element;
upper and lower double coil structures embedded in the core element, the upper double coil structure forming first and second upper coils contacting the upper surface of the cover element and the lower double coil structure forming third and fourth lower coils contacting the lower surface of the cover element, and the upper and lower double coil structures respectively covered by the upper and lower cover elements; and
vias configured to connect the first coil conductor of the upper double coil structure and the third coil conductor of the lower double coil structure, and to connect the second coil conductor of the upper double coil structure and the fourth coil conductor of the lower double coil structure,
wherein the first and second upper coils of the upper double coil structure and the third and fourth lower coils of the lower double coil structure each has a trapezoidal cross-section whose width decreases toward the via connected thereto.

11. The coil component of claim 10 , wherein the core element and the upper and lower cover elements are formed of the same material.

12. The coil component of claim 10 , wherein any non-conductive portion between the upper and lower double coil structures, and the upper and lower cover elements, are formed of a same magnetic resin composite.

13. The coil component of claim 10 , wherein the upper cover element contacts the upper double coil structure and the lower cover element contacts the lower double coil structure.

14. The coil component of claim 10 , wherein the vias connect the first and third coil conductors, and the second and fourth coil conductors, such that levels of magnetic flux produced by current flow through the coil conductors are reinforced by each other to increase common mode impedance when currents are applied to the first and second coil conductors in the same direction, and levels of magnetic flux are compensated by each other to decrease differential mode impedance when currents are applied to the first and second coil conductors in opposite directions.

Assignees

• Samsung Electro Mech

Inventors

• Jeon Hyung Jin
• Seo Jung Wook
• Na Eun Hye

Classifications

• H01F27/292

  Surface mounted devices · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F2027/2809

  on stacked layers · CPC title