Multi-chip device with temperature control element for temperature calibration

Patent metadata

Field	Value
Publication number	US-9927266-B2
Application number	US-201213511974-A
Country	US
Kind code	B2
Filing date	Feb 27, 2012
Priority date	Feb 27, 2012
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.

First claim

What is claimed is:

1. A multi-die sensor system comprising:
a package;
one or more transducer dies mounted in the package, each transducer die including a transducer;
a temperature control element, wherein the temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element; and
a temperature sensor configured to sense the temperature of at least the portion of the transducer;

an output circuitry die mounted in the package, the output circuit die coupled to receive transducer signals and a sensed temperature signal from the temperature sensor;
a coefficient storage module configured to provide calibration coefficients to a transfer function module.

2. The system of claim 1 further comprising:
a conversion module configured to receive the transducer signals from the transducer die.

3. The system of claim 1 wherein the temperature control element is configured to receive a control signal to operate the temperature control element.

4. The system of claim 1 further comprising:
a test system coupled to communicate with the package and configured to use data measured at trim points to determine calibration data for the transducer.

5. The system of claim 1 further comprising:
a control module configured to receive the transducer signal and the sensed temperature signal from the transducer die.

6. The system of claim 5 further comprising:
a transfer function module configured to receive signals from the control module and a coefficient storage module.

7. A multi-die sensor system comprising:
a package;
one or more transducer dies mounted in the package, each transducer die including one or more transducers;
a temperature control element, wherein the temperature control element changes the temperature of at least a portion of the transducer die during operation of the temperature control element; and
a temperature sensor configured to sense the temperature of at least the portion of the transducer; and

an output circuitry die mounted in the package, the output circuit die coupled to receive transducer signals and sensed temperature signals from the temperature sensor, wherein the transducer signals include first and second measurable condition signals and the temperature signals include first and second temperature signals, further wherein calibration data generated using the first and second measurable condition signals and the first and second temperature signals are stored on the output circuitry die and are used to correct the signals from the transducer die.

8. The system of claim 7 further comprising:
a conversion module configured to condition the transducer signals from the transducer die.

9. The system of claim 7 further comprising:
a coefficient storage module configured to provide the calibration data to a transfer function module on the output circuitry die.

10. The system of claim 7 wherein the temperature control element is configured to receive a control signal to operate the temperature control element.

11. The system of claim 7 further comprising:
a control module configured to receive the transducer signals and the sensed temperature signals from the transducer die; and
a transfer function module configured to receive signals from the control module and a coefficient storage module.

12. The system of claim 11 wherein:
the temperature control element and the temperature sensor are implemented using one component.

13. A sensor system comprising
a transducer die and an output circuitry die mounted in a package, the transducer die includes a temperature control element and a temperature sensor, and the output circuitry die includes signal processing components;
a temperature control element configured to expose the package to a measurable condition, a first temperature, and a second temperature;
the signal processing components receive data on the measurable condition from the transducer and first and second temperature data from the temperature sensor and generate calibration data for the transducer based on the data collected at the measurable condition and the first and second temperatures.

14. The sensor system of claim 13 wherein:
the calibration data is used to calibrate signals from the transducer.

15. The sensor system of claim 13 further comprising:
a transfer function module on the output circuitry die;
a conversion module configured to condition transducer signals from the transducer die;
and provide the conditioned signals to the transfer function module.

16. The sensor system of claim 13 wherein:
the calibration data is stored in a coefficient storage module on the output circuitry die.

17. The sensor system of claim 13 further comprising:
a control module configured to receive the data at the first and second measurable conditions and the first and second temperatures.

18. The sensor system of claim 17 wherein the control module is configured to send a control signal to operate the temperature control element.

19. The sensor system of claim 17 wherein the output circuitry die is configured to:
send the data at the first and second measurable conditions and the first and second temperatures to a test system coupled to communicate with the package.

Assignees

• Dawson Chad S
• Lance Phillipe
• Lin Yizhen
• Schlarmann Mark E
• Nxp Usa Inc

Inventors

• Dawson Chad S
• Lance Phillipe
• Lin Yizhen
• Schlarmann Mark E

Classifications

• G01D18/00 Primary

  Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00 · CPC title

• G01D3/0365 Primary

  the undesired influence being measured using a separate sensor, which produces an influence related signal · CPC title