Optical modules for wavelength multiplexing

Patent metadata

Field	Value
Publication number	US-9927576-B2
Application number	US-201615146989-A
Country	US
Kind code	B2
Filing date	May 5, 2016
Priority date	Nov 29, 2013
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

Embodiments of the present invention provide optical modules which input and output wavelength multiplexed optical signals to and from an optical waveguide, and a manufacturing method thereof. In one embodiment, an optical module comprises light emitting and light receiving element pairs that are positioned on grooves of one or more optical waveguides, where each light emitting and light receiving element pair corresponds to a different wavelength of light. Each light emitting and light receiving element pair includes an optical pin comprising an inclined surface and a light selecting filter that are configured to reflect light of a corresponding wavelength from an optical waveguide to the light receiving element, and from the light emitting element to the optical waveguide.

First claim

What is claimed is:

1. An optical module comprising:
an optical waveguide provided on a surface of a substrate;
a groove provided on the optical waveguide on the surface of the substrate;
an optical pin disposed in the groove of the optical waveguide, the optical pin being configured to allow light exiting from a light emitting element and light entering a light receiving element to pass through, the optical pin being provided with an inclined surface, wherein the inclined surface is inclined to turn, when light from the optical waveguide is reflected on the inclined surface, the reflected light to the light receiving element, and to turn, when light from the light emitting element is reflected, the reflected light to the optical waveguide; and
a light selecting filter provided on the inclined surface of the optical pin, wherein the light selecting filter is configured to reflect light of the corresponding wavelength exiting from the light emitting element, select light of the corresponding wavelength from propagation light propagated through the optical waveguide, and reflect light to the light receiving element.

2. The optical module according to claim 1 , wherein the inclined surface of the optical pin is a surface inclined at 45 degrees to the surface of the substrate.

3. The optical module according to claim 1 , wherein the optical pin is formed of a light transmissive resin.

4. The optical module according to claim 1 , wherein the light selecting filter is a DBR (Distributed Bragg Reflector) filter.

5. The optical module according to claim 1 , wherein light transmissive underfill is filled in the groove of the optical waveguide.

6. A manufacturing method of an optical module comprising:
producing a replica resin die from an original mold, wherein a pattern of an optical pin having an inclined surface is formed;
positioning the replica resin die on a wafer provided with a light emitting and light receiving element pair corresponding to a wavelength of light;
forming an optical pin on the wafer by applying a release agent to the replica resin die, putting a curable light transmissive resin into the replica resin die, and detaching the replica resin die after curing the curable light transmissive resin;
forming a light selecting filter for reflecting light of the corresponding wavelength on the inclined surface of the optical pin formed on the wafer;
dicing the wafer to cut out a chip having the optical pin where the light selecting filter is formed and the light emitting and light receiving element pair;
forming a groove on an optical waveguide provided on a surface of a substrate; and
disposing the optical pin in the groove formed on the optical waveguide.

7. The method according to claim 6 , wherein the inclined surface of the optical pin is a surface inclined at 45 degrees to the surface of the substrate.

8. The method according to claim 6 , wherein the curable light transmissive resin is a photocurable acrylic resin.

9. The method according to claim 6 , wherein forming the light selecting filter for reflecting light of the corresponding wavelength on the inclined surface of the optical pin formed on the wafer comprises:
forming a mask for exposing the inclined surface of the optical pin where the optical pin is formed on the wafer; and
vapor-depositing a DBR (Distributed Bragg Reflector) filter onto the exposed inclined surface of the optical pin.

10. The method according to claim 9 , wherein forming a mask for exposing the inclined surface of the optical pin where the optical pin is formed on the wafer comprises:
attaching resist onto the wafer where the optical pin is formed;
exposing and developing the resist using the mask; and
exposing the inclined surface of the optical pin from the resist.

11. The method according to claim 6 , further comprising:
providing, on the surface of the substrate, the chip.

Assignees

• IBM

Inventors

• Nakagawa Shigeru
• Taira Yoichi
• Tokunari Masao

Classifications

• G02B6/132

  by deposition of thin films · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/2938 Primary

  for multiplexing or demultiplexing, i.e. combining or separating wavelengths, e.g. 1xN, NxM · CPC title

• G02B6/29362

  Serial cascade of filters or filtering operations, e.g. for a large number of channels · CPC title

• G02B6/29328

  Diffractive elements operating in reflection · CPC title