Method of decomposing layout of semiconductor device and method of manufacturing semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-9928330-B2
Application number	US-201514737244-A
Country	US
Kind code	B2
Filing date	Jun 11, 2015
Priority date	Sep 4, 2014
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

In a method of decomposing a layout of a semiconductor device, a polygon, which includes a plurality of intersections at each of which at least two lines are crossed, among polygons included in the layout of the semiconductor device may be determined as a complex polygon. A first stitch may be inserted between the plurality of intersections on the complex polygon. A plurality of decomposed patterns may be generated by performing a pattern dividing operation on the layout.

First claim

What is claimed is:

1. A method of decomposing a layout of a semiconductor device, comprising:
determining a polygon is a complex polygon among polygons included in the layout of the semiconductor device, the complex polygon including a plurality of intersection where at least two lines are crossed;
inserting a first stitch between the plurality of intersections on the complex polygon;
inserting a first separator between two polygons that are within a critical dimension from each other, among the polygons included in the layout;
determining if an odd cycle is formed among the polygons in the layout that are connected to the first separator, the odd cycle including an odd number of the polygons;
in response to the odd cycle being formed, inserting a second stitch on one of the odd numbers of the polygons included in the odd cycle; and
generating a plurality of decomposed patterns by performing a pattern dividing operation on the layout.

2. The method of claim 1 , wherein the inserting the first stitch includes inserting the first stitch at a center of two adjacent intersections among the plurality of intersections included in the complex polygon.

3. The method of claim 1 , wherein
the layout includes a plurality of the complex polygons, and
the inserting the first stitch includes inserting the first stitch between the plurality of intersections on at least one of the plurality of the complex polygons.

4. The method of claim 1 , wherein
the generating the plurality of decomposed patterns includes separating the plurality of decomposed patterns into different decomposed patterns from each other based on at least a first part of the complex polygon and a second part of the complex polygon,
the first part of the complex polygon is on one side of the first stitch, and
the second part of the complex polygon that is on an other side of the first stitch.

5. The method of claim 1 , wherein
the generating the plurality of decomposed patterns includes separating the plurality of decomposed patterns into different decomposed patterns from each other based on at least the two polygons, and
the two polygons are located at respective sides of the first separator.

6. The method of claim 1 , further comprising:
inserting a second separator between two polygons that are adjacent to each other by a distance greater than the critical dimension, among the polygons included in the layout.

7. The method of claim 6 , wherein
the generating the plurality of decomposed patterns includes separating the plurality of decomposed patterns into different decomposed patterns from each other based on at least the two polygons, and
the two polygons are located at respective sides of the second separator.

8. The method of claim 6 , wherein
the generating the plurality of decomposed patterns includes assigning a first priority while performing the pattern dividing operation to the second separator in response to the second separator being inserted between a first polygon and a second polygon that is apart from the first polygon more than the critical dimension in a direction corresponding to a minor axis of the first polygon, and
the generating the plurality of decomposed patterns includes assigning a second priority while performing the pattern dividing operation to the second separator in response to the second separator being inserted between the first polygon and a third polygon that is apart from the first polygon more than the critical dimension in a direction corresponding to a major axis of the first polygon,
the second priority is lower than the first priority while performing the pattern dividing operation.

9. The method of claim 1 , wherein the pattern dividing operation is performed using a double pattern dividing algorithm for a double patterning technology (DPT) process.

10. The method of claim 1 , wherein a number of the plurality of decomposed patterns is two.

11. A method of decomposing a layout of a semiconductor device, comprising:
inserting a first separator between two polygons that are within a critical dimension from each other, among polygons included in the layout of the semiconductor device;
inserting a second separator between two polygons that are adjacent to each other by a distance greater than the critical dimension, among the polygons included in the layout; and
generating a plurality of decomposed patterns by performing a pattern dividing operation on the layout.

12. The method of claim 11 , further comprising:
determining a polygon among the polygons included in the layout is a complex polygon, the complex polygon including a plurality of intersections where at least two lines are crossed; and
inserting a first stitch between the plurality of intersections on the complex polygon.

13. A method of manufacturing a semiconductor device, comprising:
performing the method of decomposing a layout of a semiconductor device according to claim 1 ;
generating a plurality of masks corresponding to the plurality of decomposed patterns, respectively; and
forming a wiring pattern on a substrate by performing lithography processes on the substrate using the plurality of masks.

14. A method of decomposing a layout of a semiconductor device, the layout including a plurality of polygons, comprising:
inserting in the layout at least one of,
a first stitch between a plurality of intersections where at least two lines are crossed in at least one complex polygon, in response to the plurality of polygons including the at least one complex polygon, and
a first separator between two polygons that are spaced apart from each other by a distance less than a critical dimension, in response to the plurality of polygons including the two polygons that are spaced apart from each other by the distance less than the critical dimension;

inserting a second separator between two polygons that are spaced apart from each other by a distance greater than the critical dimension in response to the plurality of polygons including the two polygons that are spaced apart from each other by the distance greater than the critical dimension, and
generating a plurality of decomposed patterns by performing a pattern dividing operation on the layout.

15. The method of claim 14 , wherein
the method includes inserting the first stitch between the plurality of intersections where at least two lines are crossed in at least one complex polygon,
the generating the plurality of decomposed patterns includes separating the plurality of decomposed patterns into different decomposed patterns based on at least a position of each first stitch in the at least one complex polygon,
the different decomposed patterns include first decomposed patterns and second decomposed patterns,
the first decomposed patterns are based on at least a first part of the at least one complex polygon that is on one side each first stitch,
the second decomposed patterns are based on at least a second part of the at least one complex polygon that is on an other side of each first stitch, and
the first decomposed patterns are different than the second decomposed patterns.

16. The method of claim 14 , further comprising:
the method includes inserting the first separator between two polygons that are spaced apart from each other by the distance less than the critical dimension,
the generating the plurality of decomposed patterns includes separating the plurality of decomposed patterns into different decomposed patterns from each other based on at least a position of the first separator relative to the two polygons that are spaced apart

Assignees

• Kang Dae Kwon
• Jung Ji Young
• Kim Dong Gyun
• Yang Jae Seok
• Hwang Sung Wook
• Samsung Electronics Co Ltd

Inventors

• Kang Dae-Kwon
• Jung Ji-Young
• Kim Dong-Gyun
• Yang Jae-Seok
• Hwang Sung-Wook

Classifications

• H10P76/2041 Primary

  Photolithographic processes · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10W20/089

  using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning · CPC title

• G06F30/398

  Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM] (optical proximity correction [OPC] design processes G03F1/36) · CPC title

• G06F30/39 Primary

  Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347) · CPC title