Layered polymer structures and methods

US9927703B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9927703-B2
Application numberUS-201314653478-A
CountryUS
Kind codeB2
Filing dateDec 20, 2013
Priority dateDec 21, 2012
Publication dateMar 27, 2018
Grant dateMar 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optical assembly includes an optical device having an optical surface. The optical assembly further includes an encapsulant that substantially covers the optical surface. The encapsulant has a first layer ( 106 ) and a second layer ( 108 ). The first layer ( 106 ) has a first silicone-containing hot melt composition and a major surface ( 112 ). The second layer ( 108 ) has a second silicone-containing hot melt composition, the second layer ( 108 ) having a second major surface ( 110 ) in contact with the first major surface ( 112 ).

First claim

Opening claim text (preview).

What is claimed is: 1. An optical assembly, comprising: an optical device comprising an optical surface; and a pre-formed encapsulant film that substantially or entirely covers the optical surface, the encapsulant comprising: a first layer comprising a first silicone-containing hot melt composition, the first layer having a first major surface and a second major surface; and a second layer comprising a second silicone-containing hot melt composition, the second layer having a first major surface and a second major surface, the first major surface of the second layer being in contact with the first major surface of the first layer wherein the optical device includes a coherent light source or an incoherent light source. 2. The optical assembly of claim 1 , wherein at least one of the first silicone-containing hot melt composition and the second silicone-containing hot melt composition is a reactive or non-reactive silicone-containing hot melt composition. 3. The optical assembly of claim 1 , wherein at least one of the first silicone containing hot melt composition and the second silicone-containing hot melt composition comprises at least one of a resin-linear composition, a hydrosilylation cure composition, a high-phenyl-T composition, a silicon sealant composition, a polyurea-polysiloxane composition, an MQ/polysiloxane composition, an MQ/X-diorganosiloxane composition, a polyimide-polysiloxane composition, a polycarbonate-polysiloxane composition, a polyurethane-polysiloxane composition, a polyacrylate-polysiloxane composition or a polyisobutylene-polysiloxane composition. 4. The optical assembly of claim 1 , wherein at least one of the first layer and the second layer has a shore A hardness gradient, wherein the shore A hardness gradient is from the first major surface to the second major surface of the first layer or from the first major surface to the second major surface of the second layer. 5. The optical assembly of claim 1 , wherein the thickness of the encapsulant is from about 0.5 μm to about 5000 μm. 6. The optical assembly of claim 1 , wherein at least one of the first and the second layers are cured. 7. The optical assembly of claim 1 , further comprising a tie layer. 8. The optical assembly of claim 7 , wherein the tie layer comprises a resin.

Assignees

Inventors

Classifications

  • Optical elements · CPC title

  • G03F7/0007Primary

    Filters, e.g. additive colour filters; Components for display devices · CPC title

  • containing silicon bound to unsaturated aliphatic groups · CPC title

  • containing silicon bound to hydrogen · CPC title

  • Organic displays, e.g. OLED · CPC title

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Frequently asked questions

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What does patent US9927703B2 cover?
An optical assembly includes an optical device having an optical surface. The optical assembly further includes an encapsulant that substantially covers the optical surface. The encapsulant has a first layer ( 106 ) and a second layer ( 108 ). The first layer ( 106 ) has a first silicone-containing hot melt composition and a major surface ( 112 ). The second layer ( 108 ) has a second silicone-…
Who is the assignee on this patent?
Dow Corning, Dow Corning Toray Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/0007. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).