Spatial light modulation element module, photolithographing apparatus, exposure apparatus, method of manufacturing spatial light modulation element module and method of manufacturing device

Patent metadata

Field	Value
Publication number	US-9927712-B2
Application number	US-201615155453-A
Country	US
Kind code	B2
Filing date	May 16, 2016
Priority date	Nov 18, 2013
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A spatial light modulation element module having a large area is manufactured. A spatial light modulation element module comprising a base member and a plurality of spatial light modulation element arrays, wherein each of the plurality of spatial light modulation element arrays has a light modulation element which modulates and emits at least one of the intensity and the phase of an incident light, and the base member maintains the plurality of spatial light modulation element arrays in a predetermined relative position in a bare chip state. In the above-described spatial light modulation element module, the plurality of spatial light modulation element arrays may be in a staggered arrangement in at least 1 direction.

First claim

What is claimed is:

1. A spatial light modulation element module comprising:
a plurality of combinations of a base member and a plurality of spatial light modulation element arrays, wherein
each of the plurality of spatial light modulation element arrays has a light modulation element which modulates and emits at least one of an intensity and a phase of an incident light,
the base member maintains the plurality of spatial light modulation element arrays in predetermined relative positions in bare chip states, and
the combinations are arranged with each other such that the plurality of spatial light modulation element arrays are in a staggered arrangement.

2. The spatial light modulation element module according to claim 1 , wherein the plurality of spatial light modulation element arrays are in a staggered arrangement in at least one direction.

3. The spatial light modulation element module according to claim 2 , wherein at least one reflecting element of one spatial light modulation element array and at least one reflecting element of another spatial light modulation element array adjacent to the one spatial light modulation element array are arranged in adjacent positions without a space or in an overlapping position, as viewed from a direction orthogonal to the at least one direction.

4. The spatial light modulation element module according to claim 1 wherein, each of the plurality of spatial light modulation element arrays has a micro-bump electrically connected to the base member on a surface opposite to the base member.

5. The spatial light modulation element module according to claim 1 , further comprising a packaging unit which covers the base member and at least a portion of each of the plurality of spatial light modulation element arrays.

6. The spatial light modulation element module according to claim 5 , wherein
the packaging unit has a mask unit in which an opening is provided in a region in which each of the plurality of spatial light modulation element arrays is arranged, and
the mask unit further has an antireflective structure including an absorber which absorbs an incident light or a reflected light.

7. The spatial light modulation element module according to claim 5 , wherein
the packaging unit has a mask unit in which an opening is provided in a region in which each of the plurality of spatial light modulation element arrays is arranged, and
the mask unit includes any of a mirror, a diffraction grating, and a blazed diffraction optical element and further includes a structure which reflects an incident light toward an optical path which is different from a reflected light from a reflecting element.

8. A photolithographing apparatus to draw a light figure using the spatial light modulation element module according to claim 1 .

9. An exposure apparatus to expose a semiconductor using the photolithographing apparatus according to claim 8 .

10. A method of manufacturing a device including lithography process, wherein exposure is performed using the exposure apparatus according to claim 9 in the lithography process.

Assignees

• Nikon Corp

Inventors

• Suzuki Yoshihiko
• Suzuki Junji

Classifications

• G02B26/06

  for controlling the phase of light (G02B26/08 takes precedence {, measuring optical phase difference G01J9/00}) · CPC title

• G02B5/003

  Light absorbing elements · CPC title

• G03F7/70191 Primary

  Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title