Pressure sensing device

Patent metadata

Field	Value
Publication number	US-9927313-B2
Application number	US-201615011456-A
Country	US
Kind code	B2
Filing date	Jan 29, 2016
Priority date	Jul 9, 2015
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A pressure sensing device is disclosed in the present disclosure. The pressure sensing device includes a bottom plate, a flexible shell and a MEMS pressure sensor. The flexible shell covers the bottom plate for forming a hermetical cavity, and the MEMS pressure sensor is accommodated in the hermetical cavity. Air in the hermetical cavity is compressed when the flexible shell is pressed, the MEMS pressure sensor is configured for detecting variation of an air pressure within the hermetical cavity when the flexible shell is pressed, and convert the variation of the air pressure into an electric signal.

First claim

What is claimed is:

1. A pressure sensing device, comprising:
a bottom plate;
a flexible shell covering the bottom plate and forming a hermetical cavity cooperatively with the bottom plate; and
a MEMS pressure sensor accommodated in the hermetical cavity;
wherein the flexible shell comprises a rigid cover and a flexible frame, the flexible frame locates between the rigid cover and the bottom plate for performing elastic deformation, air in the hermetical cavity is compressed when the flexible shell is pressed, the MEMS pressure sensor is configured for detecting variation of an air pressure within the hermetical cavity when the flexible shell is pressed, and converting the variation of the air pressure into an electric signal.

2. The pressure sensing device of claim 1 , further comprising an ASIC chip electrically connected to the MEMS pressure sensor and accommodated in the hermetical cavity, wherein the ASIC chip is configured for receiving the electric signal from the MEMS pressure sensor and performing signal processing on the electric signal.

3. The pressure sensing device of claim 2 , wherein the bottom plate comprises a rigid substrate and a flexible printed circuit board placed on the rigid substrate, the ASIC chip is electrically connected with the flexible printed circuit board.

4. The pressure sensing device of claim 3 , wherein the flexible printed circuit board comprises a main body disposed in the hermetical cavity, and an extending portion extending from the main body and out of the hermetical cavity.

5. The pressure sensing device of claim 4 , further comprising a plurality of solder pads formed at an end of the extending portion, wherein the solder pads are configured for outputting the electric signal processed by the ASIC chip to the external circuit.

6. The pressure sensing device of claim 4 , wherein the MEMS pressure sensor and the ASIC chip are both disposed on the main body of the flexible printed circuit board.

7. The pressure sensing device of claim 3 , wherein the MEMS pressure sensor and the ASIC chip are respectively disposed on the flexible printed circuit board and the flexible shell.

8. The pressure sensing device of claim 2 , wherein the MEMS pressure sensor and the ASIC chip are both disposed on the flexible shell.

9. The pressure sensing device of claim 2 , wherein the bottom plate is a printed circuit board, the MEMS pressure sensor and the ASIC chip are mounted on the printed circuit board.

10. The pressure sensing device of claim 9 , wherein the printed circuit board comprises a plurality of solder pads; and the ASIC chip is electrically connected with the solder pads via connecting lines of the printed circuit board.

11. The pressure sensing device of claim 2 , wherein the MEMS pressure sensor and the ASIC chip are two separate and independent chips.

12. The pressure sensing device of claim 2 , wherein the MEMS pressure sensor and the ASIC chip are integrated into a one-piece component.

Assignees

• Zhang Jinyu
• Zhang Rui
• Aac Technologies Pte Ltd

Inventors

• Zhang Jinyu
• Zhang Rui

Classifications

• G01L19/0084 Primary

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title

• G01L9/0044

  Constructional details of non-semiconductive diaphragms · CPC title